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公开(公告)号：US06794109B2
公开(公告)日：2004-09-21
申请号：US09791252
申请日：2001-02-23
IPC分类号： G03F7004
CPC分类号： G03F7/0392 , G03F7/0046 , Y10S430/108 , Y10S430/115
摘要： The present invention provides photoresist materials for use in photolithography at wavelengths less than about 248 nm. More particularly, the photoresists of the invention are particularly suited for use in 157 nm lithography. A photoresist composition of the invention includes a polymer having at least one monomeric unit having an aromatic moiety. The monomeric unit further includes at least a group, such as an electron withdrawing group, attached to the aromatic moiety. The attached group includes at least one CF bond. The polymer further includes an acidic hydroxyl group. A photoresist composition of the invention can have an absorbance in a range of 1-5 &mgr;m−1 at 157 nm, rendering it particularly suitable for use as a single layer resist in 157 nm lithography.
摘要翻译： 本发明提供了在波长小于约248nm的光刻中使用的光刻胶材料。 更具体地说，本发明的光致抗蚀剂特别适用于157nm光刻。 本发明的光致抗蚀剂组合物包括具有至少一个具有芳族部分的单体单元的聚合物。 单体单元还包括至少一个与芳族部分连接的基团，例如吸电子基团。 所附组包括至少一个CF键。 聚合物还包括酸性羟基。 本发明的光致抗蚀剂组合物可以在157nm处具有在1-5mum -1的范围内的吸光度，使其特别适合用作157nm光刻中的单层抗蚀剂。
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公开(公告)号：US5212046A
公开(公告)日：1993-05-18
申请号：US725872
申请日：1991-06-28
申请人： Angelo A. Lamola , Gary Calabrese , Roger Sinta
发明人： Angelo A. Lamola , Gary Calabrese , Roger Sinta
CPC分类号： G03F7/038 , G03F7/0045 , Y10S430/121 , Y10S430/123 , Y10S430/126 , Y10S430/127
摘要： A photoacid-generating photoresist composition sensitized with an aromatic, multi-ring, heterocylcic nitrogen containing sensitizer, preferably a ring extended phenothiazine derivative. The use of the sensitizer permits exposure of photoresists to near UV irradiation where such photoresists have heretofore been exposed to deep UV irradiation. The invention is especially useful for acid hardening photoresist systems.
摘要翻译： 一种产生光致酸的光致抗蚀剂组合物，其用芳族，多环，杂环状含氮增感剂，优选环延长吩噻嗪衍生物敏化。 敏化剂的使用允许光致抗蚀剂暴露于近紫外线照射下，其中这种光致抗蚀剂迄今为止已经暴露于深紫外线照射。 本发明特别适用于酸硬化光致抗蚀剂体系。
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公开(公告)号：US20190339613A1
公开(公告)日：2019-11-07
申请号：US16404234
申请日：2019-05-06
申请人： Jeremy Golden , Gerard Gomes , Roger Sinta , Sha Liu , Michael Cronin
发明人： Jeremy Golden , Gerard Gomes , Roger Sinta , Sha Liu , Michael Cronin
摘要： Disclosed herein is a photosensitive composition that includes: a novolak polymer; one or more crosslinkers; photoacid generator; and a hydroxybenzophenone compound having the general structure (I) wherein m is 0 to 3 and n is 0 to 4 and m+n may be 0 to 5
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公开(公告)号：US20070292072A1
公开(公告)日：2007-12-20
申请号：US11424412
申请日：2006-06-15
IPC分类号： G02B6/12
CPC分类号： B23K35/262 , B23K35/3013 , C22C5/02 , C22C13/00 , C22C28/00 , H01L51/5246
摘要： Lead-free solder compositions for bonding and sealing flat panel displays, CCD's, solar cells, light emitting diodes, and other optoelectronic devices are disclosed. The solders are based on alloys of Sn, Au, Ag, and Cu and one or more rare earth metals chosen from the following, Y, La, Ce, Pr, Sc, Sm, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu. Optionally, the compositions may comprise In, Bi, or Zn. The solder compositions exhibit superior bonding capability in joining dissimilar surfaces such as those present in both the flat panel display and light emitting devices. Additionally the solders provide a strong barrier to the diffusion of both water and oxygen into these devices thus promoting longer device life times.
摘要翻译： 公开了用于粘合和密封平板显示器，CCD，太阳能电池，发光二极管和其它光电子器件的无铅焊料组合物。 焊料基于Sn，Au，Ag和Cu的合金以及一种或多种稀土金属，其选自以下Y，La，Ce，Pr，Sc，Sm，Gd，Tb，Dy，Ho，Er，Tm ，Yb和Lu。 任选地，组合物可以包含In，Bi或Zn。 焊料组合物在接合不同的表面（例如平板显示器和发光器件中存在的那些表面）中表现出优异的接合能力。 此外，焊料为水和氧气扩散到这些器件中提供了强大的屏障，从而延长了器件寿命。
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5.发明授权Radiation sensitive composition comprising polymer having inert blocking groups 失效包含具有惰性封闭基团的聚合物的辐射敏感性组合物
公开(公告)号：US5514520A
公开(公告)日：1996-05-07
申请号：US405800
申请日：1995-03-16
CPC分类号： G03F7/0045 , Y10S430/106
摘要： A photoresist composition consisting of an acid or base generator, a crosslinking agent activated in the presence of an acid or base and an alkali soluble resin, preferably a phenolic resin, having a portion of its phenolic hydroxyl groups reacted to form a blocking group inert to acid or base. The presence of the inert blocking group enables development of an exposed photoresist with a strong developer without formation of microbridges between fine line features.
摘要翻译： 由酸或碱发生剂，在酸或碱存在下活化的交联剂和碱溶性树脂（优选酚醛树脂）组成的光致抗蚀剂组合物，其酚酚羟基的一部分反应形成对于 酸或碱。 惰性阻挡基团的存在使得能够用强显影剂显影曝光的光致抗蚀剂，而不会在细线特征之间形成微桥。
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6.发明授权Photoresist and method for forming a relief image utilizing composition with copolymer binder having a major proportion of phenolic units and a minor proportion of non-aromatic cyclic alcoholic units 失效光致抗蚀剂和利用具有主要比例的酚单元的共聚物粘合剂和少量非芳族环状醇单元的组合物形成浮雕图像的方法
公开(公告)号：US5210000A
公开(公告)日：1993-05-11
申请号：US832004
申请日：1992-02-06
申请人： James Thackeray , George W. Orsula , Roger Sinta
发明人： James Thackeray , George W. Orsula , Roger Sinta
CPC分类号： G03F7/0295 , G03F7/0233 , G03F7/038 , Y10S430/106 , Y10S430/11
摘要： A photoresist that utilizes a copolymer of a phenol and a cyclic alcohol having increased optical transmission properties relative to photoresists using fully aromatic phenolic resins. Preferred binders are hydrogenated novolak resins and hydrogenated polyvinyl phenol resins.
摘要翻译： 相对于使用完全芳族酚醛树脂的光致抗蚀剂，利用苯酚和环状醇的共聚物的光致抗蚀剂具有增强的光学透射性能。 优选的粘合剂是氢化酚醛清漆树脂和氢化聚乙烯基苯酚树脂。
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公开(公告)号：US20090014746A1
公开(公告)日：2009-01-15
申请号：US11776378
申请日：2007-07-11
CPC分类号： C22C5/02 , C22C5/06 , C22C13/00 , C22C28/00 , H01L33/62 , H01L2224/48091 , H01L2924/01322 , H01L2924/12044 , H01L2924/1461 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： Lead-free solder compositions for bonding and sealing flat panel displays, CCD's, solar cells, light emitting diodes, and other optoelectronic devices are disclosed. The solders are based on alloys of Sn, Au, Ag, and Cu and one or more rare earth metals chosen from the following, Y, La, Ce, Pr, Sc, Sm, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu. Optionally, the compositions may comprise In, Bi, or Zn. The solder compositions exhibit superior bonding capability in joining dissimilar surfaces such as those present in both the flat panel display and light emitting devices. Additionally the solders provide a strong barrier to the diffusion of both water and oxygen into these devices thus promoting longer device life times.
摘要翻译： 公开了用于粘合和密封平板显示器，CCD，太阳能电池，发光二极管和其它光电子器件的无铅焊料组合物。 焊料基于Sn，Au，Ag和Cu的合金以及一种或多种稀土金属，其选自以下Y，La，Ce，Pr，Sc，Sm，Gd，Tb，Dy，Ho，Er，Tm ，Yb和Lu。 任选地，组合物可以包含In，Bi或Zn。 焊料组合物在接合不同的表面（例如平板显示器和发光器件中存在的那些表面）中表现出优异的接合能力。 此外，焊料为水和氧气扩散到这些器件中提供了强大的屏障，从而延长了器件寿命。
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8.发明授权Radiation sensitive compositions comprising polymer having acid labile groups 失效包含具有酸不稳定基团的聚合物的辐射敏感组合物
公开(公告)号：US5362600A
公开(公告)日：1994-11-08
申请号：US78654
申请日：1993-05-25
申请人： Roger Sinta , Richard C. Hemond , David R. Medeiros , Martha M. Rajaratnam , James W. Thackeray , Dianne Canistro
发明人： Roger Sinta , Richard C. Hemond , David R. Medeiros , Martha M. Rajaratnam , James W. Thackeray , Dianne Canistro
IPC分类号： G03F7/004 , G03F7/022 , G03F7/023 , G03F7/029 , G03F7/032 , G03F7/039 , G03F7/20 , H01L21/027 , G03C1/54 , G03C5/58
CPC分类号： G03F7/0233 , G03F7/0045 , G03F7/039 , Y10S430/106 , Y10S430/11
摘要： The invention provides a radiation sensitive composition having a polymer binder of phenolic and cyclic alcohol units. At least a portion of the phenolic units and/or cyclic alcohol units of the polymer are bonded to acid labile groups. High solubility differentials between exposed and unexposed regions are realized with only moderate substitution of the binder with the acid labile groups.
摘要翻译： 本发明提供一种具有酚和环醇单元的聚合物粘合剂的辐射敏感组合物。 聚合物的至少一部分酚单元和/或环醇单元与酸不稳定基团键合。 曝光和未曝光区域之间的高溶解度差异仅通过粘合剂与酸不稳定基团的适度取代来实现。
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公开(公告)号：US08945677B2
公开(公告)日：2015-02-03
申请号：US13358462
申请日：2012-01-25
申请人： Nicholas A. Zafiropoulos , Paul Nahass , Roxana Trifu , Redouane Begag , Wendell E. Rhine , Wenting Dong , Shannon White , George L. Gould , Alaric Naiman , Roger Sinta
发明人： Nicholas A. Zafiropoulos , Paul Nahass , Roxana Trifu , Redouane Begag , Wendell E. Rhine , Wenting Dong , Shannon White , George L. Gould , Alaric Naiman , Roger Sinta
IPC分类号： B05D3/10 , H01L21/02 , H01L21/3105 , C08L79/08
CPC分类号： H01L23/5329 , C08L79/08 , H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02282 , H01L21/31058 , H01L2924/0002 , H01L2924/00
摘要： Materials and methods for manufacturing electronic devices and semiconductor components using low dielectric materials comprising polyimide based aerogels are described. Additional methods for manipulating the properties of the dielectric materials and affecting the overall dielectric property of the system are also provided.
摘要翻译： 描述了使用包含聚酰亚胺基气凝胶的低介电材料制造电子器件和半导体部件的材料和方法。 还提供了用于操纵介电材料的性质并影响系统的整体介电性能的附加方法。
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公开(公告)号：US20120189782A1
公开(公告)日：2012-07-26
申请号：US13358462
申请日：2012-01-25
申请人： Nicholas A Zafiropoulos , Paul Nahass , Roxana Trifu , Redouane Begag , Wendell E Rhine , Wenting Dong , Shannon White , George L Gould , Alaric Naiman , Roger Sinta
发明人： Nicholas A Zafiropoulos , Paul Nahass , Roxana Trifu , Redouane Begag , Wendell E Rhine , Wenting Dong , Shannon White , George L Gould , Alaric Naiman , Roger Sinta
CPC分类号： H01L23/5329 , C08L79/08 , H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02282 , H01L21/31058 , H01L2924/0002 , H01L2924/00
摘要： Materials and methods for manufacturing electronic devices and semiconductor components using low dielectric materials comprising polyimide based aerogels are described. Additional methods for manipulating the properties of the dielectric materials and affecting the overall dielectric property of the system are also provided.
摘要翻译： 描述了使用包含聚酰亚胺基气凝胶的低介电材料制造电子器件和半导体部件的材料和方法。 还提供了用于操纵介电材料的性质并影响系统的整体介电性能的附加方法。
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