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1.发明申请SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MOUNTING METHOD, AND PRESSING TOOL 有权半导体器件安装结构及其制造方法，半导体器件安装方法和压制工具公开(公告)号：US20120298310A1
公开(公告)日：2012-11-29
申请号：US13567112
申请日：2012-08-06
IPC分类号： B30B9/00
CPC分类号： H01L24/75 , B30B5/02 , H01L21/56 , H01L21/563 , H01L23/3121 , H01L24/83 , H01L24/90 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/75303 , H01L2224/75315 , H01L2224/75756 , H01L2224/83192 , H01L2224/83855 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/18161 , H01L2924/3512 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided.
摘要翻译： 当形成在半导体芯片的焊盘上的凸起和具有粘附在其表面上的片状密封粘合树脂的板彼此面对地设置时，用工具将凸块和板彼此挤压，从而形成半导体芯片 其中密封粘合树脂填充在半导体芯片和板之间，并且其中半导体芯片的焊盘和板的电极分别经由凸块相互连接。 半导体芯片的角部的整个侧面被密封接合树脂覆盖。 因此，由于板弯曲而在安装期间由加热和冷却引起的各个部件之间的热膨胀和收缩差异的板弯曲产生的负载以及安装之后的机械负载，从而可以避免半导体芯片的内部击穿。
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公开(公告)号：US20100032832A1
公开(公告)日：2010-02-11
申请号：US12531819
申请日：2008-05-09
IPC分类号： H01L23/488
CPC分类号： H01L24/13 , H01L24/05 , H01L24/11 , H01L2224/02125 , H01L2224/0401 , H01L2224/05076 , H01L2224/05554 , H01L2224/05576 , H01L2224/05599 , H01L2224/1147 , H01L2224/11472 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/73204 , H01L2224/81001 , H01L2224/81191 , H01L2224/83192 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/00 , H01L2924/00012
摘要： In this semiconductor chip 3, a table electrode 13 is interposed between a bump electrode 14 and an electrode pad 6. The table electrode 13 is formed by forming a plurality of cores 15 having a smaller Young's modulus than the bump electrode 14, on the electrode pad 6, and then covering the surfaces of the cores 15 with a conductive electrode 16. When the semiconductor chip 3 is flip-chip mounted, the bump electrode 14 is plastically deformed and the table electrode 13 is elastically deformed appropriately, thereby obtaining a good conductive state.
摘要翻译： 在该半导体芯片3中，台面电极13插入在凸块电极14和电极焊盘6之间。台电极13通过在电极上形成具有比突起电极14更小的杨氏模量的多个芯15而形成 垫6，然后用导电电极16覆盖芯15的表面。当半导体芯片3倒装芯片安装时，凸起电极14塑性变形，并且台面电极13被适当地弹性变形，从而获得良好的 导电状态。
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3.发明授权Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool 有权半导体器件安装结构及其制造方法，半导体器件安装方法和压制工具公开(公告)号：US08264079B2
公开(公告)日：2012-09-11
申请号：US12666860
申请日：2008-06-26
IPC分类号： H01L23/48
CPC分类号： H01L24/75 , B30B5/02 , H01L21/56 , H01L21/563 , H01L23/3121 , H01L24/83 , H01L24/90 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/75303 , H01L2224/75315 , H01L2224/75756 , H01L2224/83192 , H01L2224/83855 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/18161 , H01L2924/3512 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided.
摘要翻译： 当形成在半导体芯片的焊盘上的凸起和具有粘附在其表面上的片状密封粘合树脂的板彼此面对地设置时，用工具将凸块和板彼此挤压，从而形成半导体芯片 其中密封粘合树脂填充在半导体芯片和板之间，并且其中半导体芯片的焊盘和板的电极分别经由凸块相互连接。 半导体芯片的角部的整个侧面被密封接合树脂覆盖。 因此，由于板弯曲而在安装期间由加热和冷却引起的各个部件之间的热膨胀和收缩差异的板弯曲产生的负载以及安装之后的机械负载，从而可以避免半导体芯片的内部击穿。
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4.发明申请SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MOUNTING METHOD, AND PRESSING TOOL 有权半导体器件安装结构及其制造方法，半导体器件安装方法和压制工具公开(公告)号：US20100181667A1
公开(公告)日：2010-07-22
申请号：US12666860
申请日：2008-06-26
CPC分类号： H01L24/75 , B30B5/02 , H01L21/56 , H01L21/563 , H01L23/3121 , H01L24/83 , H01L24/90 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/75303 , H01L2224/75315 , H01L2224/75756 , H01L2224/83192 , H01L2224/83855 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/18161 , H01L2924/3512 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding use resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding use resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. In the semiconductor chip mounted structure formed in this way, entire side faces at the corner portions of the semiconductor chip are covered with the seal-bonding use resin. As a result, loads generated at corner portions of the semiconductor chip due to board flexures for thermal expansion differences and thermal contraction differences among the individual members caused by heating process and cooling process in mounting operation as well as for mechanical loads after the mounting operation so that internal breakdown of the semiconductor chip can be avoided.
摘要翻译： 当在半导体芯片的焊盘上形成的凸起和具有粘附在其表面上的片状密封用树脂的基板面对面地设置时，用工具将凸块和板彼此挤压，从而形成半导体 分别在半导体芯片和板之间填充密封用树脂并且其中半导体芯片的焊盘和板的电极通过凸块相互连接的芯片安装结构。 在以这种方式形成的半导体芯片安装结构中，用密封接合用树脂覆盖半导体芯片的角部的整个侧面。 结果，由于板弯曲导致的半导体芯片的角部处的负载产生的热膨胀差异和各个部件之间的热收缩差异由安装操作中的加热处理和冷却过程以及安装操作之后的机械负载引起。 可以避免半导体芯片的内部故障。
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公开(公告)号：US07994638B2
公开(公告)日：2011-08-09
申请号：US12531819
申请日：2008-05-09
IPC分类号： H01L23/488
CPC分类号： H01L24/13 , H01L24/05 , H01L24/11 , H01L2224/02125 , H01L2224/0401 , H01L2224/05076 , H01L2224/05554 , H01L2224/05576 , H01L2224/05599 , H01L2224/1147 , H01L2224/11472 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/73204 , H01L2224/81001 , H01L2224/81191 , H01L2224/83192 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/00 , H01L2924/00012
摘要： In this semiconductor chip 3, a table electrode 13 is interposed between a bump electrode 14 and an electrode pad 6. The table electrode 13 is formed by forming a plurality of cores 15 having a smaller Young's modulus than the bump electrode 14, on the electrode pad 6, and then covering the surfaces of the cores 15 with a conductive electrode 16. When the semiconductor chip 3 is flip-chip mounted, the bump electrode 14 is plastically deformed and the table electrode 13 is elastically deformed appropriately, thereby obtaining a good conductive state.
摘要翻译： 在该半导体芯片3中，台面电极13插入在凸块电极14和电极焊盘6之间。台电极13通过在电极上形成具有比突起电极14更小的杨氏模量的多个芯15而形成 垫6，然后用导电电极16覆盖芯15的表面。当半导体芯片3倒装芯片安装时，凸起电极14塑性变形，并且台面电极13被适当地弹性变形，从而获得良好的 导电状态。
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6.发明授权Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool 有权半导体器件安装结构及其制造方法，半导体器件安装方法和压制工具公开(公告)号：US08426965B2
公开(公告)日：2013-04-23
申请号：US13567112
申请日：2012-08-06
IPC分类号： H01L23/48
CPC分类号： H01L24/75 , B30B5/02 , H01L21/56 , H01L21/563 , H01L23/3121 , H01L24/83 , H01L24/90 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/75303 , H01L2224/75315 , H01L2224/75756 , H01L2224/83192 , H01L2224/83855 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/18161 , H01L2924/3512 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided.
摘要翻译： 当形成在半导体芯片的焊盘上的凸起和具有粘附在其表面上的片状密封粘合树脂的板彼此面对地设置时，用工具将凸块和板彼此挤压，从而形成半导体芯片 其中密封粘合树脂填充在半导体芯片和板之间，并且其中半导体芯片的焊盘和板的电极分别经由凸块相互连接。 半导体芯片的角部的整个侧面被密封接合树脂覆盖。 因此，由于板弯曲而在安装期间由加热和冷却引起的各个部件之间的热膨胀和收缩差异的板弯曲产生的负载以及安装之后的机械负载，从而可以避免半导体芯片的内部击穿。
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公开(公告)号：US09165168B2
公开(公告)日：2015-10-20
申请号：US14385553
申请日：2013-02-21
申请人： Takanori Suzuki , Yuichiro Yamada , Kenta Nakai
发明人： Takanori Suzuki , Yuichiro Yamada , Kenta Nakai
CPC分类号： G06K7/084 , G11B5/00808 , G11B5/09 , G11B20/10 , G11B2220/17
摘要： In order to perform processing of analyzing card data in an appropriate amount of time depending on the number of tracks actually present on a magnetic stripe with use of a single demodulation circuit, the single demodulation circuit produces, based on magnetic data read by a magnetic head, a single common card running signal obtained by ORing card running signals of tracks present on the magnetic stripe of the magnetic card, a clock signal of each track present on the magnetic stripe, and a data signal of each track present on the magnetic stripe. A card running signal generation circuit generates, based on the common card running signal and the clock signal of each track, an individual card running signal of each track present on the magnetic stripe. A data analysis processing unit determines, based on presence or absence of the individual card running signal, presence or absence of a track on the magnetic stripe to perform processing of analyzing the data signal only for the track determined to be present on the magnetic stripe.
摘要翻译： 为了根据使用单个解调电路在磁条上实际存在的轨道的数量，在适当的时间内进行分析卡数据的处理，单个解调电路基于由磁头读取的磁数据 通过对存在于磁卡的磁条上的磁道的卡运行信号，磁条上存在的每个磁道的时钟信号和存在于磁条上的每个磁道的数据信号进行OR运算获得的单个普通卡运行信号。 卡片运行信号产生电路基于公共卡运行信号和每个磁道的时钟信号产生磁条上存在的每个磁道的单独卡运行信号。 数据分析处理单元基于存在或不存在单独的卡运行信号来确定磁条上是否存在磁道，以执行仅针对确定存在于磁条上的磁道来分析数据信号的处理。
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8.发明授权Liquid crystal display device and process for producing liquid crystal display device 有权液晶显示装置及液晶显示装置的制造方法公开(公告)号：US09164325B2
公开(公告)日：2015-10-20
申请号：US13813772
申请日：2011-07-27
申请人： Masanobu Mizusaki , Youhei Nakanishi , Takeshi Noma , Yuichiro Yamada , Satoshi Enomoto , Yuki Hara , Hideo Kikuchi
发明人： Masanobu Mizusaki , Youhei Nakanishi , Takeshi Noma , Yuichiro Yamada , Satoshi Enomoto , Yuki Hara , Hideo Kikuchi
IPC分类号： G02F1/1337 , G02F1/1333 , C08F220/18 , C08F222/10
CPC分类号： G02F1/133711 , B32B2457/202 , C08F220/18 , C08F222/1006 , G02F1/1333 , G02F1/133723 , G02F1/133788 , G02F2001/133397 , G02F2001/133742 , Y10T428/1005
摘要： The liquid crystal display device according to the present invention includes a pair of substrates, and a liquid crystal layer disposed between the pair of substrates, wherein the liquid crystal layer includes a liquid crystal material having a negative dielectric constant anisotropy, at least one of the pair of substrates is provided with an alignment film for vertically aligning adjacent liquid crystal molecules, and a polymer layer formed on the alignment film for controlling the alignment of the adjacent liquid crystal molecules, the polymer layer is formed by polymerization of at least one monomer, the polymerization being initiated by radicals generated of the monomer upon absorption of light, the alignment film includes a polymer compound having a main chain that contains an imide structure, and the main chain has an imidization ratio of 50% or more.
摘要翻译： 根据本发明的液晶显示装置包括一对基板和设置在该对基板之间的液晶层，其中液晶层包括具有负介电常数各向异性的液晶材料，至少一个 一对基板设置有用于垂直排列相邻液晶分子的取向膜和形成在取向膜上的用于控制相邻液晶分子的取向的聚合物层，聚合物层通过至少一种单体的聚合形成， 聚合由吸收光时由单体产生的自由基引发，取向膜包括具有含有酰亚胺结构的主链的高分子化合物，并且主链的酰亚胺化率为50％以上。
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9.发明授权Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads 有权树脂密封半导体器件，具有管芯焊盘的引线框，以及具有管芯焊盘的引线框架的制造方法公开(公告)号：US07952177B2
公开(公告)日：2011-05-31
申请号：US12208804
申请日：2008-09-11
IPC分类号： H01L23/02
CPC分类号： H01L24/32 , H01L23/4334 , H01L23/49503 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/29007 , H01L2224/32014 , H01L2224/32245 , H01L2224/451 , H01L2224/48095 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2224/92247 , H01L2924/00014 , H01L2924/181 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599
摘要： A resin-sealed semiconductor device with built-in heat sink prevents internal bulging and cracking caused by exfoliation of a semiconductor element from the heat sink when the vapor pressure of moisture absorbed into a gap between the semiconductor element and the heat sink rises during mounting of the semiconductor device to a printed circuit board using lead-free solder. By providing a plurality of separated die pads (502) in a mounting area for a semiconductor element (301) and adhering the semiconductor element (301) to the heat sink (105) via the die pads (502), space is opened up between the semiconductor element (301) and the heat sink (105) for sealing resin (304) to run into.
摘要翻译： 具有内置散热器的树脂密封半导体器件在吸收到半导体元件和散热片之间的间隙中的水分的蒸气压在安装期间升高时防止半导体元件从散热器脱落引起的内部凸起和破裂 将半导体器件用于使用无铅焊料的印刷电路板。 通过在用于半导体元件（301）的安装区域中设置多个分离的管芯焊盘（502）并且经由管芯焊盘（502）将半导体元件（301）粘附到散热器（105）上， 半导体元件（301）和用于密封树脂（304）进入的散热片（105）。
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10.发明申请公开(公告)号：US20050087890A1
公开(公告)日：2005-04-28
申请号：US10991864
申请日：2004-11-19
IPC分类号： H01L23/31 , H01L23/495 , H01L23/28
CPC分类号： H01L23/49541 , H01L23/3107 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A resin molded type semiconductor device has: a semiconductor chip (12) which is mounted on a die pad portion (11) of a lead frame (9); thin metal wires (14) which connect terminals of the semiconductor chip (12) to inner lead portions (13) of the lead frame (9); and a sealing resin (15), and the lead frame (9) is subjected to an upsetting process so that a supporting portion (11) is located at a position higher than the inner lead portions (13). Since the sealing resin of a thickness corresponding to the step difference of the upsetting exists below the supporting portion, the adhesiveness between the lead frame and the sealing resin can be improved, and high reliability and thinning are realized. Since at least one groove portion is disposed in the surface of each of the inner lead portions (13), the anchoring effect to the sealing resin (15), stress acting on a lead portion of a product, and stress to the thin metal wires (14) can be relaxed, and leads and the thin metal wires can be prevented from peeling off.
摘要翻译： 树脂模制型半导体器件具有：半导体芯片（12），其安装在引线框架（9）的芯片焊盘部分（11）上; 将半导体芯片（12）的端子连接到引线框架（9）的内引线部分（13）的细金属线（14）; 和密封树脂（15），并且引线框架（9）经受镦锻处理，使得支撑部分（11）位于比内部引线部分（13）高的位置。 由于对应于镦粗阶梯差的厚度的密封树脂存在于支撑部分的下方，因此可以提高引线框架和密封树脂之间的粘合性，并且实现高可靠性和变薄。 由于至少一个槽部设置在每个内部引线部分（13）的表面中，所以对密封树脂（15）的锚定效应，作用在产品的引线部分上的应力和对金属细线的应力 （14）可以松弛，并且可以防止导线和细金属线剥离。
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