公开(公告)号：US07574312B2

公开(公告)日：2009-08-11

申请号：US11268662

申请日：2005-11-08

申请人： Takeshi Nakayama ,  Eiji Takahashi ,  Yoshiyuki Saito

发明人： Takeshi Nakayama ,  Eiji Takahashi ,  Yoshiyuki Saito

IPC分类号： G01F23/00

CPC分类号： H03H7/38 ,  G06F1/26

摘要： A semiconductor device is disclosed in which resistance to the influence of external noise on internal power source network is improved. A semiconductor device operating at any predetermined frequency among a plurality thereof, and having power source networks for supplying power from a power source to internal functional units in the semiconductor device comprises switches, a storage unit, and a control unit. The switches are provided in the power source networks, and switch ON/OFF the supply of power from the power source to the functional units. In the storage unit are mapped and stored a plurality of predetermined operating frequencies and switching information designating an ON state or an OFF state for the switches. The control unit reads, from the storage, switching information corresponding to a current operating frequency, and controls the ON/OFF switching of the switches in accordance with the read switching information.

摘要翻译： 公开了一种半导体器件，其中改善了对外部噪声对内部电源网络的影响的抵抗力。 一种半导体器件，在其多个中以任何预定频率工作，并具有用于从电源向半导体器件中的内部功能单元供电的电源网络，包括开关，存储单元和控制单元。 开关设置在电源网络中，并从电源向功能单元接通/断开电源。 在存储单元中映射并存储多个预定操作频率和指定开关的ON状态或OFF状态的切换信息。 控制单元从存储器读取与当前工作频率相对应的切换信息，并且根据读取的切换信息来控制开关的ON / OFF切换。

公开(公告)号：US06901343B2

公开(公告)日：2005-05-31

申请号：US10029571

申请日：2001-12-20

申请人： Eiji Takahashi ,  Yukihiro Fukumoto ,  Yoshiyuki Saito ,  Osamu Shibata ,  Shinichi Tanimoto ,  Takeshi Nakayama

发明人： Eiji Takahashi ,  Yukihiro Fukumoto ,  Yoshiyuki Saito ,  Osamu Shibata ,  Shinichi Tanimoto ,  Takeshi Nakayama

IPC分类号： G06F17/50 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H04L9/32

CPC分类号： G06F17/5068 ,  H05K1/0275 ,  H05K1/0298 ,  H05K1/114 ,  H05K2201/09627 ,  H05K2201/09772 ,  H05K2201/10151

摘要： A signal line, being in a six-layer board and connecting terminal 102 of component 101 with terminal 115 of component 114, requires tamper-resistance. The signal line is composed of foil 103 on an outside layer, a via 104, foil 111 on the third layer, via 105, foil 112 on the fourth layer, via 106, and foil 113 on the sixth layer. Portions of the signal line that exist on outside layers are all hidden under circuit components. Foil 103 and an end of via 104 are placed under component 101 on first layer 116, an end of via 105 is placed under component 107 on layer 116, an end of via 106 is placed under component 108 on layer 116, the other end of via 104 is placed under component 109 on sixth layer 121, the other end of via 105 is placed under component 110 on layer 121, and foil 113 and the other end of via 106 are placed under component 114 on layer 121.

摘要翻译： 在组件101的六层板和连接端子102与元件114的端子115之间的信号线需要防篡改。 信号线由外层的箔103，通孔104，第三层上的箔111，通孔105，第四层上的箔112，第106层和第六层上的箔113组成。 存在于外层的信号线部分都隐藏在电路元件下面。 箔103和通孔104的末端放置在第一层116上的部件101下方，通孔105的端部放置在层116上的部件107的下方，通孔106的端部放置在层116上的部件108的下方，另一端 通孔104被放置在第六层121上的部件109的下方，通孔105的另一端被放置在层121上的部件110下方，并且箔113和通孔106的另一端放置在层121上的部件114下方。

公开(公告)号：US07346051B2

公开(公告)日：2008-03-18

申请号：US11149171

申请日：2005-06-10

申请人： Takeshi Nakayama ,  Eiji Takahashi ,  Yoshiyuki Saito ,  Yukihiro Ishimaru ,  Hideki Iwaki

发明人： Takeshi Nakayama ,  Eiji Takahashi ,  Yoshiyuki Saito ,  Yukihiro Ishimaru ,  Hideki Iwaki

IPC分类号： H04Q11/00 ,  H04L12/50 ,  H04L12/28 ,  H04L12/56 ,  H02J13/00 ,  G06F3/00 ,  G06F15/76

CPC分类号： G06F13/409 ,  G06F13/4226 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/16145 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A stacked device is disclosed which is easily manufactured while identifying a plurality of devices that are stacked in the stacked device. The stacked device includes a stack of a plurality of slave devices and a master device having identical terminal arrangements. Here, the master device includes command transmission unit configured to input an identification command to a terminal of an adjacent slave device. Furthermore, the slave device includes a through-wire for interconnecting at least one terminal of that same device and an adjacent slave device; command reception unit configured to receive the identification command; and ID (identifier) setting unit configured to set the ID of that same device based on the identification command; the positions of the terminals that are interconnected with the adjacent slave devices differing in each slave device, so that, in each slave device, the slave device command reception unit receive an identification command having a modified value as a result of transiting through-wires that are connected at differing positions in each slave device.

摘要翻译： 公开了一种容易制造的堆叠式装置，同时识别堆叠在堆叠装置中的多个装置。 堆叠式装置包括多个从装置的堆叠和具有相同端子装置的主装置。 这里，主设备包括命令传输单元，其被配置为向相邻从设备的终端输入识别命令。 此外，从设备包括用于互连同一设备的至少一个终端和相邻从设备的通线; 命令接收单元，被配置为接收所述识别命令; ID（识别符）设定部，其基于所述识别命令来设定同一设备的ID; 与相邻从设备互连的终端的位置在每个从设备中不同，从而在每个从设备中，从设备命令接收单元接收作为转接通线的结果具有修改值的标识命令， 被连接在每个从设备中的不同位置。

公开(公告)号：US20050289269A1

公开(公告)日：2005-12-29

申请号：US11149171

申请日：2005-06-10

申请人： Takeshi Nakayama ,  Eiji Takahashi ,  Yoshiyuki Saito ,  Yukihiro Ishimaru ,  Hideki Iwaki

发明人： Takeshi Nakayama ,  Eiji Takahashi ,  Yoshiyuki Saito ,  Yukihiro Ishimaru ,  Hideki Iwaki

IPC分类号： G06F13/00 ,  G06F13/40 ,  G06F13/42

CPC分类号： G06F13/409 ,  G06F13/4226 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/16145 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A stacked device is disclosed which is easily manufactured while identifying a plurality of devices that are stacked in the stacked device. The stacked device includes a stack of a plurality of slave devices and a master device having identical terminal arrangements. Here, the master device includes command transmission unit configured to input an identification command to a terminal of an adjacent slave device. Furthermore, the slave device includes a through-wire for interconnecting at least one terminal of that same device and an adjacent slave device; command reception unit configured to receive the identification command; and ID (identifier) setting unit configured to set the ID of that same device based on the identification command; the positions of the terminals that are interconnected with the adjacent slave devices differing in each slave device, so that, in each slave device, the slave device command reception unit receive an identification command having a modified value as a result of transiting through-wires that are connected at differing positions in each slave device.

摘要翻译： 公开了一种容易制造的堆叠式装置，同时识别堆叠在堆叠装置中的多个装置。 堆叠式装置包括多个从装置的堆叠和具有相同端子装置的主装置。 这里，主设备包括命令传输单元，其被配置为向相邻从设备的终端输入识别命令。 此外，从设备包括用于互连同一设备的至少一个终端和相邻从设备的通线; 命令接收单元，被配置为接收所述识别命令; ID（识别符）设定部，其基于所述识别命令来设定同一设备的ID; 与相邻从设备互连的终端的位置在每个从设备中不同，从而在每个从设备中，从设备命令接收单元接收作为转接通线的结果具有修改值的标识命令， 被连接在每个从设备中的不同位置。

公开(公告)号：US20060097748A1

公开(公告)日：2006-05-11

申请号：US11268662

申请日：2005-11-08

申请人： Takeshi Nakayama ,  Eiji Takahashi ,  Yoshiyuki Saito

发明人： Takeshi Nakayama ,  Eiji Takahashi ,  Yoshiyuki Saito

IPC分类号： H03K19/01

CPC分类号： H03H7/38 ,  G06F1/26

摘要： A semiconductor device is disclosed in which resistance to the influence of external noise on internal power source network is improved. A semiconductor device operating at any predetermined frequency among a plurality thereof, and having power source networks for supplying power from a power source to internal functional units in the semiconductor device comprises switches, a storage unit, and a control unit. The switches are provided in the power source networks, and switch ON/OFF the supply of power from the power source to the functional units. In the storage unit are mapped and stored a plurality of predetermined operating frequencies and switching information designating an ON state or an OFF state for the switches. The control unit reads, from the storage, switching information corresponding to a current operating frequency, and controls the ON/OFF switching of the switches in accordance with the read switching information.

公开(公告)号：US20110180317A1

公开(公告)日：2011-07-28

申请号：US13122603

申请日：2010-08-05

申请人： Eiji Takahashi ,  Yoshiyuki Saito

发明人： Eiji Takahashi ,  Yoshiyuki Saito

IPC分类号： H01L23/495

CPC分类号： H01L23/49833 ,  H01L23/147 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15174 ,  H05K1/141 ,  H05K1/142 ,  H05K2201/049 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package comprising an electronic component, a circuit substrate onto which the electronic component is mounted, and an interposer located between the electronic component and the circuit substrate, allowing them to be electrically connected with each other, wherein the interposer is composed of at least two sub-interposers, and the at least two sub-interposers lie in the same plane to be disposed only on electrode terminal-forming areas of both of the electronic component and the circuit substrate.

摘要翻译： 一种包括电子部件，安装有电子部件的电路基板和位于电子部件与电路基板之间的插入件的封装，使它们彼此电连接，其中插入件由至少两个 子插入件，并且所述至少两个子内插层位于仅设置在电子部件和电路基板的电极端子形成区域的同一平面中。

公开(公告)号：US20100163282A1

公开(公告)日：2010-07-01

申请号：US12376862

申请日：2007-10-22

申请人： Hiroyoshi Tagi ,  Eiji Takahashi ,  Yoshiyuki Saito

发明人： Hiroyoshi Tagi ,  Eiji Takahashi ,  Yoshiyuki Saito

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K3/20 ,  H05K1/11

CPC分类号： H05K1/0228 ,  H05K1/0245 ,  H05K1/0393 ,  H05K3/4614 ,  H05K3/4635 ,  H05K2201/055 ,  H05K2201/097 ,  Y10T29/49128

摘要： Provided are a printed wiring board and a flexible printed wiring board which hardly generate radiation electromagnetic noises and are not easily affected by external noises. First and second wave-shape wirings are provided between at least two insulation substrates stacked on each other. The first and the second wave-shape wirings three-dimensionally intersect with each other in a plane direction and a thickness direction of the insulating substrates. The first and second wave-shape wirings are electrically separated from each other by a resist layer provided between the insulating substrates.

摘要翻译： 提供了几乎不产生辐射电磁噪声并且不容易受到外部噪声的影响的印刷线路板和柔性印刷线路板。 在彼此堆叠的至少两个绝缘基板之间设置第一和第二波形布线。 第一和第二波形布线在绝缘基板的平面方向和厚度方向上彼此三维地相交。 第一和第二波形布线通过设置在绝缘基板之间的抗蚀剂层彼此电分离。

公开(公告)号：US07233889B2

公开(公告)日：2007-06-19

申请号：US10278507

申请日：2002-10-23

申请人： Eiji Takahashi ,  Yoshiyuki Saito ,  Yukihiro Fukumoto ,  Hiroshi Benno

发明人： Eiji Takahashi ,  Yoshiyuki Saito ,  Yukihiro Fukumoto ,  Hiroshi Benno

IPC分类号： G06F17/50

CPC分类号： G06F17/5036

摘要： A method of evaluating noise immunity of a semiconductor device is provided. An actual circuit including the semiconductor device is represented by an equivalent circuit which has a target equivalent circuit, a noise source equivalent circuit, and an external equivalent circuit connected in parallel. The target equivalent circuit represents the semiconductor device. The noise source equivalent circuit represents a noise source outside the semiconductor device, and supplies noise to the target equivalent circuit. The external equivalent circuit represents a circuit outside the semiconductor device. The noise immunity is evaluated based on a voltage or current which arises in the target equivalent circuit by the noise. In this way, the immunity of the semiconductor device against extraneous noise can be evaluated in consideration of the effects of the circuitry outside the semiconductor device.

摘要翻译： 提供了一种评估半导体器件的抗噪声性的方法。 包括半导体器件的实际电路由具有并联连接的目标等效电路，噪声源等效电路和外部等效电路的等效电路表示。 目标等效电路表示半导体器件。 噪声源等效电路表示半导体器件外部的噪声源，并且将噪声提供给目标等效电路。 外部等效电路表示半导体器件外部的电路。 基于由噪声在目标等效电路中产生的电压或电流来评估噪声抗扰度。 以这种方式，可以考虑半导体器件外的电路的影响来评估半导体器件对外来噪声的抗扰性。

公开(公告)号：US20090097301A1

公开(公告)日：2009-04-16

申请号：US11915816

申请日：2006-05-18

申请人： Eiji Takahashi ,  Yoshiyuki Saito

发明人： Eiji Takahashi ,  Yoshiyuki Saito

IPC分类号： G11C11/24 ,  G11C7/00

CPC分类号： H01L27/101 ,  G11C11/404 ,  G11C11/4074 ,  G11C11/4076 ,  H01L27/1085 ,  H01L27/10882

摘要： An object is to provide a semiconductor memory device which can dynamically change the number of memory cells used as by-pass capacitors. In each memory block, one selector signal line is provided in parallel to one word line. In a pair of the word line and the selector signal line adjacent to each other, states are maintained opposite to each other. Further, in a memory block, one branch of a supply line is provided in parallel to one bit line. In each of the memory cells, a first transistor connects a capacitor to the bit line in accordance with the state of the word line. Furthermore, a second transistor connects the same capacitor to the branch of the supply line in accordance with the state of the selector signal line. In the memory cells aligned in a row direction, gates of the first transistors are connected to the same word line, and gates of the second transistors are connected to the same selector signal line.

摘要翻译： 本发明的目的是提供一种半导体存储器件，其可以动态地改变用作旁路电容器的存储单元的数量。 在每个存储块中，一条选择器信号线与一条字线平行地提供。 在彼此相邻的一对字线和选择器信号线中，状态保持彼此相对。 此外，在存储块中，供给线的一个分支与一个位线并行设置。 在每个存储单元中，第一晶体管根据字线的状态将电容器连接到位线。 此外，第二晶体管根据选择器信号线的状态将相同的电容器连接到电源线的分支。 在沿行方向排列的存储单元中，第一晶体管的栅极连接到相同的字线，第二晶体管的栅极连接到相同的选择信号线。

公开(公告)号：US08119919B2

公开(公告)日：2012-02-21

申请号：US12376862

申请日：2007-10-22

申请人： Hiroyoshi Tagi ,  Eiji Takahashi ,  Yoshiyuki Saito

发明人： Hiroyoshi Tagi ,  Eiji Takahashi ,  Yoshiyuki Saito

IPC分类号： H05K1/00

CPC分类号： H05K1/0228 ,  H05K1/0245 ,  H05K1/0393 ,  H05K3/4614 ,  H05K3/4635 ,  H05K2201/055 ,  H05K2201/097 ,  Y10T29/49128

摘要： Provided are a printed wiring board and a flexible printed wiring board which hardly generate radiation electromagnetic noises and are not easily affected by external noises. First and second wave-shape wirings are provided between at least two insulation substrates stacked on each other. The first and the second wave-shape wirings three-dimensionally intersect with each other in a plane direction and a thickness direction of the insulating substrates. The first and second wave-shape wirings are electrically separated from each other by a resist layer provided between the insulating substrates.

摘要翻译： 提供了几乎不产生辐射电磁噪声并且不容易受到外部噪声的影响的印刷线路板和柔性印刷线路板。 在彼此堆叠的至少两个绝缘基板之间设置第一和第二波形布线。 第一和第二波形布线在绝缘基板的平面方向和厚度方向上彼此三维地相交。 第一和第二波形布线通过设置在绝缘基板之间的抗蚀剂层彼此电分离。