摘要:
Materials and methods for manufacturing electronic devices and semiconductor components using low dielectric materials comprising polyimide based aerogels are described. Additional methods for manipulating the properties of the dielectric materials and affecting the overall dielectric property of the system are also provided.
摘要:
Disclosed and claimed herein are hybrid aerogels which are compositions of tetraalkoxysilanes and bis-(trialkoxysilyl)imides that exhibit low thermal conductivities and high compressive strengths. Methods for their preparation are also provided.
摘要:
The invention provides reinforced aerogel monoliths as well as reinforced composites thereof for a variety of uses. Compositions and methods of preparing the monoliths and composites are also provided. Application of these materials in transparent assemblies is also discuss.
摘要:
Disclosed and claimed herein are hybrid silica aerogels containing non-polymeric, functional organic materials covalently bonded at one or both ends to the silica network of the aerogels through a C—Si bond between a carbon atom of the organic material and a silicon atom of the aerogel network. Methods of their preparation are also disclosed.
摘要:
Aerogel materials, aerogel composites and the like may be improved by enhancing their smoke suppression, combustion reduction properties. It is additionally useful to provide aerogel based composites compatible with environments conducive to combustion. Such aerogel materials and methods of manufacturing the same are described.
摘要:
The degree of wear metal contamination in an oil is determined by treating a sample of the oil with a mixture of HF/HCl/nitric acid, diluting the oil/acid mixture with a solvent mixture consisting of a nonionic surfactant and a diluent, and spectrometrically analyzing the resulting diluted mixture. Severe wear in an oil wetted apparatus may be detected by directly analyzing spectrometrically a sample of the oil and comparing the results of such analysis with the results obtained according to the acid dissolution method described above.
摘要:
Aerogel materials, aerogel composites and the like may be improved by enhancing their smoke suppression, combustion reduction properties. It is additionally useful to provide aerogel based composites compatible with environments conducive to combustion. Such aerogel materials and methods of manufacturing the same are described.
摘要:
Sulfur is removed from a hydrocarbon fuel via contact with a desulfurization agent; the desulfurization agent is then regenerated (wherein sulfur is released) by exposing it to oxygen. The sulfur removal and regeneration processes each can be carried out at relatively moderate temperatures, e.g., from 300 to 600° C., and pressure, e.g., about 0.79 to about 3.5 MPa; and the desulfurization agent can include a transition metal oxide, such as molybdenum oxide. The process can also include the additional steps of cracking the hydrocarbon, separating high-boiling and low-boiling fractions from the reaction product and contacting the lower-boiling fraction with a secondary desulfurization agent.
摘要:
An apparatus for processing hydrocarbon fuel (e.g., gasoline, kerosene, jet fuel, diesel and heating oil) to generate hydrogen (H2), which can be used in fuel cells, includes a desulfurization reactor for removing sulfur from the fuel; a catalytic reactor for forming a reformate from the fuel; and, optionally, a separator for separating a light fraction of the fuel from a heavy fraction of the fuel. The fuel is first exposed to the desulfurization reactor and then, if present, to the separator. Finally, the fuel is exposed to the catalyst in the catalytic reactor; and the hydrogen gas generated there from is collected for use in the fuel cell.
摘要:
An electronic device package is provided, consisting of reaction bonded silicon nitride structural and dielectric components and conductor, resistor, and capacitor elements positioned with the package structural components. The package consists of a ceramic package base characterized by a dielectric constant less than 6, of reaction bonded silicon nitride, or a heat spreader material. An electrical conductor is positioned on, embedded in, or attached to the package base for making electrical contact to an electronic device supported on the base and in preferred embodiments, a resistor is attached to the package base. The invention also provides package sidewalls connected to the package base, preferably of reaction bonded silicon nitride, and at least one electrical conductor extending to an outside surface of the package sidewalls for making electrical contact to an electronic device supported by the package base. The reaction formed electronic device packages of the invention provide the ability to support high device signal frequencies, high device operational temperatures, and high environmental temperatures, due to the characteristics of the package materials. The reaction formed electronic device packages of the invention may be produced with a nitriding process during which the overall package structure exhibits minimal shrinkage. As a result, the reaction formed electronic device packages of the invention may be shaped to finished dimensions before the nitriding process with complicated and tight-tolerance geometries of package structural, conducting, resistive, and capacitive components.