摘要:
A heat-conductive sheet comprising a cured or semi-cured binder wherein a carbon fiber is orientated in the direction of the thickness of the heat-conductive sheet. This heat-conductive sheet exhibits a high anisotropic heat conductivity along the direction of the thickness thereof to thereby enable efficiently releasing heat from a heating element such as a semiconductor element or semiconductor package. Moreover, the heat-conductive sheet is excellent in not only heat resistance, durability and mechanical strength but also adherence to the heating element.
摘要:
A rubber composition consisting essentially of 5-99 parts by weight of a thermosetting resin and 94-1 parts by weight of one of the following functional rubber-like copolymers (I) to (III) having a Mooney viscosity ML.sub.1+4.sup.100 of 20-120:(I) a functional rubber-like copolymer consisting of 1-20% by weight of a monomer having epoxy groups, hydroxyl groups or amino groups, 15-50% by weight of acrylonitrile and 40-80% by weight of butadiene and/or isoprene as monomer units constituting the polymer,(II) a functional rubber-like copolymer consisting of 1-20% by weight of a monomer having epoxy groups, hydroxyl groups or amino groups, 40-99% by weight of an alkyl (meth)acrylate and/or an alkoxyalkyl (meth)acrylate and 0-30% by weight of monomers copolymerizable therewith other than butadiene and isoprene, as the monomer units constituting the polymer, and(III) a functional rubber-like copolymer consisting of 1-20% by weight of a monomer having epoxy groups, hydroxyl groups or amino groups, 15-50% by weight of acrylonitrile, 20-60% by weight of butadiene and/or isoprene and 5-65% by weight of an alkyl (meth)acrylate and/or an alkoxy (meth)acrylate as the monomer units constituting the polymer.Said functional rubber copolymer may include 10% by weight or less of a polyfunctional monomer as a monomer unit constituting the polymer. In this case, the ratio of the thermosetting resin to the functional rubber-like copolymer is 50-99 parts by weight of the former to 1-50 parts by weight of the latter.
摘要:
A resin composition comprising 100 parts by weight of a thermosetting resin and 1 to 100 parts by weight of a functional, rubbery copolymer containing among the monomer units which constitute the copolymer, at least one monomer containing a substituent selected from the group consisting of epoxy, hydroxyl, carboxyl and amino groups, said copolymer being prepared by one of three emulsion polymerization processes in which a nonionic surface active agent and/or ionic surface active agent is employed as the emulsifying agent.
摘要:
A positive-tone photosensitive resin composition for forming a thick film which is suitably used for photofabrication such as manufacture of circuit boards, a photosensitive resin film, and a method of forming a bump using the same. The photosensitive resin composition comprising (A) a novolac resin with a weight average molecular weight of 2,000-30,000, (B) a polyvinyl lower alkyl ether, (C) a polyphenol derivative compound with a molecular weight of 200-1,000, and (D) a compound containing a naphthoquinonediazido group.
摘要:
An olefin polymer and a curable resin composition which can form cure coatings with excellent transparency, low reflectance, and high scratch resistance, an antireflection film exhibiting excellent transparency, low reflectance, and high scratch resistance are disclosed. The olefin polymer comprises a polysiloxane segment in the main chain, has 30 wt % or more fluorine content, and has a polystyrene-reduced number average molecular weight of 5,000 or more. The curable resin composition comprises the olefin polymer. The antireflection film is made from the cured product of the curable resin composition.
摘要:
A water-developable photosensitive resin composition which exhibits a small swelling, small reduction in strength and small dimension change when developed with water and which has an excellent balance of characteristics. Said composition comprises (1) a oarboxyl group-containing diene polymer, (2) a hydrogenated diene block polymer in which at least 80% of the double bonds in the recurring unit consisting of conjugated diene has been hydrogenated, (3) a photopolymerizable ethylenically unsaturated monomer, (4) an amino group-containing compound and (5) a photopolymerization initiator.
摘要:
A thermoplastic elastomer composition which comprises 25-95% by weight of a polyamide and 75-5% by weight of a halogenated butyl rubber, a chlorosulfonated polyethylene or both thereof. Said composition is excellent in resistance to Freon gas permeation and has good oil resistance and low-temperature resistance. A hose wherein the layer to be contacted with a gas is made of the above thermoplastic elastomer composition is suitable as a Freon gas R-22 hose.
摘要:
A negative photoresist stripping liquid composition is provided which comprises from 30 to 75% by weight of dimethyl sulfoxide, from 20 to 65% by weight of 1,3-dimethyl-2-imidazolidinone, from 0.1 to 5% by weight of a tetraalkylammonium hydroxide and from 0.5 to 15% by weight of water. The composition has a superior stripping performance especially against photoresists that are alkali-developable and can form films of at least 20 .mu.m in thickness, and has no problem of freezing even when stored outdoors in the winter. The composition is useful for the stripping of negative photoresists for bump formation and for fabricating circuit substrates.
摘要:
A radiation sensitive resin composition comprising:(A) an alkali-soluble copolymer comprising:(a) 10 to 50% by weight of a first unit consisting of a radical polymerizable compound having a carboxylic group,(b) 20 to 60% by weight of a second unit consisting of a radical polymerizable compound having a cycloalkyl group, the unit containing no carboxyl group, and(c) 5 to 40% by weight of a third unit consisting of a radical polymerizable compound other than the radical polymerizable compounds in (a) and (b) above;(B) a polymerizable compound having at least one ethylenically unsaturated double bond; and(C) a radiation sensitive radical initiator. Also is disclosed a material for forming bumps containing the radiation sensitive resin composition. The radiation sensitive resin composition has sufficient developability with an alkali developer and sufficient resolution when the composition is in the form of a 20 .mu.m or more thick film. The composition and material of the present invention have excellent resistance to plating liquids and good wettability to plating liquids, and improved adhesion to substrates upon development. Therefore, the composition and material of the present invention can form bumps having sufficient characteristics by plating and give rise to a cured product which has excellent peelability from the substrate on which it is formed.
摘要:
A positive photoresist composition including (A) 100 parts by weight of an alkali-soluble novolak resin, and based thereon; (B) 5 to 50 parts by weight of an alkali-soluble acrylic resin containing, as s, 10 to 80% by weight of a unit of a radical-polymerizable compound having an alcoholic hydroxyl group and 3 to 50% by weight of at least one of a unit of a radical-polymerizable compound having a carboxyl group and a unit of a radical-polymerizable compound having a phenolic hydroxyl group; (C) 5 to 100 parts by weight of a quinonediazide group-containing compound; and (D) a solvent, is provided. This composition has a good adhesion to substrates at the time of development and a good plating solution resistance and moreover can be well wetted with plating solutions, can be well developed with alkali developing solutions and can be well stripped from substrates at the resist unexposed areas, and is suited for the formation of thick films suitable as bump forming materials.