公开(公告)号：US10546841B2

公开(公告)日：2020-01-28

申请号：US15470780

申请日：2017-03-27

申请人： The Board of Trustees of the University of Illinois

发明人： John A. Rogers ,  Ralph Nuzzo ,  Hoon-sik Kim ,  Eric Brueckner ,  Sang Il Park ,  Rak Hwan Kim

IPC分类号： H01L33/32 ,  H01L25/075 ,  H01L21/683 ,  H01L23/00 ,  H01L33/00 ,  H01L25/00 ,  H01L33/48 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62

摘要： Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.

公开(公告)号：US09647171B2

公开(公告)日：2017-05-09

申请号：US14479100

申请日：2014-09-05

申请人： The Board of Trustees of the University of Illinois

发明人： John A. Rogers ,  Ralph Nuzzo ,  Hoon-sik Kim ,  Eric Brueckner ,  Sang Il Park ,  Rak Hwan Kim

IPC分类号： H01L33/50 ,  H01L33/00 ,  H01L25/075 ,  H01L23/00 ,  H01L21/683 ,  H01L25/00 ,  H01L33/48 ,  H01L33/54 ,  H01L33/62

CPC分类号： H01L25/0753 ,  H01L21/6835 ,  H01L24/83 ,  H01L24/95 ,  H01L25/50 ,  H01L33/0079 ,  H01L33/32 ,  H01L33/486 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68386 ,  H01L2224/8312 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/95085 ,  H01L2924/01322 ,  H01L2924/05432 ,  H01L2924/06 ,  H01L2924/12033 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/13063 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2933/0041 ,  H01L2933/005 ,  Y10S438/977 ,  H01L2924/00

摘要： Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.