公开(公告)号：US5189523A

公开(公告)日：1993-02-23

申请号：US618398

申请日：1990-11-27

申请人： Takashi Sugiura ,  Nao Nagashima ,  Shunichi Abe

发明人： Takashi Sugiura ,  Nao Nagashima ,  Shunichi Abe

IPC分类号： H04N1/58 ,  H04N1/62

CPC分类号： H04N1/62 ,  H04N1/58

摘要： An image processing apparatus suitable for use in a copying machine or a facsimile apparatus includes an input circuit for inputting an image signal, an image discrimination circuit for discriminating a characteristic of the input image signal and providing a discrimination signal representing that characteristic, and a memory for storing the discrimination signal. A processing circuit then processes a reentered image signal input by the input circuit in accordance with the discrimination signal stored in the memory to reproduce an image.

摘要翻译： 适用于复印机或传真装置的图像处理装置包括用于输入图像信号的输入电路，用于识别输入图像信号的特性并提供表示该特征的鉴别信号的图像鉴别电路和存储器 用于存储鉴别信号。 处理电路然后根据存储在存储器中的鉴别信号处理由输入电路输入的重入图像信号以再现图像。

公开(公告)号：US08428503B2

公开(公告)日：2013-04-23

申请号：US12929859

申请日：2011-02-22

申请人： Tetsurou Sasamoto ,  Takuma Nakamura ,  Masafumi Yamada ,  Yuichi Aoyama ,  Takanori Inadome ,  Kazuya Nagao ,  Shunichi Abe

发明人： Tetsurou Sasamoto ,  Takuma Nakamura ,  Masafumi Yamada ,  Yuichi Aoyama ,  Takanori Inadome ,  Kazuya Nagao ,  Shunichi Abe

IPC分类号： G03G15/20

CPC分类号： G03G15/2096

摘要： A disclosed fixing device for fixing resin particles softened by applying a foam fixer thereon to a recording medium includes a foam fixer generator unit to introduce air bubbles into a liquid fixer containing a softener for softening the resin particles by dissolving or swelling a part of the resin particles to generate the foam fixer, a fixer application member to be brought into contact with a facing member facing the fixer application member to form an application nip and transfer the generated foam fixer to the application nip by moving its surface while carrying the foam fixer to apply the foam fixer to a surface of the recording medium carrying the resin particles at the application nip, and a foam accumulation detector unit to detect a foam accumulation formed of the foam fixer accumulated at an entrance side of the application nip.

摘要翻译： 公开的用于固定通过在其上施加泡沫定影剂而软化的树脂颗粒的定影装置包括泡沫定影剂发生器单元，其将气泡引入含有软化剂的液体定影剂中，所述液体定影剂通过溶解或溶胀树脂的一部分而使树脂颗粒软化 用于产生泡沫定影剂的颗粒，定影剂施加构件，其与面向定影剂施加构件的面对构件接触以形成施加辊隙，并将产生的泡沫定影剂通过移动其表面并将泡沫定影剂运送到施加辊隙 将泡沫定影剂施加到在施加辊隙处承载树脂颗粒的记录介质的表面，以及泡沫聚积检测器单元，用于检测由在施加辊隙的入口侧积聚的泡沫定影剂形成的泡沫聚积。

公开(公告)号：US20110217099A1

公开(公告)日：2011-09-08

申请号：US12929859

申请日：2011-02-22

申请人： Tetsurou Sasamoto ,  Takuma Nakamura ,  Masafumi Yamada ,  Yuichi Aoyama ,  Takanori Inadome ,  Kazuya Nagao ,  Shunichi Abe

发明人： Tetsurou Sasamoto ,  Takuma Nakamura ,  Masafumi Yamada ,  Yuichi Aoyama ,  Takanori Inadome ,  Kazuya Nagao ,  Shunichi Abe

IPC分类号： G03G15/20

CPC分类号： G03G15/2096

摘要： A disclosed fixing device for fixing resin particles softened by applying a foam fixer thereon to a recording medium includes a foam fixer generator unit to introduce air bubbles into a liquid fixer containing a softener for softening the resin particles by dissolving or swelling a part of the resin particles to generate the foam fixer, a fixer application member to be brought into contact with a facing member facing the fixer application member to form an application nip and transfer the generated foam fixer to the application nip by moving its surface while carrying the foam fixer to apply the foam fixer to a surface of the recording medium carrying the resin particles at the application nip, and a foam accumulation detector unit to detect a foam accumulation formed of the foam fixer accumulated at an entrance side of the application nip.

摘要翻译： 公开的用于固定通过在其上施加泡沫定影剂而软化的树脂颗粒的定影装置包括泡沫定影剂发生器单元，其将气泡引入含有软化剂的液体定影剂中，所述液体定影剂通过溶解或溶胀树脂的一部分而使树脂颗粒软化 用于产生泡沫定影剂的颗粒，定影剂施加构件，其与面向定影剂施加构件的面对构件接触以形成施加辊隙，并将产生的泡沫定影剂通过移动其表面并将泡沫定影剂运送到施加辊隙 将泡沫定影剂施加到在施加辊隙处承载树脂颗粒的记录介质的表面，以及泡沫聚积检测器单元，用于检测由在施加辊隙的入口侧积聚的泡沫定影剂形成的泡沫聚积。

公开(公告)号：US07028397B2

公开(公告)日：2006-04-18

申请号：US10159123

申请日：2002-06-03

申请人： Shunichi Abe ,  Tetsuya Uebayashi ,  Naoki Izumi ,  Akira Yamazaki

发明人： Shunichi Abe ,  Tetsuya Uebayashi ,  Naoki Izumi ,  Akira Yamazaki

IPC分类号： H05K3/34

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/07802 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T156/1339

摘要： A semiconductor chip, substrate employing plural bonding steps to ensure complete bonding particularly of peripheral edges. Embodiments include placing an adhesive layer on a chip mounting substrate positioned on a first supporting device, pressing a semiconductor chip against the chip mounting substrate to bond the semiconductor chip temporarily to the chip mounting substrate temporarily bonded chip on a second supporting device, and applying chip to straighten warpage and to bond the chip entirely to the chip mounting substrate.

摘要翻译： 一种半导体芯片，采用多个接合步骤的基板，以确保特别是外围边缘的完全接合。 实施例包括将粘合剂层放置在位于第一支撑装置上的芯片安装基板上，将半导体芯片压靠在芯片安装基板上，将半导体芯片暂时地接合到芯片安装基板上，临时接合芯片在第二支撑装置上， 以矫正翘曲并将芯片完全粘合到芯片安装基板上。

公开(公告)号：US06965154B2

公开(公告)日：2005-11-15

申请号：US10810813

申请日：2004-03-29

申请人： Shunichi Abe ,  Tetsuya Uebayashi ,  Naoki Izumi ,  Akira Yamazaki

发明人： Shunichi Abe ,  Tetsuya Uebayashi ,  Naoki Izumi ,  Akira Yamazaki

IPC分类号： H01L25/18 ,  H01L23/495 ,  H01L23/50 ,  H01L25/065 ,  H01L25/07 ,  H01L29/00 ,  H01L23/06 ,  H01L23/34 ,  H01L23/48

CPC分类号： H01L23/49575 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A semiconductor device and a manufacturing method thereof are provided with downsizing and densification achieved by reducing the thickness of the semiconductor device without increase in area. Terminal electrodes are arranged, in plan view, outside a region where semiconductor chips are arranged. A lower semiconductor chip is placed to overlap in the range of height with the terminal electrodes, an upper semiconductor chip is placed above the lower semiconductor chip, a wire connects the upper and lower semiconductor chips to the terminal electrodes, and an encapsulating resin encapsulates the upper and lower semiconductor chips and wire. The encapsulating resin has its bottom surface coplanar with the bottom surface of the terminal electrodes.

摘要翻译： 通过减小半导体器件的厚度而不增加面积，提供了通过减小​​和致密化的半导体器件及其制造方法。 端子电极在平面图中布置在半导体芯片布置的区域的外部。 下半导体芯片放置成与端子电极在高度范围内重叠，上半导体芯片放置在下半导体芯片的上方，导线将上半导体芯片和下半导体芯片连接到端子电极，封装树脂封装 上下半导体芯片和导线。 封装树脂的底面与端子电极的底面共面。

公开(公告)号：US5508811A

公开(公告)日：1996-04-16

申请号：US497336

申请日：1995-06-30

申请人： Shunichi Abe ,  Masaharu Ohkubo ,  Akio Suzuki ,  Yoshihiro Takada

发明人： Shunichi Abe ,  Masaharu Ohkubo ,  Akio Suzuki ,  Yoshihiro Takada

IPC分类号： G06T3/60 ,  H04N1/23 ,  H04N1/387 ,  B41J2/01 ,  G01D9/00

CPC分类号： H04N1/2323 ,  G06T3/60 ,  H04N1/2307 ,  H04N1/387

摘要： An image reading and recording apparatus includes a reader for reading an image of a document and by scanning a document; a recorder for effecting recording of the image read by the reader on a recording medium by scanning one side of the recording medium. A driving and controlling device drives and controls the reader and the recorder in such a manner that the image recorded on one side of the recording medium by means of the recorder will be inverted with respect to the image of the document.

摘要翻译： 图像读取和记录装置包括用于读取文档的图像并扫描文档的读取器; 记录器，用于通过扫描记录介质的一侧来将由读取器读取的图像记录在记录介质上。 驱动和控制装置以这样的方式驱动和控制读取器和记录器，使得借助于记录器记录在记录介质的一侧上的图像将相对于文档的图像反转。

公开(公告)号：US5440169A

公开(公告)日：1995-08-08

申请号：US177380

申请日：1994-01-05

申请人： Yoshihiro Tomita ,  Shunichi Abe

发明人： Yoshihiro Tomita ,  Shunichi Abe

IPC分类号： H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/50 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H01L23/48

CPC分类号： H01L23/49503 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49551 ,  H05K1/0204 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/07802 ,  H01L2924/1532 ,  H01L2924/1815 ,  H05K1/182 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K3/341

摘要： A resin-packaged semiconductor device having a semiconductor element mounted on a first surface of a mounting pad. The mounting pad has an edge molded in a frame-shaped portion of a molding material. A second surface of the mounting pad has a central portion that is not included in the edge of the mounting pad and that is not covered with the molding material, the central portion of the second surface being exposed at the outside of the device. The thickness of the molding material in the frame-shaped portion and on the second surface of the mounting pad can be readily reduced to reduce the thickness of the device. Since the molding material does not cover the entire second surface, molding characteristics as well as heat radiation characteristics are improved.

摘要翻译： 一种树脂封装半导体器件，其具有安装在安装焊盘的第一表面上的半导体元件。 安装垫具有模制在模制材料的框形部分中的边缘。 安装垫的第二表面具有不包括在安装垫的边缘中并且不被模制材料覆盖的中心部分，第二表面的中心部分在设备的外部露出。 可以容易地减小框架部分和安装垫的第二表面上的成型材料的厚度，以减小装置的厚度。 由于成型材料不覆盖整个第二表面，因此改善了成型特性以及散热特性。

公开(公告)号：US5317191A

公开(公告)日：1994-05-31

申请号：US929443

申请日：1992-08-14

申请人： Shunichi Abe

发明人： Shunichi Abe

IPC分类号： H01L21/52 ,  H01L21/60 ,  H01L23/48 ,  H01L29/46 ,  H01L29/62 ,  H01L29/64

CPC分类号： H01L24/32 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29211 ,  H01L2224/29316 ,  H01L2224/32245 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/1576

摘要： A semiconductor device includes a semiconductor element attached to a support member by a junction material that includes a parent phase of a low-melting-point junction material and fine particles of a high-melting-point junction material which are uniformly dispersed in the low-melting-point material. By heating the junction material to a temperature higher than the melting point of the low-melting-point junction material and lower than the melting point of the high-melting-point junction material, the low-melting-point junction material is brought to a molten state, making the entire junction material fluid. Thus, the size of the junction material need not be adjusted to that of the semiconductor element. Further, with this semiconductor device, the contact area between the low-melting-point junction material and the high-melting-point junction material is extremely large so that the requisite time for making the composition of the junction material uniform is shortened.

摘要翻译： 半导体器件包括通过包含低熔点连接材料的母相和均匀分散在低熔点连接材料中的高熔点连接材料的细颗粒的连接材料附着到支撑构件上的半导体元件， 熔点材料。 通过将接合材料加热到高于低熔点接合材料的熔点并低于高熔点接合材料的熔点的温度，将低熔点接合材料变成 熔融状态，使整个接合材料流体。 因此，不需要将连接材料的尺寸调整为半导体元件的尺寸。 此外，利用该半导体器件，低熔点连接材料与高熔点连接材料之间的接触面积非常大，从而缩短了使连接材料组成均匀的必要时间。

公开(公告)号：US4745466A

公开(公告)日：1988-05-17

申请号：US585602

申请日：1984-03-02

申请人： Tadashi Yoshida ,  Kimiyoshi Hayashi ,  Shunichi Abe ,  Nobuo Matsuoka ,  Yoshinori Ikeda ,  Mitsuo Akiyama ,  Yoshinobu Mita

发明人： Tadashi Yoshida ,  Kimiyoshi Hayashi ,  Shunichi Abe ,  Nobuo Matsuoka ,  Yoshinori Ikeda ,  Mitsuo Akiyama ,  Yoshinobu Mita

IPC分类号： G03F3/08 ,  H04N1/405 ,  H04N1/60

CPC分类号： H04N1/6027 ,  H04N1/4055

摘要： An image processing apparatus receives color data and includes a masking processing circuit for modifying the colors represented by the color data by processing each of the different color data received. The colors are modified according to other color data associated with each of the colors represented by the color data. The masking processing circuit includes a first memory for storing data representing each color and a second memory for storing data from the data derived after masking processing the data stored in the first memory. The color data and the other color data are used as addresses in the first and second memory. The number of bits of each color data used as an address for each respective color is larger than the number of bits for each of the other color data received at that portion of the memory.

摘要翻译： 图像处理装置接收彩色数据，并且包括掩蔽处理电路，用于通过处理接收的不同颜色数据中的每一个来修改由颜色数据表示的颜色。 根据与由颜色数据表示的每种颜色相关联的其他颜色数据来修改颜色。 掩蔽处理电路包括用于存储表示每种颜色的数据的第一存储器和用于存储来自在掩蔽处理之后导出的数据的数据的第二存储器，存储在第一存储器中的数据。 颜色数据和其他颜色数据被用作第一和第二存储器中的地址。 用作每种颜色的地址的每种颜色数据的位数大于在存储器的该部分处接收的每个其他颜色数据的位数。

公开(公告)号：US4700236A

公开(公告)日：1987-10-13

申请号：US662559

申请日：1984-10-19

申请人： Shunichi Abe

发明人： Shunichi Abe

IPC分类号： G03G15/04 ,  B41J2/52 ,  G03G15/043 ,  H04N1/04 ,  H04N1/40 ,  H04N1/407 ,  H04N1/10

CPC分类号： H04N1/40056 ,  H04N1/4072

摘要： An image processing apparatus comprises an illumination device for illuminating an original image, a photosensing device for converting the illuminated original image to an electrical signal and a conversion device for converting the output data of the photosensing device. The illumination device has a variable light intensity relative to the original image, and the conversion device changes a data conversion mode between a first mode and a second mode in accordance with the light illumination of the illumination device.

摘要翻译： 图像处理装置包括用于照亮原始图像的照明装置，用于将照亮的原始图像转换为电信号的光感测装置，以及用于转换光敏装置的输出数据的转换装置。 照明装置相对于原始图像具有可变的光强度，并且转换装置根据照明装置的光照照改变第一模式和第二模式之间的数据转换模式。