公开(公告)号：US20100044799A1

公开(公告)日：2010-02-25

申请号：US12541556

申请日：2009-08-14

申请人： Teruo Kurahashi ,  Yasuyoshi Mishima ,  Yukie Sakita

发明人： Teruo Kurahashi ,  Yasuyoshi Mishima ,  Yukie Sakita

IPC分类号： H01L27/092 ,  H01L21/28

CPC分类号： H01L21/823842 ,  H01L21/823835 ,  H01L29/4975 ,  H01L29/66545

摘要： A method for manufacturing a P-type MOS transistor includes forming a gate insulating film on the substrate, forming a gate electrode from amorphous silicon containing no impurities on the gate insulating film, performing a heat treatment for controlling the film characteristics of the amorphous silicon, depositing a nickel (Ni) layer on the gate electrode, and forming nickel silicides from the gate electrode and the nickel (Ni).

摘要翻译： 一种P型MOS晶体管的制造方法，其特征在于，在所述基板上形成栅极绝缘膜，在所述栅极绝缘膜上形成不含有杂质的非晶硅的栅电极，进行用于控制所述非晶硅的膜特性的热处理， 在栅电极上沉积镍（Ni）层，并从栅电极和镍（Ni）形成镍硅化物。

公开(公告)号：US08470653B2

公开(公告)日：2013-06-25

申请号：US12541556

申请日：2009-08-14

申请人： Teruo Kurahashi ,  Yasuyoshi Mishima ,  Yukie Sakita

发明人： Teruo Kurahashi ,  Yasuyoshi Mishima ,  Yukie Sakita

IPC分类号： H01L27/092

CPC分类号： H01L21/823842 ,  H01L21/823835 ,  H01L29/4975 ,  H01L29/66545

摘要： A method for manufacturing a P-type MOS transistor includes forming a gate insulating film on the substrate, forming a gate electrode from amorphous silicon containing no impurities on the gate insulating film, performing a heat treatment for controlling the film characteristics of the amorphous silicon, depositing a nickel (Ni) layer on the gate electrode, and forming nickel silicides from the gate electrode and the nickel (Ni).

摘要翻译： 一种P型MOS晶体管的制造方法，其特征在于，在所述基板上形成栅极绝缘膜，在所述栅极绝缘膜上形成不含有杂质的非晶硅的栅电极，进行用于控制所述非晶硅的膜特性的热处理， 在栅电极上沉积镍（Ni）层，并从栅电极和镍（Ni）形成镍硅化物。

公开(公告)号：US07612400B2

公开(公告)日：2009-11-03

申请号：US11944847

申请日：2007-11-26

申请人： Teruo Kurahashi ,  Hideharu Shido ,  Kenji Ishikawa ,  Takeo Nagata ,  Yasuyoshi Mishima ,  Yukie Sakita

发明人： Teruo Kurahashi ,  Hideharu Shido ,  Kenji Ishikawa ,  Takeo Nagata ,  Yasuyoshi Mishima ,  Yukie Sakita

IPC分类号： H01L27/108

CPC分类号： H01L27/2472 ,  H01L45/04 ,  H01L45/1233 ,  H01L45/1253 ,  H01L45/146 ,  H01L45/1625

摘要： An MIM device includes a lower electrode of a metal nitride film, a hysteresis film of an oxide film containing Nb formed on the lower electrode, and an upper electrode of a metal nitride film formed on the hysteresis film.

摘要翻译： MIM器件包括金属氮化物膜的下电极，在下电极上形成含有Nb的氧化物膜的滞后膜和形成在滞后膜上的金属氮化物膜的上电极。

公开(公告)号：US08837149B2

公开(公告)日：2014-09-16

申请号：US13307029

申请日：2011-11-30

申请人： Shinichi Hirose ,  Taisuke Iwai ,  Yoshitaka Yamaguchi ,  Yohei Yagishita ,  Yukie Sakita ,  Masaaki Norimatsu

发明人： Shinichi Hirose ,  Taisuke Iwai ,  Yoshitaka Yamaguchi ,  Yohei Yagishita ,  Yukie Sakita ,  Masaaki Norimatsu

IPC分类号： H05K7/20 ,  H01L21/50 ,  H01L21/48 ,  H01L23/433 ,  H01L23/42 ,  H01L23/373

CPC分类号： H01L23/433 ,  H01L21/4871 ,  H01L21/50 ,  H01L23/373 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29076 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/8336 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/15788 ,  H01L2924/16152 ,  Y10T428/24124 ,  Y10T428/24132 ,  Y10T428/24165 ,  Y10T428/24174 ,  Y10T428/2913 ,  Y10T428/30 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.

摘要翻译： 一种电子部件的制造方法，其特征在于，在第一基板的上方设置包含碳原子数的多个线状结构的热辐射材料和设置在所述多个线状结构体中的热塑性树脂填充层，在所述热辐射上设置吸墨纸 材料，在高于热塑性树脂的熔融温度的温度下进行热处理，并用吸收纸吸收多个线性结构上方的热塑性树脂，除去吸墨纸，并将散热材料粘附到第一衬底上 冷却固化热塑性树脂。

公开(公告)号：US20120236502A1

公开(公告)日：2012-09-20

申请号：US13403156

申请日：2012-02-23

申请人： Yoshitaka Yamaguchi ,  Taisuke Iwai ,  Masaaki Norimatsu ,  Shinichi Hirose ,  Yohei Yagishita ,  Yukie Sakita

发明人： Yoshitaka Yamaguchi ,  Taisuke Iwai ,  Masaaki Norimatsu ,  Shinichi Hirose ,  Yohei Yagishita ,  Yukie Sakita

IPC分类号： H05K7/20 ,  B23P11/00 ,  B05D5/12 ,  B32B5/16

CPC分类号： H01L23/433 ,  F28F2013/006 ,  F28F2255/20 ,  H01L23/373 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/10158 ,  H01L2924/16152 ,  Y10T29/49826 ,  Y10T428/249924

摘要： According to an aspect of the embodiments, a sheet-shaped structure includes a bundle structure that includes a plurality of line-shaped structures of carbon atoms, a covering layer that covers the line-shaped structures in longitudinal directions of the line-shaped structures, respectively, and a filling layer that is disposed between the line-shaped structures covered with the covering layer.

摘要翻译： 根据实施例的一个方面，片状结构包括：束结构，其包括多个碳原子的线状结构;覆盖层，其在线状结构的纵向方向上覆盖线状结构; 以及填充层，其设置在被覆盖层覆盖的线状结构之间。

公开(公告)号：US20100124025A1

公开(公告)日：2010-05-20

申请号：US12614063

申请日：2009-11-06

申请人： Yoshitaka Yamaguchi ,  Taisuke Iwai ,  Shinichi Hirose ,  Daiyu Kondo ,  Ikuo Soga ,  Yohei Yagishita ,  Yukie Sakita

发明人： Yoshitaka Yamaguchi ,  Taisuke Iwai ,  Shinichi Hirose ,  Daiyu Kondo ,  Ikuo Soga ,  Yohei Yagishita ,  Yukie Sakita

IPC分类号： H05K7/20 ,  H05K13/00 ,  B32B9/00

CPC分类号： H01L23/433 ,  H01L23/373 ,  H01L23/3733 ,  H01L24/28 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/29499 ,  H01L2224/73253 ,  H01L2224/83365 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/10158 ,  H01L2924/15788 ,  H01L2924/16152 ,  Y10S977/734 ,  Y10S977/739 ,  Y10S977/742 ,  Y10T29/49002 ,  Y10T428/30 ,  Y10T428/31504 ,  H01L2924/00 ,  H01L2224/0401

摘要： The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.

摘要翻译： 电子装置包括发热体54，散热器58和设置在发热体54与散热器58之间的热辐射材料56，它包括多个碳原子线性结构12和填充层14， 热塑性树脂并且设置在多个线性结构12之间。

公开(公告)号：US20120218715A1

公开(公告)日：2012-08-30

申请号：US13307029

申请日：2011-11-30

申请人： Shinichi HIROSE ,  Taisuke Iwai ,  Yoshitaka Yamaguchi ,  Yohei Yagishita ,  Yukie Sakita ,  Masaaki Norimatsu

发明人： Shinichi HIROSE ,  Taisuke Iwai ,  Yoshitaka Yamaguchi ,  Yohei Yagishita ,  Yukie Sakita ,  Masaaki Norimatsu

IPC分类号： H05K7/20 ,  H01L21/50

CPC分类号： H01L23/433 ,  H01L21/4871 ,  H01L21/50 ,  H01L23/373 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29076 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/8336 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/15788 ,  H01L2924/16152 ,  Y10T428/24124 ,  Y10T428/24132 ,  Y10T428/24165 ,  Y10T428/24174 ,  Y10T428/2913 ,  Y10T428/30 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.

摘要翻译： 一种电子部件的制造方法，其特征在于，在第一基板的上方设置包含碳原子数的多个线状结构的热辐射材料和设置在所述多个线状结构体中的热塑性树脂填充层，在所述热辐射上设置吸墨纸 材料，在高于热塑性树脂的熔融温度的温度下进行热处理，并用吸收纸吸收多个线性结构上方的热塑性树脂，除去吸墨纸，并将散热材料粘附到第一衬底上 冷却固化热塑性树脂。

公开(公告)号：US20120325454A1

公开(公告)日：2012-12-27

申请号：US13603773

申请日：2012-09-05

申请人： Taisuke IWAI ,  Daiyu Kondo ,  Yoshitaka Yamaguchi ,  Shinichi Hirose ,  Yukie Sakita ,  Yohei Yagishita ,  Masaki Norimatsu

发明人： Taisuke IWAI ,  Daiyu Kondo ,  Yoshitaka Yamaguchi ,  Shinichi Hirose ,  Yukie Sakita ,  Yohei Yagishita ,  Masaki Norimatsu

IPC分类号： F28F21/06 ,  F28F21/08 ,  B32B37/16 ,  F28F7/00

CPC分类号： H01L23/373 ,  H01L23/3737 ,  H01L23/433 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00

摘要： A heat dissipating structure includes a heat source; a heat dissipating part disposed to oppose to the heat source; a concave portion formed in at least one of opposing surfaces of the heat source and the heat dissipating part; and a heat conducting structure comprising a filler layer of thermoplastic material disposed between the heat source and the heat dissipating part and contacting with the opposing surfaces of the heat source and the heat dissipating part, and an assembly of carbon nanotubes that are distributed in the thermoplastic material, oriented perpendicularly to the surfaces of the filler layer, contacting, at both ends, with the opposing surfaces of the heat source and the heat dissipating part, and limited its distribution in the opposing surfaces by the concave portion.

摘要翻译： 散热结构包括热源; 设置成与热源相对的散热部; 形成在所述热源和所述散热部的至少一个相对表面中的凹部; 以及导热结构，其包括设置在所述热源和所述散热部件之间并与所述热源和所述散热部件的相对表面接触的热塑性材料填充层，以及分布在所述热塑性塑料中的碳纳米管的组件 材料，其垂直于填料层的表面定向，在两端与热源和散热部分的相对表面接触，并通过凹部限制其在相对表面中的分布。

公开(公告)号：US08958207B2

公开(公告)日：2015-02-17

申请号：US13465393

申请日：2012-05-07

申请人： Yoshitaka Yamaguchi ,  Taisuke Iwai ,  Shinichi Hirose ,  Daiyu Kondo ,  Ikuo Soga ,  Yohei Yagishita ,  Yukie Sakita

发明人： Yoshitaka Yamaguchi ,  Taisuke Iwai ,  Shinichi Hirose ,  Daiyu Kondo ,  Ikuo Soga ,  Yohei Yagishita ,  Yukie Sakita

IPC分类号： H05K7/20 ,  H01L23/433 ,  H01L23/373 ,  H01L23/00

CPC分类号： H01L23/433 ,  H01L23/373 ,  H01L23/3733 ,  H01L24/28 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/29499 ,  H01L2224/73253 ,  H01L2224/83365 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/10158 ,  H01L2924/15788 ,  H01L2924/16152 ,  Y10S977/734 ,  Y10S977/739 ,  Y10S977/742 ,  Y10T29/49002 ,  Y10T428/30 ,  Y10T428/31504 ,  H01L2924/00 ,  H01L2224/0401

摘要： The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.

摘要翻译： 电子装置包括发热体54，散热器58和设置在发热体54与散热器58之间的热辐射材料56，它包括多个碳原子线性结构12和填充层14， 热塑性树脂并且设置在多个线性结构12之间。

公开(公告)号：US20120218713A1

公开(公告)日：2012-08-30

申请号：US13465393

申请日：2012-05-07

申请人： Yoshitaka Yamaguchi ,  Taisuke Iwai ,  Shinichi Hirose ,  Daiyu Kondo ,  Ikuo Soga ,  Yohei Yagishita ,  Yukie Sakita

发明人： Yoshitaka Yamaguchi ,  Taisuke Iwai ,  Shinichi Hirose ,  Daiyu Kondo ,  Ikuo Soga ,  Yohei Yagishita ,  Yukie Sakita

IPC分类号： H05K7/20 ,  B32B37/02 ,  F28F7/00

CPC分类号： H01L23/433 ,  H01L23/373 ,  H01L23/3733 ,  H01L24/28 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/29499 ,  H01L2224/73253 ,  H01L2224/83365 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/10158 ,  H01L2924/15788 ,  H01L2924/16152 ,  Y10S977/734 ,  Y10S977/739 ,  Y10S977/742 ,  Y10T29/49002 ,  Y10T428/30 ,  Y10T428/31504 ,  H01L2924/00 ,  H01L2224/0401

摘要： The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.

摘要翻译： 电子装置包括发热体54，散热器58和设置在发热体54与散热器58之间的热辐射材料56，它包括多个碳原子线性结构12和填充层14， 热塑性树脂并且设置在多个线性结构12之间。