公开(公告)号：US4576735A

公开(公告)日：1986-03-18

申请号：US660089

申请日：1984-10-12

申请人： Takashi Kuroki ,  Tsuyoshi Fujita ,  Gyozo Toda ,  Shousaku Ishihara ,  Yoshiyuki Ohzawa

发明人： Takashi Kuroki ,  Tsuyoshi Fujita ,  Gyozo Toda ,  Shousaku Ishihara ,  Yoshiyuki Ohzawa

IPC分类号： C04B41/51 ,  C04B41/88 ,  H01B1/22 ,  H05K1/09 ,  H05K3/40 ,  H01B1/02

CPC分类号： C04B41/009 ,  C04B41/5138 ,  C04B41/88 ,  H01B1/22 ,  H05K1/092 ,  H05K3/4061

摘要： An electroconductive molybdenum paste comprising 100 parts by weight of a mixture consisting of 68.0 to 89.2% by weight of molybdenum powders having an average particle size of 0.5 to 10 .mu.m, 10.0 to 27.0% by weight of a solvent, and 0.8 to 5.0% by weight of a binder, 0.5 to 5.0 parts by weight of a gelling agent, and 0.5 to 4.0 parts by weight of a silane coupling agent can firmly fill throughholes of a green sheet without formation of clearances and hollows in the resulting conductors in the throughholes, with better surface roughness of the conductor surfaces in the throughholes, and without development of cracks near the throughholes.

摘要翻译： 一种导电性钼膏，其包含100重量份的由68.0至89.2重量％的平均粒径为0.5至10微米的钼粉末，10.0至27.0重量％的溶剂和0.8至5.0重量％ 的粘合剂，0.5-5.0重量份的胶凝剂和0.5-4.0重量份的硅烷偶联剂可以牢固地填充生片的通孔，而不会在通孔中产生的导体中形成间隙和中空部分 ，通孔中导体表面的表面粗糙度更好，并且不会在通孔附近发展裂纹。

公开(公告)号：US4624896A

公开(公告)日：1986-11-25

申请号：US627889

申请日：1984-07-05

申请人： Yutaka Watanabe ,  Fumiyuki Kobayashi ,  Satoru Ogihara ,  Yoshiyuki Ohzawa

发明人： Yutaka Watanabe ,  Fumiyuki Kobayashi ,  Satoru Ogihara ,  Yoshiyuki Ohzawa

IPC分类号： B32B15/04 ,  H01L21/48 ,  H01L23/15 ,  H01L23/538 ,  H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  B32B3/10

CPC分类号： H01L21/4807 ,  H01L23/15 ,  H01L23/5383 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15312 ,  H05K1/0306 ,  H05K3/4676 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： The multi-layer ceramic substrate of this invention includes conductor layers and insulating layers disposed between the conductor layers. The insulating layers include the layers of a sintered body principally composed of mullite and the layers of a sintered body principally composed of alumina. This multi-layer ceramic substrate is produced by laminating the green sheets and sintering the laminate. The green sheets principally composed of mullite and the green sheet principally composed of alumina are prepared, and they are laminated and sintered.

摘要翻译： 本发明的多层陶瓷基板包括布置在导体层之间的导体层和绝缘层。 绝缘层包括主要由莫来石组成的烧结体层和主要由氧化铝构成的烧结体层。 该多层陶瓷基板通过层叠生片并烧结层压体而制造。 制备主要由莫来石组成的生片和主要由氧化铝构成的生片，并将它们层压并烧结。

公开(公告)号：US4580713A

公开(公告)日：1986-04-08

申请号：US535055

申请日：1983-09-23

申请人： Masao Sekibata ,  Kanji Otsuka ,  Yoshiyuki Ohzawa

发明人： Masao Sekibata ,  Kanji Otsuka ,  Yoshiyuki Ohzawa

IPC分类号： H05K3/32 ,  H01L21/60 ,  H01L21/607 ,  H01R4/62 ,  H01R43/02 ,  B23K20/10

CPC分类号： H01R43/0207 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45644 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/4823 ,  H01L2224/48455 ,  H01L2224/48472 ,  H01L2224/48686 ,  H01L2224/48699 ,  H01L2224/4911 ,  H01L2224/4917 ,  H01L2224/78313 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/00011 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/19107 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01R4/625

摘要： A method for bonding an aluminum wire to a minute pad of an electronic circuit by an ultrasonic bonding technique. An anodized aluminum wire having its surface subjected to insulating coating is used. The bonding is effected such that this anodized aluminum wire is pressed against the pad by means of a wedge and, while a load is being thereby applied to the wire, ultrasonic vibrations are caused in the wedge. The alumite is exfoliated from the base material by application of the load and ultrasonic energy to the wire, and this base material and pad are bonded together at this exfoliated portion.

摘要翻译： 一种通过超声波接合技术将铝线结合到电子电路的微小焊盘的方法。 使用其表面经过绝缘涂层的阳极氧化铝线。 实现接合，使得该阳极氧化铝线通过楔形物压靠在焊盘上，并且当负载由此施加到电线时，在楔形件中引起超声波振动。 通过将负载和超声波能量施加到导线上，将耐酸铝从基材剥离，并且该基材和垫在该剥离部分处结合在一起。

公开(公告)号：US4497677A

公开(公告)日：1985-02-05

申请号：US463855

申请日：1983-02-04

申请人： Sakae Sanada ,  Yoshiyuki Ohzawa

发明人： Sakae Sanada ,  Yoshiyuki Ohzawa

IPC分类号： H05K3/12 ,  B28B1/30 ,  C04B41/51 ,  C04B41/88 ,  H01L21/48 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  B32B31/14 ,  C04B39/12

CPC分类号： C04B41/009 ,  C04B41/51 ,  C04B41/88 ,  H01L21/4857 ,  H05K1/0306 ,  H05K3/0011 ,  H05K3/4629

摘要： A method for manufacturing a ceramic substrate, featured by pressing of the green sheet to reduce its dimensional change with time is provided. After this dimensional stabilization treatment, a conductor is printed on the surface of the green sheet and then the conductor-printed green sheet is sintered.

摘要翻译： 提供一种制造陶瓷基板的方法，其特征在于通过按压生片以减小其尺寸变化随时间变化。 在该尺寸稳定化处理之后，将导体印刷在生片的表面上，然后将导体印刷的生片烧结。