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    Semiconductor device manufacturing method
    5.
    发明申请
    Semiconductor device manufacturing method 有权
    半导体器件制造方法

    公开(公告)号：US20060068572A1

    公开(公告)日：2006-03-30

    申请号：US11225898

    申请日：2005-09-14

    申请人： Takashi Noma ,  Kazuo Okada ,  Hiroshi Yamada ,  Masanori Iida

    发明人： Takashi Noma ,  Kazuo Okada ,  Hiroshi Yamada ,  Masanori Iida

    IPC分类号： H01L21/28 ,  H01L29/70 ,  H01L21/44 ,  H01L27/102 ,  H01L27/082 ,  H01L31/11

    CPC分类号： H01L24/12 ,  H01L21/76898 ,  H01L23/3114 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/00014

    摘要： The invention is directed to improvement of reliability of a chip size package type semiconductor device in a manufacturing method thereof. A support body is formed on a front surface of a semiconductor substrate with a first insulation film therebetween. Then, a part of the semiconductor substrate is selectively etched from its back surface to form an opening, and then a second insulation film is formed on the back surface. Next, the first insulation film and the second insulation film at a bottom of the opening are selectively etched, to expose pad electrodes at the bottom of the opening. Then, a third resist layer is selectively formed on a second insulation film at boundaries between sidewalls and the bottom of the opening on the back surface of the semiconductor substrate. Furthermore, a wiring layer electrically connected with the pad electrodes at the bottom of the opening and extending onto the back surface of the semiconductor substrate is selectively formed corresponding to a predetermined pattern.

    摘要翻译： 本发明的目的在于提高芯片尺寸封装型半导体器件的制造方法的可靠性。 在半导体基板的前表面上形成有第一绝缘膜的支撑体。 然后，从其背面选择性地蚀刻半导体衬底的一部分以形成开口，然后在背面形成第二绝缘膜。 接下来，选择性地蚀刻开口底部的第一绝缘膜和第二绝缘膜，以露出开口底部的焊盘电极。 然后，在半导体衬底的背面的开口的侧壁和底部之间的边界处，在第二绝缘膜上选择性地形成第三抗蚀剂层。 此外，根据预定图案选择性地形成与开口底部的焊盘电极电连接并延伸到半导体衬底的背面上的布线层。

    Semiconductor device manufacturing method
    6.
    发明授权
    Semiconductor device manufacturing method 有权
    半导体器件制造方法

    公开(公告)号：US07413931B2

    公开(公告)日：2008-08-19

    申请号：US11225898

    申请日：2005-09-14

    申请人： Takashi Noma ,  Kazuo Okada ,  Hiroshi Yamada ,  Masanori Iida

    发明人： Takashi Noma ,  Kazuo Okada ,  Hiroshi Yamada ,  Masanori Iida

    IPC分类号： H01L21/312

    CPC分类号： H01L24/12 ,  H01L21/76898 ,  H01L23/3114 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/00014

    摘要： The invention is directed to improvement of reliability of a chip size package type semiconductor device in a manufacturing method thereof. A support body is formed on a front surface of a semiconductor substrate with a first insulation film therebetween. Then, a part of the semiconductor substrate is selectively etched from its back surface to form an opening, and then a second insulation film is formed on the back surface. Next, the first insulation film and the second insulation film at a bottom of the opening are selectively etched, to expose pad electrodes at the bottom of the opening. Then, a third resist layer is selectively formed on a second insulation film at boundaries between sidewalls and the bottom of the opening on the back surface of the semiconductor substrate. Furthermore, a wiring layer electrically connected with the pad electrodes at the bottom of the opening and extending onto the back surface of the semiconductor substrate is selectively formed corresponding to a predetermined pattern.

    摘要翻译： 本发明的目的在于提高芯片尺寸封装型半导体器件的制造方法的可靠性。 在半导体基板的前表面上形成有第一绝缘膜的支撑体。 然后，从其背面选择性地蚀刻半导体衬底的一部分以形成开口，然后在背面形成第二绝缘膜。 接下来，选择性地蚀刻开口底部的第一绝缘膜和第二绝缘膜，以露出开口底部的焊盘电极。 然后，在半导体衬底的背面的开口的侧壁和底部之间的边界处，在第二绝缘膜上选择性地形成第三抗蚀剂层。 此外，根据预定图案选择性地形成与开口底部的焊盘电极电连接并延伸到半导体衬底的背面上的布线层。

    Optical waveguide and method of forming the same
    7.
    发明授权
    Optical waveguide and method of forming the same 有权
    光波导及其形成方法

    公开(公告)号：US07024087B2

    公开(公告)日：2006-04-04

    申请号：US10432212

    申请日：2001-11-27

    申请人： Mikihiro Shimada ,  Tsuguhiro Korenaga ,  Masanori Iida ,  Hiroyuki Asakura

    发明人： Mikihiro Shimada ,  Tsuguhiro Korenaga ,  Masanori Iida ,  Hiroyuki Asakura

    IPC分类号： G02B6/10

    CPC分类号： G02B6/1221 ,  G02B6/12 ,  G02B6/132 ,  G02B2006/12147

    摘要： A first substrate on which an optical-waveguide groove is formed and a second substrate. The second substrate is bonded to the plane of the first substrate on which the optical-waveguide groove is formed by a material having a refractive index higher than those of the first substrate and second substrate. The optical-waveguide groove is filled with the material, and the refractive index of the first substrate is different from the refractive index of the second substrate.

    摘要翻译： 形成有光波导槽的第一基板和第二基板。 第二衬底通过具有比第一衬底和第二衬底的折射率高的材料结合到其上形成有光波导沟槽的第一衬底的平面上。 光波导槽填充有材料，第一衬底的折射率不同于第二衬底的折射率。

    Wavelength tunable filter apparatus
    8.
    发明授权
    Wavelength tunable filter apparatus 失效
    波长可调谐滤波器

    公开(公告)号：US06597480B1

    公开(公告)日：2003-07-22

    申请号：US09537767

    申请日：2000-03-30

    申请人： Masanori Iida ,  Hiroyuki Asakura

    发明人： Masanori Iida ,  Hiroyuki Asakura

    IPC分类号： H04J1402

    CPC分类号： H04B10/67 ,  H04B10/675 ,  H04J14/02 ,  H04J14/0298

    摘要： The apparatus has: a wavelength tunable filter 1; a photoelectric conversion part 2 which converts transmitted light received from the wavelength tunable filter 1 into a received light intensity signal; a received light intensity detecting part 3 which detects the intensity of the received light intensity signal; a signal component detecting part 8 which detects a signal component from the received light intensity signal; a signal intensity detecting part 9 which detects the intensity of the signal component; an intensity variation detecting part 4 which detects an intensity variation in the received light intensity signal which is detected and an intensity variation in the signal component; and a peak position detecting part 5 and a wavelength scanning part 6 which scan and a wavelength to be selected by the wavelength tunable filter 1 based on the two detected variations.

    摘要翻译： 该装置具有：波长可调滤波器1; 将从波长可调滤波器1接收的透射光转换为接收的光强度信号的光电转换部2; 接收光强度检测部分3，其检测接收的光强度信号的强度; 信号分量检测部分8，其从接收的光强度信号中检测信号分量; 信号强度检测部9，其检测信号分量的强度; 强度变化检测部分4，其检测被检测的接收光强度信号的强度变化和信号分量的强度变化; 以及基于两个检测到的变化的波长可调滤波器1进行扫描和波长选择的峰值位置检测部分5和波长扫描部分6。

    Optical circuit and light transmission system and method using the same
    9.
    发明授权
    Optical circuit and light transmission system and method using the same 失效
    光电路和光传输系统及其使用方法

    公开(公告)号：US5546219A

    公开(公告)日：1996-08-13

    申请号：US397961

    申请日：1995-03-03

    申请人： Masanori Iida

    发明人： Masanori Iida

    IPC分类号： G02B27/28 ,  G02B6/293 ,  G02F1/03 ,  G02F1/09 ,  H04B10/00 ,  H04B10/40 ,  H04B10/50 ,  H04B10/60

    CPC分类号： G02F1/0311 ,  G02F1/093

    摘要： In the forward direction, the light from an input fiber is polarized and separated in a polarized light separating and combining element, the separated polarized light is rotated by a polarized light rotating element, dispersed according to wavelength by a wavelength dispersing element, rotated again by the polarized light rotating element, and is further rotated by a phase plate, thereby combining the polarized lights in the polarized light separating and combining element, so that only the light of a desired wavelength is coupled with the optical fiber. In the reverse direction, the light from the output fiber is not coupled with the input fiber, and hence the light propagation direction is defined in one direction in the disclosed optical circuit. A light transmission system and method using this optical circuit is also presented.

    摘要翻译： 在向前方向上，来自输入光纤的光在偏振光分离和组合元件中被偏振和分离，所分离的偏振光由偏振光旋转元件旋转，由波长分散元件根据波长分散，再次旋转 偏振光旋转元件，并且被相位板进一步旋转，从而将偏振光分离和组合元件中的偏振光组合，使得只有所需波长的光与光纤耦合。 在相反方向上，来自输出光纤的光不与输入光纤耦合，因此在所公开的光电路中光传播方向在一个方向上被限定。 还提出了使用该光电路的光传输系统和方法。

    Optical isolator and optical fiber amplifier
    10.
    发明授权
    Optical isolator and optical fiber amplifier 失效
    光隔离器和光纤放大器

    公开(公告)号：US5493440A

    公开(公告)日：1996-02-20

    申请号：US324972

    申请日：1994-10-18

    申请人： Hironori Souda ,  Masaaki Tojo ,  Noboru Kurata ,  Masanori Iida

    发明人： Hironori Souda ,  Masaaki Tojo ,  Noboru Kurata ,  Masanori Iida

    IPC分类号： G02B6/26 ,  G02B6/42 ,  G02F1/09 ,  H01S3/067 ,  G11B7/00

    CPC分类号： G02B6/2746 ,  G02F1/093 ,  H01S3/06754 ,  G02B6/4246

    摘要： On one end side of a converging rod lens are provided a first and second input optical fibers and a first and second output optical fibers. On the other end side of the converging rod lens is provided a reflecting mirror. Between the converging lens and the first and second input and output optical fibers is provided a birefringent element for resolving a ray which passes therethrough into an ordinary ray and an extraordinary ray. In the optical paths of the first and second output optical fibers between the converging rod lens and birefringent element is placed a compensator for rotating 45 degrees the plane of polarization of a ray which passes therethrough. The reflecting mirror reflects incident rays from the first and second input optical fibers to the first and second output optical fibers. Between the converging rod lens and the reflecting mirror is provided a magneto-optical element for rotating 22.5 degrees the plane of polarization of a ray which passes therethrough. The rays emitted from the first and second input optical fibers have their planes of polarization rotated 90 degrees by the magneto-optical element and compensator.

    摘要翻译： 在会聚杆透镜的一端侧设置有第一和第二输入光纤以及第一和第二输出光纤。 在会聚杆透镜的另一端设有反射镜。 在会聚透镜和第一和第二输入和输出光纤之间设置有用于将通过其中的光线分解为普通光线和非凡光线的双折射元件。 在会聚棒透镜和双折射元件之间的第一和第二输出光纤的光路中设置有用于使通过其的光线的偏振平面旋转45度的补偿器。 反射镜将来自第一和第二输入光纤的入射光线反射到第一和第二输出光纤。 在聚光棒透镜和反射镜之间设置有用于使穿过其中的光线的偏振面旋转22.5度的磁光元件。 从第一和第二输入光纤发射的光线通过磁光元件和补偿器使其偏振面旋转90度。