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1.发明授权Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool 有权半导体器件安装结构及其制造方法，半导体器件安装方法和压制工具公开(公告)号：US08426965B2
公开(公告)日：2013-04-23
申请号：US13567112
申请日：2012-08-06
IPC分类号： H01L23/48
CPC分类号： H01L24/75 , B30B5/02 , H01L21/56 , H01L21/563 , H01L23/3121 , H01L24/83 , H01L24/90 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/75303 , H01L2224/75315 , H01L2224/75756 , H01L2224/83192 , H01L2224/83855 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/18161 , H01L2924/3512 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided.
摘要翻译： 当形成在半导体芯片的焊盘上的凸起和具有粘附在其表面上的片状密封粘合树脂的板彼此面对地设置时，用工具将凸块和板彼此挤压，从而形成半导体芯片 其中密封粘合树脂填充在半导体芯片和板之间，并且其中半导体芯片的焊盘和板的电极分别经由凸块相互连接。 半导体芯片的角部的整个侧面被密封接合树脂覆盖。 因此，由于板弯曲而在安装期间由加热和冷却引起的各个部件之间的热膨胀和收缩差异的板弯曲产生的负载以及安装之后的机械负载，从而可以避免半导体芯片的内部击穿。
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公开(公告)号：US07994638B2
公开(公告)日：2011-08-09
申请号：US12531819
申请日：2008-05-09
IPC分类号： H01L23/488
CPC分类号： H01L24/13 , H01L24/05 , H01L24/11 , H01L2224/02125 , H01L2224/0401 , H01L2224/05076 , H01L2224/05554 , H01L2224/05576 , H01L2224/05599 , H01L2224/1147 , H01L2224/11472 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/73204 , H01L2224/81001 , H01L2224/81191 , H01L2224/83192 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/00 , H01L2924/00012
摘要： In this semiconductor chip 3, a table electrode 13 is interposed between a bump electrode 14 and an electrode pad 6. The table electrode 13 is formed by forming a plurality of cores 15 having a smaller Young's modulus than the bump electrode 14, on the electrode pad 6, and then covering the surfaces of the cores 15 with a conductive electrode 16. When the semiconductor chip 3 is flip-chip mounted, the bump electrode 14 is plastically deformed and the table electrode 13 is elastically deformed appropriately, thereby obtaining a good conductive state.
摘要翻译： 在该半导体芯片3中，台面电极13插入在凸块电极14和电极焊盘6之间。台电极13通过在电极上形成具有比突起电极14更小的杨氏模量的多个芯15而形成 垫6，然后用导电电极16覆盖芯15的表面。当半导体芯片3倒装芯片安装时，凸起电极14塑性变形，并且台面电极13被适当地弹性变形，从而获得良好的 导电状态。
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3.发明申请SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MOUNTING METHOD, AND PRESSING TOOL 有权半导体器件安装结构及其制造方法，半导体器件安装方法和压制工具公开(公告)号：US20120298310A1
公开(公告)日：2012-11-29
申请号：US13567112
申请日：2012-08-06
IPC分类号： B30B9/00
CPC分类号： H01L24/75 , B30B5/02 , H01L21/56 , H01L21/563 , H01L23/3121 , H01L24/83 , H01L24/90 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/75303 , H01L2224/75315 , H01L2224/75756 , H01L2224/83192 , H01L2224/83855 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/18161 , H01L2924/3512 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided.
摘要翻译： 当形成在半导体芯片的焊盘上的凸起和具有粘附在其表面上的片状密封粘合树脂的板彼此面对地设置时，用工具将凸块和板彼此挤压，从而形成半导体芯片 其中密封粘合树脂填充在半导体芯片和板之间，并且其中半导体芯片的焊盘和板的电极分别经由凸块相互连接。 半导体芯片的角部的整个侧面被密封接合树脂覆盖。 因此，由于板弯曲而在安装期间由加热和冷却引起的各个部件之间的热膨胀和收缩差异的板弯曲产生的负载以及安装之后的机械负载，从而可以避免半导体芯片的内部击穿。
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公开(公告)号：US20100032832A1
公开(公告)日：2010-02-11
申请号：US12531819
申请日：2008-05-09
IPC分类号： H01L23/488
CPC分类号： H01L24/13 , H01L24/05 , H01L24/11 , H01L2224/02125 , H01L2224/0401 , H01L2224/05076 , H01L2224/05554 , H01L2224/05576 , H01L2224/05599 , H01L2224/1147 , H01L2224/11472 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/73204 , H01L2224/81001 , H01L2224/81191 , H01L2224/83192 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/00 , H01L2924/00012
摘要： In this semiconductor chip 3, a table electrode 13 is interposed between a bump electrode 14 and an electrode pad 6. The table electrode 13 is formed by forming a plurality of cores 15 having a smaller Young's modulus than the bump electrode 14, on the electrode pad 6, and then covering the surfaces of the cores 15 with a conductive electrode 16. When the semiconductor chip 3 is flip-chip mounted, the bump electrode 14 is plastically deformed and the table electrode 13 is elastically deformed appropriately, thereby obtaining a good conductive state.
摘要翻译： 在该半导体芯片3中，台面电极13插入在凸块电极14和电极焊盘6之间。台电极13通过在电极上形成具有比突起电极14更小的杨氏模量的多个芯15而形成 垫6，然后用导电电极16覆盖芯15的表面。当半导体芯片3倒装芯片安装时，凸起电极14塑性变形，并且台面电极13被适当地弹性变形，从而获得良好的 导电状态。
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5.发明授权Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool 有权半导体器件安装结构及其制造方法，半导体器件安装方法和压制工具公开(公告)号：US08264079B2
公开(公告)日：2012-09-11
申请号：US12666860
申请日：2008-06-26
IPC分类号： H01L23/48
CPC分类号： H01L24/75 , B30B5/02 , H01L21/56 , H01L21/563 , H01L23/3121 , H01L24/83 , H01L24/90 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/75303 , H01L2224/75315 , H01L2224/75756 , H01L2224/83192 , H01L2224/83855 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/18161 , H01L2924/3512 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided.
摘要翻译： 当形成在半导体芯片的焊盘上的凸起和具有粘附在其表面上的片状密封粘合树脂的板彼此面对地设置时，用工具将凸块和板彼此挤压，从而形成半导体芯片 其中密封粘合树脂填充在半导体芯片和板之间，并且其中半导体芯片的焊盘和板的电极分别经由凸块相互连接。 半导体芯片的角部的整个侧面被密封接合树脂覆盖。 因此，由于板弯曲而在安装期间由加热和冷却引起的各个部件之间的热膨胀和收缩差异的板弯曲产生的负载以及安装之后的机械负载，从而可以避免半导体芯片的内部击穿。
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6.发明申请SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MOUNTING METHOD, AND PRESSING TOOL 有权半导体器件安装结构及其制造方法，半导体器件安装方法和压制工具公开(公告)号：US20100181667A1
公开(公告)日：2010-07-22
申请号：US12666860
申请日：2008-06-26
CPC分类号： H01L24/75 , B30B5/02 , H01L21/56 , H01L21/563 , H01L23/3121 , H01L24/83 , H01L24/90 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/75303 , H01L2224/75315 , H01L2224/75756 , H01L2224/83192 , H01L2224/83855 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/18161 , H01L2924/3512 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding use resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding use resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. In the semiconductor chip mounted structure formed in this way, entire side faces at the corner portions of the semiconductor chip are covered with the seal-bonding use resin. As a result, loads generated at corner portions of the semiconductor chip due to board flexures for thermal expansion differences and thermal contraction differences among the individual members caused by heating process and cooling process in mounting operation as well as for mechanical loads after the mounting operation so that internal breakdown of the semiconductor chip can be avoided.
摘要翻译： 当在半导体芯片的焊盘上形成的凸起和具有粘附在其表面上的片状密封用树脂的基板面对面地设置时，用工具将凸块和板彼此挤压，从而形成半导体 分别在半导体芯片和板之间填充密封用树脂并且其中半导体芯片的焊盘和板的电极通过凸块相互连接的芯片安装结构。 在以这种方式形成的半导体芯片安装结构中，用密封接合用树脂覆盖半导体芯片的角部的整个侧面。 结果，由于板弯曲导致的半导体芯片的角部处的负载产生的热膨胀差异和各个部件之间的热收缩差异由安装操作中的加热处理和冷却过程以及安装操作之后的机械负载引起。 可以避免半导体芯片的内部故障。
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公开(公告)号：US08050049B2
公开(公告)日：2011-11-01
申请号：US12427056
申请日：2009-04-21
IPC分类号： H05K7/00
CPC分类号： H05K1/181 , H05K3/284 , H05K3/305 , H05K2201/0133 , H05K2201/09036 , H05K2201/09909 , H05K2201/10674 , H05K2201/10977 , Y02P70/611
摘要： The present invention provides a semiconductor device of a double-side mounting structure including a circuit board and a plurality of semiconductor chips arranged and joined together on the opposite surfaces of the circuit board, wherein in an area in which the semiconductor chip 31 mounted on the top surface of the circuit board 2 overlaps with the semiconductor chip 32 mounted on the bottom surface of the circuit board 2, a recess portion 21 (or a protruding portion 22) is formed in the surfaces of the circuit board 2.
摘要翻译： 本发明提供了一种双面安装结构的半导体器件，其包括在电路板的相对表面上布置和接合在一起的电路板和多个半导体芯片，其中在安装在电路板上的半导体芯片31的区域中 电路板2的顶面与安装在电路基板2的底面的半导体芯片32重叠，在电路基板2的表面形成有凹部21（或突出部22）。
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公开(公告)号：US20100265683A1
公开(公告)日：2010-10-21
申请号：US12427056
申请日：2009-04-21
IPC分类号： H05K7/02
CPC分类号： H05K1/181 , H05K3/284 , H05K3/305 , H05K2201/0133 , H05K2201/09036 , H05K2201/09909 , H05K2201/10674 , H05K2201/10977 , Y02P70/611
摘要： The present invention provides a semiconductor device of a double-side mounting structure including a circuit board and a plurality of semiconductor chips arranged and joined together on the opposite surfaces of the circuit board, wherein in an area in which the semiconductor chip 31 mounted on the top surface of the circuit board 2 overlaps with the semiconductor chip 32 mounted on the bottom surface of the circuit board 2, a recess portion (or a protruding portion 22) is formed in the surfaces of the circuit board 2.
摘要翻译： 本发明提供了一种双面安装结构的半导体器件，其包括在电路板的相对表面上布置和接合在一起的电路板和多个半导体芯片，其中在安装在电路板上的半导体芯片31的区域中 电路板2的上表面与安装在电路基板2的底面上的半导体芯片32重叠，在电路基板2的表面形成有凹部（或突出部22）。
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公开(公告)号：US08436253B2
公开(公告)日：2013-05-07
申请号：US12992306
申请日：2009-03-23
IPC分类号： H05K1/00
CPC分类号： H05K3/305 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/05155 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/29298 , H01L2224/32225 , H01L2224/731 , H01L2224/73203 , H01L2224/73204 , H01L2224/83101 , H01L2224/83192 , H01L2224/83194 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/10253 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/3011 , H05K2201/0187 , H05K2201/10674 , H05K2201/10734 , H05K2201/10977 , H05K2203/1476 , Y02P70/613 , Y10T29/4913 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A mounting structure is provided which includes an electronic component; a circuit board; a first insulating resin and a second insulating resin which are placed between the electronic component and the circuit board, for sealing; a plurality of bumps are formed on the electronic component or the circuit board; a plurality of counter electrodes of the circuit board or the electronic component, connected to the plurality of bumps; and a plurality of joining regions. The plurality of joining regions are formed by the second insulating resin, a plurality of first insulating resin regions are disposed around the joining regions so that the joining regions are sandwiched by the plurality of first insulating resin regions, the first insulating resin and the second insulating resin each contain filler, and the second insulating resin has a higher curing temperature than the curing temperature of the first insulating resin.
摘要翻译： 提供一种安装结构，其包括电子部件; 电路板; 第一绝缘树脂和第二绝缘树脂，其被放置在电子部件和电路板之间用于密封; 在电子部件或电路基板上形成多个凸块; 连接到所述多个凸块的所述电路板或所述电子部件的多个对置电极; 和多个接合区域。 多个连接区域由第二绝缘树脂形成，多个第一绝缘树脂区域设置在接合区域周围，使得接合区域被多个第一绝缘树脂区域夹持，第一绝缘树脂和第二绝缘树脂区域 树脂各自含有填料，第二绝缘树脂的固化温度比第一绝缘树脂的固化温度高。
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公开(公告)号：US20110061913A1
公开(公告)日：2011-03-17
申请号：US12992306
申请日：2009-03-23
CPC分类号： H05K3/305 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/05155 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/29298 , H01L2224/32225 , H01L2224/731 , H01L2224/73203 , H01L2224/73204 , H01L2224/83101 , H01L2224/83192 , H01L2224/83194 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/10253 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/3011 , H05K2201/0187 , H05K2201/10674 , H05K2201/10734 , H05K2201/10977 , H05K2203/1476 , Y02P70/613 , Y10T29/4913 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A method of manufacturing a mounting structure includes: an insulating resin arranging step of forming, on a circuit board, two kinds of insulating resin including first insulating resin cured at first curing temperature and second insulating resin cured at second curing temperature higher than the first curing temperature; a mounting step of aligning the bumps formed on an electronic component such that the bumps are opposed to counter electrodes of the circuit board; and a full-scale pressing step of performing, after the mounting step, full-scale pressing to join the electronic component and the circuit board. The insulating resin is heated to reach the first curing temperature before the full-scale pressing, and the insulating resin is heated to reach the second temperature during the full-scale pressing after the curing of the first insulating resin.
摘要翻译： 一种制造安装结构的方法包括：绝缘树脂布置步骤，在电路板上形成两种绝缘树脂，所述绝缘树脂包括在第一固化温度下固化的第一绝缘树脂和在比第一固化的第二固化温度下固化的第二绝缘树脂 温度; 将形成在电子部件上的凸块对准使得凸块与电路板的对置电极相对的安装步骤; 以及全尺寸按压步骤，在安装步骤之后进行全尺寸按压以连接电子部件和电路板。 在全压制之前，将绝缘树脂加热到达第一固化温度，并且在固化第一绝缘树脂之后，在全压制期间将绝缘树脂加热到达第二温度。
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