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公开(公告)号：US20090088496A1
公开(公告)日：2009-04-02
申请号：US12210273
申请日：2008-09-15
IPC分类号： C08J3/22
CPC分类号： C08C1/04 , B29B7/7495 , B60C1/0016 , B60C1/0025 , C08J3/226 , C08J2407/00 , C08K3/04
摘要： A rubber-filler composite exhibiting low heat build-up, fatigue resistance and heat aging resistance equal to those of a concentrated natural rubber latex, despite using a field latex of a natural rubber and omitting a concentration step is disclosed. The rubber-filler composite is obtained by jetting a field latex of a natural rubber in a form of a high-speed flow having a flow rate of 500 m/sec or more into a mixing chamber while supplying a filler slurry containing a filler to the mixing chamber, thereby separating and removing protein in the field latex from a rubber component and at the same time, mixing the field latex and the filler slurry.
摘要翻译： 公开了尽管使用天然橡胶的现场胶乳并省略了浓缩步骤，但是具有低的发热性，耐疲劳性和耐老化性等于浓缩天然橡胶胶乳的橡胶填料复合材料。 通过将具有500m / sec以上流速的高速流动的天然橡胶的现场胶乳喷射到混合室中，同时将含有填料的填料浆料供给到 混合室，从而将现场胶乳中的蛋白质从橡胶组分中分离除去，同时混合野外胶乳和填料浆料。
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公开(公告)号：US20090151839A1
公开(公告)日：2009-06-18
申请号：US12266140
申请日：2008-11-06
CPC分类号： C08K3/38 , Y10T428/31696 , C08L21/00
摘要： A rubber composition for adhering a steel cord that improves wet heat-resistant adhesioness, particularly heat-resistant adhesioness, by preventing adhesion deterioration due to heat, as well as initial adhesioness between a steel cord and a rubber, is disclosed. The rubber composition comprising 100 parts by weight of a diene rubber component and from 0.1 to 30 parts by weight of composite graphite particles containing boron, obtained by heating and graphitizing carbon black together with boron or a compound containing boron.
摘要翻译： 公开了一种用于通过防止由于热引起的粘附劣化以及钢帘线和橡胶之间的初始粘附性而提高耐湿热粘合性，特别是耐热粘合性的钢丝帘线的橡胶组合物。 该橡胶组合物包含100重量份的二烯橡胶组分和0.1至30重量份的含有硼的复合石墨颗粒，其通过将硼与硼或含硼化合物一起加热和石墨化而获得。
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公开(公告)号：US20090036596A1
公开(公告)日：2009-02-05
申请号：US12178765
申请日：2008-07-24
IPC分类号： C08L7/00
CPC分类号： C08J3/215 , C08J2307/02 , C08J2321/00 , C08K3/04 , C08L7/00
摘要： In a rubber-filler composite, the filler is uniformly finely dispersed, thereby improving low heat build-up, fatigue resistance and processability of a rubber composition. The rubber-filler composite is obtained by irradiating a filler slurry containing a filler such as carbon black or silica with high amplitude ultrasonic waves having amplitude of 80 μm or more to finely disperse the filler in the slurry, and mixing the dispersion-treated filler slurry with a concentrated natural rubber latex while conducting irradiation with high amplitude ultrasonic waves having amplitude of 80 μm or more, followed by coagulating and drying.
摘要翻译： 在橡胶填料复合材料中，填料均匀地细分散，从而提高橡胶组合物的低发热性，耐疲劳性和加工性。 通过用振幅为80μm以上的高振幅超声波照射含有炭黑或二氧化硅等填料的填料浆，将填料细分散在浆料中，将分散处理后的填料浆料 用浓缩的天然橡胶胶乳进行辐照，同时以幅度为80μm以上的高振幅超声波进行照射，然后进行凝固和干燥。
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公开(公告)号：US20090030105A1
公开(公告)日：2009-01-29
申请号：US12177344
申请日：2008-07-22
IPC分类号： C08L9/10
CPC分类号： C08K3/04 , C08J3/215 , C08J2307/02 , C08J2309/10 , C08K3/013 , C08L7/02 , C08L21/02
摘要： In a rubber-filler composite, the filler is uniformly finely dispersed, thereby improving low heat build-up, fatigue resistance and processability of a rubber composition. The rubber-filler composite is obtained by irradiating a filler slurry containing a filler such as carbon black or silica with high amplitude ultrasonic waves having amplitude of 80 μm or more to finely disperse the filler in the slurry, and mixing the dispersion-treated filler slurry with a rubber latex such as a natural rubber latex while conducting irradiation with high amplitude ultrasonic waves having amplitude of 80 μm or more, followed by coagulating and drying.
摘要翻译： 在橡胶填料复合材料中，填料均匀地细分散，从而提高橡胶组合物的低发热性，耐疲劳性和加工性。 通过用振幅为80μm以上的高振幅超声波照射含有炭黑或二氧化硅等填料的填料浆，将填料细分散在浆料中，将分散处理后的填料浆料 与天然橡胶胶乳等橡胶胶乳同时进行具有80μm以上振幅的高振幅超声波的照射，然后进行凝固和干燥。
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公开(公告)号：US20090043014A1
公开(公告)日：2009-02-12
申请号：US12184397
申请日：2008-08-01
申请人： Hiroaki Narita , Ikuo Ihara , Takashi Miyasaka , Hirofumi Hayashi
发明人： Hiroaki Narita , Ikuo Ihara , Takashi Miyasaka , Hirofumi Hayashi
IPC分类号： C08J3/22
CPC分类号： B60C1/0025 , B60C1/00 , B60C1/0016 , C08K5/378 , C08L21/00
摘要： A rubber composition for tire, which combines low heat build-up properties and breakage property in high level, reduces fuel consumption of a tire, and has excellent durability and good processability is provided. The rubber composition for tire is obtained by kneading a diene rubber component, sulfur and a pyrithione metal salt to obtain a rubber mixture, and adding and kneading a vulcanization accelerator in a post-mixing step using the rubber mixture. The pyrithione metal salt can use a compound represented by the following formula (1): wherein n is 1 or 2, and M represents Zn, Cu, Na or Ca.
摘要翻译： 一种结合低发热性和高水平断裂性的轮胎用橡胶组合物，降低轮胎的燃料消耗，并且具有优异的耐久性和良好的加工性。 轮胎用橡胶组合物通过将二烯橡胶成分，硫和吡啶二酮金属盐进行捏合而获得橡胶混合物，并使用橡胶混合物在后混合工序中添加和捏合硫化促进剂。 吡啶硫酮金属盐可以使用由下式（1）表示的化合物：其中n为1或2，M表示Zn，Cu，Na或Ca。
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公开(公告)号：US20090062455A1
公开(公告)日：2009-03-05
申请号：US12192204
申请日：2008-08-15
申请人： Hiroaki Narita , Ikuo Ihara , Takashi Miyasaka , Hirofumi Hayashi
发明人： Hiroaki Narita , Ikuo Ihara , Takashi Miyasaka , Hirofumi Hayashi
IPC分类号： C08L9/00
CPC分类号： C08J3/20 , B60C1/00 , C08J2321/00 , C08K5/378 , C08L21/00
摘要： A rubber composition for tire, which combines low heat build-up properties and breakage property, reduces fuel consumption of a tire, and has excellent good processability is provided. The rubber composition for tire is obtained by blending sulfur and caprolactam disulfide with a diene rubber component to obtain a pre-mixture which does not contain a reinforcing filler and a vulcanization accelerator, and blending and mixing a reinforcing filler and a vulcanization accelerator with the pre-mixture in a post-mixing step.
摘要翻译： 一种结合了低发热性和断裂性的轮胎用橡胶组合物，降低了轮胎的燃料消耗，并且具有优异的加工性。 用于轮胎的橡胶组合物是通过将硫和己内酰胺二硫化物与二烯橡胶组分混合而获得的，以获得不含增强填料和硫化促进剂的预混合物，并将增强填料和硫化促进剂与前预混合 混合后混合。
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公开(公告)号：US06761175B2
公开(公告)日：2004-07-13
申请号：US10000159
申请日：2001-12-04
申请人： Yukio Nakanishi , Akinori Ota , Katsuhiko Kan , Naohiko Shimono , Kiyotaka Kawai , Yoshisato Miyakoshi , Hiroaki Narita , Toshiki Iijima , Kouichi Hagiwara
发明人： Yukio Nakanishi , Akinori Ota , Katsuhiko Kan , Naohiko Shimono , Kiyotaka Kawai , Yoshisato Miyakoshi , Hiroaki Narita , Toshiki Iijima , Kouichi Hagiwara
IPC分类号： A24B1512
摘要： Sheet tobacco according to the present invention includes a carrier sheet made of nonwoven plant fibers, and a tobacco powder layer formed on the carrier sheet and containing a powder mixture of tobacco lamina powder and binder powder. In a sheet tobacco manufacturing process according to the present invention, a carrier sheet of plant fibers is formed by a nonwoven fabric production process, a tobacco powder layer is formed by spreading the powder mixture on the carrier sheet, and a cover sheet of plant fibers is optionally formed on the tobacco powder layer. Subsequently, the carrier sheet, the tobacco powder layer and the optical cover sheet are all together subjected to heating and pressing, thereby producing sheet tobacco with a two- or three-layer structure. The present invention also provides a manufacturing system for carrying out the sheet tobacco manufacturing process.
摘要翻译： 根据本发明的烟草片包括由非织造植物纤维制成的载体片和形成在载体片上并含有烟草薄片粉末和粘合剂粉末的粉末混合物的烟草粉末层。 在本发明的片状烟草制造方法中，通过非织造布生产方法形成植物纤维的载体片，通过将粉末混合物铺展在载体片上形成烟草粉末层，并且将植物纤维的覆盖片 任选地形成在烟草粉末层上。 随后，将载体片，烟草粉末层和光学覆盖片都一起进行加热和加压，由此生产具有两层或三层结构的片状烟草。 本发明还提供一种用于进行烟草卷烟制造过程的制造系统。
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公开(公告)号：US08853865B2
公开(公告)日：2014-10-07
申请号：US12856664
申请日：2010-08-15
申请人： Hiroaki Narita
发明人： Hiroaki Narita
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/00 , H01L23/495 , H01L21/48 , H01L21/683 , H01L23/31 , H01L21/56 , H05K3/34
CPC分类号： H01L23/4951 , H01L21/4821 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/3107 , H01L23/49548 , H01L23/49582 , H01L23/49805 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/97 , H01L2224/0401 , H01L2224/04042 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/16245 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2224/78301 , H01L2224/81001 , H01L2224/81801 , H01L2224/85051 , H01L2224/85986 , H01L2224/97 , H01L2924/00014 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H05K3/3442 , H01L2224/81 , H01L2224/85186 , H01L2924/00 , H01L2224/48227 , H01L2924/00012 , H01L2224/4554
摘要： The size and thickness of a semiconductor device are reduced. A semiconductor package with a flip chip bonding structure includes: a semiconductor chip having a main surface with multiple electrode pads formed therein and a back surface located on the opposite side thereto; four lead terminals each having an upper surface with the semiconductor chip placed thereover and a lower surface located on the opposite side thereto; and a sealing body having a main surface and a back surface located on the opposite side thereto. In this semiconductor package, the distance between adjacent first lower surfaces of the four lead terminals exposed in the back surface of the sealing body is made longer than the distance between adjacent upper surfaces thereof. This makes it possible to suppress the production of a solder bridge when the semiconductor package is solder mounted to a mounting board and to reduce the size and thickness of the semiconductor package and further enhance the reliability of the semiconductor package.
摘要翻译： 半导体器件的尺寸和厚度减小。 具有倒装芯片接合结构的半导体封装包括：具有形成在其中的多个电极焊盘的主表面和位于其相对侧的后表面的半导体芯片; 四个引线端子各自具有其上放置有半导体芯片的上表面和位于其相对侧上的下表面; 以及密封体，其具有位于其相对侧上的主表面和后表面。 在该半导体封装中，在密封体的后表面露出的四个引线端子的相邻第一下表面之间的距离比其相邻的上表面之间的距离长。 这使得当半导体封装被焊接到安装板上时可以抑制焊接桥的制造，并且可以减小半导体封装的尺寸和厚度，进一步提高半导体封装的可靠性。
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9.发明申请公开(公告)号：US20110215748A1
公开(公告)日：2011-09-08
申请号：US12968491
申请日：2010-12-15
申请人： Makoto Saruwatari , Hiroaki Narita
发明人： Makoto Saruwatari , Hiroaki Narita
IPC分类号： H02P1/18
CPC分类号： G05B23/00 , H02P1/18 , Y10T307/625
摘要： An electric actuator is provided having the same configuration whether used as an ordinary electric actuator or as an electric actuator having an emergency shutoff function. A portion for supplying power during a power failure, a power failure detection circuit, and a motor power supply switching circuit are provided in a module detachably coupled to the electric actuator. When failure of primary power is not detected, the power is sent to the electric actuator by the motor power supply switching circuit. When failure of the primary power is detected, secondary power is sent to the electric actuator by the motor power supply switching circuit. In addition, notification of the power failure is sent from the module to the control board of the electric actuator, via a relay connector. After being notified of the power failure, the control board reads a specified aperture during a power failure from a memory, and drives the motor with secondary power from the module as the energy source, thereby setting the aperture of the valve to the aperture during a power failure.
摘要翻译： 提供具有与用作普通电动致动器或具有紧急关闭功能的电致动器相同的构造的电致动器。 在电动执行器可拆卸地连接的模块中设置有在断电期间供电的部分，断电检测电路和电动机电源切换电路。 当未检测到主电源故障时，通过电机电源切换电路将电力发送到电动执行机构。 当检测到主电源故障时，二次电源由电动机电源切换电路发送到电动执行机构。 另外，通过中继连接器将电源故障的通知从模块发送到电动执行器的控制板。 在通知电源故障之后，控制板从存储器发生电源故障时读取指定的光圈，并将来自模块的次级电源的电动机作为能量源驱动，从而在一段时间内将阀的孔径设置为孔径 电源（检测）失败。
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10.发明授权Manufacturing method using multi-step adhesive curing for sealed semiconductor device 有权用于密封半导体器件的多步粘合剂固化的制造方法公开(公告)号：US08513060B2
公开(公告)日：2013-08-20
申请号：US13559397
申请日：2012-07-26
申请人： Hiroaki Narita
发明人： Hiroaki Narita
IPC分类号： H01L21/78
CPC分类号： H01L24/28 , H01L21/561 , H01L21/568 , H01L21/6836 , H01L21/78 , H01L23/3107 , H01L23/544 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/743 , H01L24/78 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2221/68327 , H01L2221/6834 , H01L2223/54433 , H01L2223/54486 , H01L2224/05554 , H01L2224/27436 , H01L2224/29017 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/743 , H01L2224/78301 , H01L2224/83191 , H01L2224/83856 , H01L2224/85001 , H01L2224/85045 , H01L2224/85181 , H01L2224/85186 , H01L2224/85207 , H01L2224/92247 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2924/18165 , H01L2924/20305 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A method for forming a sealing body without cracks in manufacture of a semiconductor device having an external terminal formed through the use of an electrolysis plating method. A front surface of a semiconductor wafer is placed over a front surface of a first support heated to a first temperature. An adhesive sheet is then bonded to a back surface of the semiconductor wafer, after which the semiconductor wafer is subjected to heat treatment at a second temperature higher than the first temperature. After the semiconductor wafer and the adhesive sheet are cut along cutting regions, a plurality of semiconductor chips each having an adhesive patch bonded thereto are obtained. A mother substrate is placed over a front surface of a second support heated to a third temperature and the semiconductor chips are fixed to an upper surface of the mother substrate via the adhesive patch.
摘要翻译： 在具有通过使用电解镀法形成的外部端子的半导体器件的制造中，形成密封体而没有裂纹的方法。 将半导体晶片的前表面放置在加热到第一温度的第一支撑件的前表面上。 然后将粘合片粘合到半导体晶片的背面，然后在高于第一温度的第二温度对半导体晶片进行热处理。 在切割区域切割半导体晶片和粘合片之后，获得多个粘合贴片的半导体芯片。 将母基板放置在加热到第三温度的第二支撑体的前表面上，并且半导体芯片经由粘合贴片固定到母基板的上表面。
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