公开(公告)号：US08802554B2

公开(公告)日：2014-08-12

申请号：US13372315

申请日：2012-02-13

申请人： Sehat Sutardja

发明人： Sehat Sutardja

IPC分类号： H01L21/44 ,  H01L23/485

CPC分类号： H01L23/485 ,  H01L24/05 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/0213 ,  H01L2224/0217 ,  H01L2224/04042 ,  H01L2224/05011 ,  H01L2224/05186 ,  H01L2224/05551 ,  H01L2224/05564 ,  H01L2224/05573 ,  H01L2224/05576 ,  H01L2224/05578 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05686 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48686 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48886 ,  H01L2224/85035 ,  H01L2224/85365 ,  H01L2924/00014 ,  H01L2924/01327 ,  H01L2924/05442 ,  H01L2924/05042 ,  H01L2924/01029 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2224/05552

摘要： A method includes forming a pad on an electronic component. The pad comprises conductive material. The method further includes providing passivation material on a surface of the conductive material and removing passivation material from the surface to expose portions of the conductive material to form a bond pad comprising conductive material and passivation material.

摘要翻译： 一种方法包括在电子部件上形成垫。 垫包括导电材料。 该方法还包括在导电材料的表面上提供钝化材料并从表面去除钝化材料以暴露导电材料的部分以形成包含导电材料和钝化材料的接合焊盘。

公开(公告)号：US20120205812A1

公开(公告)日：2012-08-16

申请号：US13372315

申请日：2012-02-13

申请人： Sehat Sutardja

发明人： Sehat Sutardja

IPC分类号： H01L23/485 ,  H01L21/28

CPC分类号： H01L23/485 ,  H01L24/05 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/0213 ,  H01L2224/0217 ,  H01L2224/04042 ,  H01L2224/05011 ,  H01L2224/05186 ,  H01L2224/05551 ,  H01L2224/05564 ,  H01L2224/05573 ,  H01L2224/05576 ,  H01L2224/05578 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05686 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48686 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48886 ,  H01L2224/85035 ,  H01L2224/85365 ,  H01L2924/00014 ,  H01L2924/01327 ,  H01L2924/05442 ,  H01L2924/05042 ,  H01L2924/01029 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2224/05552

摘要： A method includes forming a pad on an electronic component. The pad comprises conductive material. The method further includes providing passivation material on a surface of the conductive material and removing passivation material from the surface to expose portions of the conductive material to form a bond pad comprising conductive material and passivation material.

摘要翻译： 一种方法包括在电子部件上形成垫。 垫包括导电材料。 该方法还包括在导电材料的表面上提供钝化材料并从表面去除钝化材料以暴露导电材料的部分以形成包含导电材料和钝化材料的接合焊盘。

公开(公告)号：US4580713A

公开(公告)日：1986-04-08

申请号：US535055

申请日：1983-09-23

申请人： Masao Sekibata ,  Kanji Otsuka ,  Yoshiyuki Ohzawa

发明人： Masao Sekibata ,  Kanji Otsuka ,  Yoshiyuki Ohzawa

IPC分类号： H05K3/32 ,  H01L21/60 ,  H01L21/607 ,  H01R4/62 ,  H01R43/02 ,  B23K20/10

CPC分类号： H01R43/0207 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45644 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/4823 ,  H01L2224/48455 ,  H01L2224/48472 ,  H01L2224/48686 ,  H01L2224/48699 ,  H01L2224/4911 ,  H01L2224/4917 ,  H01L2224/78313 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/00011 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/19107 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01R4/625

摘要： A method for bonding an aluminum wire to a minute pad of an electronic circuit by an ultrasonic bonding technique. An anodized aluminum wire having its surface subjected to insulating coating is used. The bonding is effected such that this anodized aluminum wire is pressed against the pad by means of a wedge and, while a load is being thereby applied to the wire, ultrasonic vibrations are caused in the wedge. The alumite is exfoliated from the base material by application of the load and ultrasonic energy to the wire, and this base material and pad are bonded together at this exfoliated portion.

摘要翻译： 一种通过超声波接合技术将铝线结合到电子电路的微小焊盘的方法。 使用其表面经过绝缘涂层的阳极氧化铝线。 实现接合，使得该阳极氧化铝线通过楔形物压靠在焊盘上，并且当负载由此施加到电线时，在楔形件中引起超声波振动。 通过将负载和超声波能量施加到导线上，将耐酸铝从基材剥离，并且该基材和垫在该剥离部分处结合在一起。