摘要:
A driving circuit for providing a predetermined voltage as a driving signal to a respective word line in a dynamic random access memory in a short time. The driving circuit includes an operation signal supply circuit portion for providing an operation signal, a driving signal output circuit portion which receives the operation signal and provides a driving signal as an output, and a voltage supply circuit portion for providing a predetermined voltage to the driving signal output circuit portion in producing the driving signal. A bipolar switching element is provided in the driving signal output circuit portion to control the voltage supply from the voltage supply circuit portion and responds to the operation signal to provide the voltage from the voltage supply circuit portion as the voltage producing the driving signal in a short time.
摘要:
This invention relates to a semiconductor integrated circuit device which has an insulated-gate type element part comprising a capacitor which is formed through the use of a trench in a semiconductor layer, wherein a low-resistance buried layer is formed in the semiconductor layer prior to forming the trench so that the trench is formed to be surrounded by the low-resistance buried layer and thereby the low-resistance buried layer is used as an electrode of the capacitor.
摘要:
A word line driving circuit which effectively prevents ground noise during word line discharge along with accommodating the narrowing of pitch in the word lines by making the layout area of the word line driver small. The word line driving circuit includes n-type MOS transistor 14 and p-type MOS transistor 12. The drain terminal of n-type MOS transistor 14 and drain terminal of p-type MOS transistor 12 in word line driver 10 are connected to the base terminal of word line WLi. The output terminal of an output transistor driving circuit 16 is connected to the source terminal of p-type MOS transistor 12, and the output terminal of a first output transistor controlling circuit 18 is connected to the gate terminal. The output terminal of a second output transistor controlling circuit 20 is connected to the gate terminal of n-type MOS transistor 14, and a ground terminal 22 as a reference potential terminal for leading in the electric current is connected to the source terminal.
摘要:
Disclosed herein is a solid state imaging device including a support substrate; an imaging semiconductor chip having a pixel array disposed on the support substrate; and an image processing semiconductor chip disposed on the support substrate, wherein the imaging semiconductor chip and the image processing semiconductor chip are connected by through-vias, and interconnects formed on the support substrate.
摘要:
A plurality of sub word lines each have a length equivalent to the division of a main word line along the extension direction thereof, arranged along a bit line crossing said main word line, and are connected with a plurality of memory cells. A first sub word select line arranged in parallel to the main word line is extended to a plurality of sub arrays arranged in the extension direction of the word line. A second sub word select line is connected to the corresponding one of said first sub word select line to be extended orthogonally to a word line driving circuit area of an adjacent sub array. In the sub word line driving circuit provided for each sub array, a sub word line is selected and deselected by signals supplied from said main word line and said second sub word select line.
摘要:
A semiconductor device includes a first plate member having a circuit surface on which a circuit is provided, a second plate member having a circuit surface on which a circuit is provided, a plurality of first flat plates disposed on the circuit surface of the first plate member, a first communicating section disposed on the circuit surface of the first plate member, a plurality of second flat plates disposed on the circuit surface of the second plate member, and a second communicating section disposed on the circuit surface of the second plate member. The first plate member and the second plate member are arranged so that a surface of the first plate member opposite to the circuit surface faces a surface of the second plate member opposite to the circuit surface.
摘要:
A communication semiconductor chip performs wireless communication with another communication semiconductor chip. The semiconductor chip includes a communication module and a control unit. The communication module performs the wireless communication with another communication semiconductor chip and has a receiving circuit for receiving data. The control unit supplies a reference voltage to the receiving circuit and performs a calibration operation on the reference voltage.
摘要:
A semiconductor memory device for realizing high speed writing while maintaining the credibility of write data, wherein a write gate is provided between a bit line and an input/output data line of a memory cell array, the write gate becomes open when a selected word line becomes an activation state and a write signal set to the input/output data line in accordance with write data is applied to the selected bit line via the write gate when writing, so that writing of data to a selected memory cell can be performed immediately after activating the selected word line when writing, and writing to the selected memory cell can be performed in parallel with reading and refreshing of non-selected memory cells, and consequently, a time for storing charges to the selected memory cell can be sufficiently secured and writing at a high speed can be realized.
摘要:
To reduce both the noise level according to separation or short-circuitng of the electrical supply line of the sense amplifiers and the electrical supply line of the word line driving circuit and to effectively prevent destruction of the stored data in the nonselecteded memory cell. Electrical supply line (Vssw) of the power supply voltage with respect to word line driving circuit (SWD) and electrical supply line (Vssa) of power supply voltage with respect to sense amplifier driving circuit (SAD) are arranged separately in memory array area 2 (e.g., in the space in the row direction of memory array (SMAx,y)) and connected to shared electrical supply wiring (Vsso) within peripheral circuit area 3.
摘要:
A semiconductor memory device has an address buffer (200, 230). A pre-decoder circuit (202, 232) receives the output of the address buffer (200, 230), and a memory array (212) receives the output of the pre-decoder circuit. A main amplifier (216, 248) in turn receives the output of the memory array (212, 244). An address transition detector (ATD) pulse generator circuit (204, 234) also receives the output of the address buffer (200, 230), and a pulse delay circuit (208, 240) receives the output of the address transition detector pulse generator circuit (204, 234). The pulse delay circuit (208, 240) also provides a main amplifier signal to the main amplifier (216, 248). The memory device further includes a voltage generator (206, 236) that generates a back gate voltage which is provided as a low voltage supply (V.sub.BB) for the address transition detector (ATD) pulse generator circuit (204, 234) and the pulse delay circuit (208, 240). The address transition detector (ATD) pulse generator (204, 234) and the pulse delay circuit (208, 240) have a delay that is controlled by the back gate voltage (V.sub.BB) and has a reduced dependency on a high voltage supply (V.sub.DD) of the memory device.