摘要:
There is provided a measuring apparatus for measuring a signal-under-test, having a comparator for sequentially comparing voltage values of the signal-under-test with a reference voltage value fed thereto at timing of strobe signals sequentially fed thereto, a strobe timing generator for sequentially generating the strobe signals placed almost at equal time intervals, a capture memory for storing the comparison result of the comparator and a digital signal processing section for calculating jitter of the signal-under-test based on the comparison result stored in the capture memory.
摘要:
There is provided a measuring apparatus for measuring a signal-under-test, having a comparator for sequentially comparing voltage values of the signal-under-test with a reference voltage value fed thereto at timing of strobe signals sequentially fed thereto, a strobe timing generator for sequentially generating the strobe signals placed almost at equal time intervals, a capture memory for storing the comparison result of the comparator and a digital signal processing section for calculating jitter of the signal-under-test based on the comparison result stored in the capture memory.
摘要:
There is provided a test apparatus for testing a device under test, including a signal supply section that supplies a test signal to the device under test via a transmission line, and a comparing and judging section that receives a response signal from the device under test via the transmission line shared with the signal supply section, and judges whether the device under test is acceptable by referring to a comparison result obtained by comparing a signal level of the response signal with a reference level corresponding to a logic pattern of the test signal.
摘要:
A semiconductor device includes a memory section formed at a semiconductor substrate and including a first transistor having an ONO film that can store charges between the semiconductor substrate and a memory electrode and a first STI region for isolating the first transistor, and a CMOS section formed at the semiconductor substrate and including a second transistor having a CMOS electrode and a gate dielectric and a second STI region for isolating the second transistor. The height of the top surface of the first STI region is set equal to or smaller than the height of the top surface of the second STI region.
摘要:
A semiconductor device includes a memory section formed at a semiconductor substrate and including a first transistor having an ONO film that can store charges between the semiconductor substrate and a memory electrode and a first STI region for isolating the first transistor, and a CMOS section formed at the semiconductor substrate and including a second transistor having a CMOS electrode and a gate dielectric and a second STI region for isolating the second transistor. The height of the top surface of the first STI region is set equal to or smaller than the height of the top surface of the second STI region.
摘要:
A driver circuit having a temperature correction circuit for producing an output signal with high precision amplitude and timing by correcting the temperature changes in the amplitude and timing. The temperature correction circuit includes a temperature detector for detecting the temperature change in output elements, a timing adjustment circuit for correcting the timing of an output signal relative to an input signal upon receiving the temperature detection signal from the temperature detector, and a bias circuit for correcting the output amplitude and impedance of the output signal.
摘要:
A driver circuit having a temperature correction circuit for providing a relatively stable output amplitude and timing by detecting electric consumption of an output stage of the driver circuit and correcting the changes in the amplitude and timing of an output signal therefrom. The temperature correction circuit includes a temperature detection part for detecting temperature change in a pair of output elements, an output timing temperature correction part for correcting the output timing of the output signal relative to an input signal upon receiving the temperature detection signal from the temperature detection part, and an output amplitude and impedance temperature correction part for correcting output amplitudes and output impedance of the output signal.
摘要:
Provided is a test apparatus that tests a device under test, comprising a plurality of test modules that test the device under test; a synchronization module that is connected to each of the plurality of test modules, and that synchronizes the plurality of test modules; and a test control section that is connected to the plurality of test modules and the synchronization module, and that controls the test modules and the synchronization module. The synchronization module includes a receiving section that receives, from each of the plurality of test modules, a state signal indicating a state of the test module; an aggregating section that generates an aggregate state signal by calculating an aggregate of the state signals received by the receiving section; and a transmitting section that transmits, to the plurality of test modules, a control signal ordering an operation corresponding to the aggregate state signal.
摘要:
A test apparatus includes: test modules that communicate with the device under test to test the device under test; additional modules connected between the device under test and the test modules, each additional module performing a communication with the device under test, the communication being at least one of a communication performed at a higher speed and a communication performed with a lower latency, in comparison with a communication performed by the test modules; a test head having a plurality of connectors that connect the test modules and the additional modules, respectively, the test modules and the additional modules are mounted on the test head; a performance board placed on the test head that connects between at least a part of terminals of the plurality of connectors and the device under test. The test modules are connected to the additional modules without through the performance board.
摘要:
A test apparatus includes: test modules that communicate with the device under test to test the device under test; additional modules connected between the device under test and the test modules, each additional module performing a communication with the device under test; the communication being at least one of a communication performed at a higher speed and a communication performed with a lower latency, in comparison with a communication performed by the test modules; a test head having a plurality of connectors that connect the test modules and the additional modules, respectively, the test modules and the additional modules are mounted on the test head; a performance board placed on the test head that connects between at least a part of terminals of the plurality of connectors and the device under test. The test modules are connected to the additional modules without through the performance board.