公开(公告)号：US20110181797A1

公开(公告)日：2011-07-28

申请号：US13061336

申请日：2009-09-01

申请人： Tigran Galstian ,  Derek Alexandre Proudian ,  Behram Afshari ,  Michael J. Nystrom ,  Peter Clark

发明人： Tigran Galstian ,  Derek Alexandre Proudian ,  Behram Afshari ,  Michael J. Nystrom ,  Peter Clark

IPC分类号： G02F1/1335

CPC分类号： G02F1/133351 ,  G02F1/133526 ,  G02F1/13471 ,  G02F2001/13312 ,  G02F2001/294

摘要： Liquid crystal optoelectronic devices are produced by fabricating a wafer-level component structure and affixing a plurality of discrete components to a surface structure prior to singulating the individual devices therefrom. After singulation, the individual devices include a portion of the wafer-level fabricated structure and at least of the discrete components. The wafer-level structure may include a liquid crystal and controlling electrodes, and the discrete components may include fixed lenses or image sensors. The discrete components may be located on either or both of two sides of the wafer-level structure. Multiple liquid crystal layers may be used to reduce nonuniformities in the interaction with light from different angles, and to control light of different polarizations. The liquid crystal devices may function as optoelectronic devices such as tunable lenses, shutters or diaphragms.

摘要翻译： 液晶光电子器件通过制造晶片级元件结构，并在将单个器件从单元中分离出之前将多个分立元件固定在表面结构上。 在分离之后，各个器件包括晶片级制造结构的一部分和至少分立元件。 晶片级结构可以包括液晶和控制电极，并且分立元件可以包括固定透镜或图像传感器。 分立组件可以位于晶片级结构的两侧中的任一侧或两侧。 可以使用多个液晶层来减少与来自不同角度的光的相互作用中的不均匀性，并且控制不同偏振的光。 液晶装置可以用作光电器件，例如可调透镜，快门或隔膜。

公开(公告)号：US20130250197A1

公开(公告)日：2013-09-26

申请号：US13822898

申请日：2011-09-21

申请人： Behzad Khodadad ,  Michael J. Nystrom ,  Bahram Afshari ,  Karen Asatryan ,  Tigran Galstian

发明人： Behzad Khodadad ,  Michael J. Nystrom ,  Bahram Afshari ,  Karen Asatryan ,  Tigran Galstian

IPC分类号： G02F1/133

CPC分类号： G02F1/13306 ,  G02F2203/60

摘要： A tunable liquid crystal optical device is described. The optical device has an electrode arrangement associated with a liquid crystal cell and includes a hole patterned electrode, wherein control of the liquid crystal cell depends on electrical characteristics of liquid crystal optical device layers. The optical device further has a circuit for measuring said electrical characteristics of the liquid crystal optical device layers, and a drive signal circuit having at least one parameter adjusted as a function of the measured electrical characteristics. The drive signal circuit generates a control signal for the electrode arrangement.

摘要翻译： 描述了可调谐液晶光学器件。 光学器件具有与液晶单元相关联的电极布置，并且包括孔图案化电极，其中液晶单元的控制取决于液晶光学器件层的电特性。 光学装置还具有用于测量液晶光学器件层的所述电特性的电路，以及具有根据所测量的电特性调整的至少一个参数的驱动信号电路。 驱动信号电路产生用于电极装置的控制信号。

公开(公告)号：US09140920B2

公开(公告)日：2015-09-22

申请号：US13504529

申请日：2010-10-27

申请人： Bahram Afshari ,  Karen Asatryan ,  Peter P. Clark ,  Tigran Galstian ,  Michael J. Nystrom ,  Vladimir Presniakov ,  Sergei Yakovenko ,  Armen Zohrabyan

发明人： Bahram Afshari ,  Karen Asatryan ,  Peter P. Clark ,  Tigran Galstian ,  Michael J. Nystrom ,  Vladimir Presniakov ,  Sergei Yakovenko ,  Armen Zohrabyan

IPC分类号： G02F1/13 ,  G02F1/1333 ,  G09G3/00

CPC分类号： G02F1/133351 ,  G01R1/071 ,  G02F1/1309 ,  G09G3/006 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49771

摘要： Methods and apparatus for testing operation of a single or multiple tunable active optical device(s) operated by one or more driving electrodes are described Test methods and apparatus are provided for device testing without necessarily requiring direct physical contact with the driving electrodes Testing subjects devices to incident light along an optical path and to an external electric field applied to the device producing a dipolar charge distribution within the electrodes, causing the device to operate The effect of device operation on incident light is optically sensed The sensed effect is analyzed to identify device defects Test methods and apparatus are provided for testing multiple unsingulated devices during fabrication employing a strip contact structure having contact strips connected to multiple devices and extending to wafer edges, such that singulating devices leaves portions of the strip contact structure exposed on device dice edges providing electrical contacts in use.

摘要翻译： 用于测试由一个或多个驱动电极操作的单个或多个可调谐有源光学器件的操作的方法和装置描述测试方法和装置被提供用于器件测试，而不一定要求与驱动电极直接物理接触测试主体器件 沿着光路的入射光和施加到器件的外部电场，在电极内产生双极电荷分布，导致器件工作。光学感测器件对入射光的操作效果分析感测效应以识别器件缺陷 提供了测试方法和装置，用于在制造过程中测试多个不起毛的装置，使用具有连接到多个装置并且延伸到晶片边缘的接触条的带状接触结构，使得分离装置离开条形接触结构的暴露于器件骰子边缘的部分， 正在使用 。

公开(公告)号：US09239479B2

公开(公告)日：2016-01-19

申请号：US13822898

申请日：2011-09-21

申请人： Behzad Khodadad ,  Michael J. Nystrom ,  Bahram Afshari ,  Karen Asatryan ,  Tigran Galstian

发明人： Behzad Khodadad ,  Michael J. Nystrom ,  Bahram Afshari ,  Karen Asatryan ,  Tigran Galstian

IPC分类号： G02F1/133

CPC分类号： G02F1/13306 ,  G02F2203/60

摘要： A tunable liquid crystal optical device is described. The optical device has an electrode arrangement associated with a liquid crystal cell and includes a hole patterned electrode, wherein control of the liquid crystal cell depends on electrical characteristics of liquid crystal optical device layers. The optical device further has a circuit for measuring said electrical characteristics of the liquid crystal optical device layers, and a drive signal circuit having at least one parameter adjusted as a function of the measured electrical characteristics. The drive signal circuit generates a control signal for the electrode arrangement.

摘要翻译： 描述了可调谐液晶光学器件。 光学器件具有与液晶单元相关联的电极布置，并且包括孔图案化电极，其中液晶单元的控制取决于液晶光学器件层的电特性。 光学装置还具有用于测量液晶光学器件层的所述电特性的电路，以及具有根据所测量的电特性调整的至少一个参数的驱动信号电路。 驱动信号电路产生用于电极装置的控制信号。

公开(公告)号：US20130033673A1

公开(公告)日：2013-02-07

申请号：US13504529

申请日：2010-10-27

申请人： Bahram Afshari ,  Karen Asatryan ,  Peter P. Clark ,  Tigran Galstian ,  Michael J. Nystrom ,  Vladimir Presniakov ,  Sergei Yakovenko ,  Armen Zohrabyan

发明人： Bahram Afshari ,  Karen Asatryan ,  Peter P. Clark ,  Tigran Galstian ,  Michael J. Nystrom ,  Vladimir Presniakov ,  Sergei Yakovenko ,  Armen Zohrabyan

IPC分类号： G02F1/1333 ,  H05K13/00 ,  G01R31/00 ,  G02B7/00

CPC分类号： G02F1/133351 ,  G01R1/071 ,  G02F1/1309 ,  G09G3/006 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49771

摘要： Methods and apparatus for testing operation of a single or multiple tunable active optical device(s) operated by one or more driving electrodes are described Test methods and apparatus are provided for device testing without necessarily requiring direct physical contact with the driving electrodes Testing subjects devices to incident light along an optical path and to an external electric field applied to the device producing a dipolar charge distribution within the electrodes, causing the device to operate The effect of device operation on incident light is optically sensed The sensed effect is analyzed to identify device defects Test methods and apparatus are provided for testing multiple unsingulated devices during fabrication employing a strip contact structure having contact strips connected to multiple devices and extending to wafer edges, such that singulating devices leaves portions of the strip contact structure exposed on device dice edges providing electrical contacts in use.

摘要翻译： 用于测试由一个或多个驱动电极操作的单个或多个可调谐有源光学器件的操作的方法和装置描述测试方法和装置被提供用于器件测试，而不一定要求与驱动电极直接物理接触测试主体器件 沿着光路的入射光和施加到器件的外部电场，在电极内产生双极电荷分布，导致器件工作。光学感测器件对入射光的操作效果分析感测效应以识别器件缺陷 提供了测试方法和装置，用于在制造过程中测试多个不起毛的装置，使用具有连接到多个装置并且延伸到晶片边缘的接触条的带状接触结构，使得分离装置离开条形接触结构的暴露于器件骰子边缘的部分， 正在使用 。

公开(公告)号：US20080165519A1

公开(公告)日：2008-07-10

申请号：US11650356

申请日：2007-01-05

申请人： Michael J. Nystrom ,  Giles Humpston

发明人： Michael J. Nystrom ,  Giles Humpston

IPC分类号： B23P17/04 ,  H05K7/04

CPC分类号： H01B13/00 ,  H01L23/10 ,  H01L2224/48091 ,  H01L2224/48463 ,  Y10T29/49126 ,  Y10T156/1062 ,  Y10T156/1092 ,  H01L2924/00014

摘要： A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.

摘要翻译： 形成微电子组件的方法包括将支撑结构定位在与器件的有源区相邻但不延伸到有源区上。 支撑结构具有平面部分。 每个平面部分具有基本均匀的组成。 至少一个平面部分的组成不同于其它平面部分中的至少一个的组成。 盖子定位成与支撑结构接触并在有源区域上延伸。 支撑结构结合到装置和盖子上。

公开(公告)号：US06958446B2

公开(公告)日：2005-10-25

申请号：US10124166

申请日：2002-04-17

申请人： Giles Humpston ,  Yoshikatsu Ichimura ,  Nancy M. Mar ,  Daniel J. Miller ,  Michael J. Nystrom ,  Heidi L. Reynolds ,  Gary R. Trott

发明人： Giles Humpston ,  Yoshikatsu Ichimura ,  Nancy M. Mar ,  Daniel J. Miller ,  Michael J. Nystrom ,  Heidi L. Reynolds ,  Gary R. Trott

IPC分类号： G02B26/08 ,  B23K1/00 ,  B23K35/26 ,  G02B6/12 ,  G02B6/35 ,  G02B6/36 ,  G02B6/42 ,  H01J5/00 ,  H05K5/06

CPC分类号： G02B6/12 ,  B23K1/0016 ,  B23K35/26 ,  B23K2101/40 ,  B23K2103/18 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56 ,  G02B6/3512 ,  G02B6/3582 ,  G02B6/36 ,  G02B6/4248 ,  G02B2006/12104

摘要： A solder joint or seal attaching components having dissimilar coefficients of thermal expansion is made thin (e.g., less than 20 μm and preferably about 5 μm) and of a solder such as an indium-based solder that has a tendency to creep. The solder is toroidal or otherwise shaped to avoid tensile stress in the solder. Axial shearing stress in the solder causes reversible creep without causing failure of the joint or seal. In one embodiment, a toroidal solder seal has a diameter, a footprint, and a thickness in approximate proportions of 5000:200:1.

摘要翻译： 具有不同的热膨胀系数的焊接接头或密封件附接部件被制成薄（例如，小于20μm，优选约5μm）以及具有蠕变趋势的诸如铟基焊料的焊料。 焊料是环形或其他形状，以避免焊料中的拉伸应力。 焊料中的轴向剪切应力引起可逆蠕变，而不会导致接头或密封件的故障。 在一个实施例中，环形焊接密封件的直径，占地面积和厚度约为5000：200：1。

公开(公告)号：US07936062B2

公开(公告)日：2011-05-03

申请号：US11655777

申请日：2007-01-19

申请人： Giles Humpston ,  Michael J. Nystrom ,  Vage Oganesian ,  Yulia Aksenton ,  Osher Avsian ,  Robert Burtzlaff ,  Avi Dayan ,  Andrey Grinman ,  Felix Hazanovich ,  Ilya Hecht ,  Charles Rosenstein ,  David Ovrutsky ,  Mitchell Hayes Reifel

发明人： Giles Humpston ,  Michael J. Nystrom ,  Vage Oganesian ,  Yulia Aksenton ,  Osher Avsian ,  Robert Burtzlaff ,  Avi Dayan ,  Andrey Grinman ,  Felix Hazanovich ,  Ilya Hecht ,  Charles Rosenstein ,  David Ovrutsky ,  Mitchell Hayes Reifel

IPC分类号： H01L23/12

CPC分类号： B81C1/00269 ,  B81C2203/0118 ,  H01L21/50 ,  H01L23/10 ,  H01L24/48 ,  H01L24/73 ,  H01L27/14618 ,  H01L27/14687 ,  H01L31/0203 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Packaged microelectronic elements are provided. In an exemplary embodiment, a microelectronic element having a front face and a plurality of peripheral edges bounding the front face has a device region at the front face and a contact region with a plurality of exposed contacts adjacent to at least one of the peripheral edges. The packaged element may include a plurality of support walls overlying the front face of the microelectronic element such that a lid can be mounted to the support walls above the microelectronic element. For example, the lid may have an inner surface confronting the front face. In a particular embodiment, some of the contacts can be exposed beyond edges of the lid.

摘要翻译： 提供封装的微电子元件。 在一个示例性实施例中，具有前表面和限定前表面的多个周边边缘的微电子元件在前表面具有一个器件区域，以及一个接触区域与多个暴露的接触件相邻，至少一个周边边缘。 封装元件可以包括覆盖微电子元件的前表面的多个支撑壁，使得盖可以安装到微电子元件上方的支撑壁上。 例如，盖可以具有面向正面的内表面。 在一个具体实施例中，一些触点可以暴露在盖的边缘之外。

公开(公告)号：US20080296709A1

公开(公告)日：2008-12-04

申请号：US11809213

申请日：2007-05-30

申请人： Belgacem Haba ,  Charles White ,  Michael J. Nystrom

发明人： Belgacem Haba ,  Charles White ,  Michael J. Nystrom

IPC分类号： H01L29/84 ,  H01L21/58

CPC分类号： H01L21/50 ,  H01L23/16 ,  H01L23/3114 ,  H01L24/81 ,  H01L2223/6677 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/16235 ,  H01L2924/166 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention provides an integrated circuit chip assembly and a method of manufacturing the same. The assembly includes a package element having a top surface and an integrated circuit chip having a top surface, a bottom surface, edge surface between the top and bottom surfaces, and contacts exposed at the top surface. The package element is disposed below the chip with the top surface of the package element facing toward the bottom surface of the chip. At least one spacer element resides between the top surface of the package element and the bottom surface of the chip. According to one embodiment, the at least one spacer element may form a substantially closed cavity between the package element and the integrated circuit chip. According to another embodiment, first conductive features may extend from the contacts of the chip along the top surface, and at least some of said first conductive features extend along at least one of the edge surfaces of the chip.

摘要翻译： 本发明提供一种集成电路芯片组件及其制造方法。 组件包括具有顶表面的封装元件和集成电路芯片，其具有顶表面，底表面，顶表面和底表面之间的边缘表面以及暴露在顶表面处的触点。 封装元件设置在芯片的下方，封装元件的顶表面朝向芯片的底表面。 至少一个间隔元件位于封装元件的顶表面和芯片的底表面之间。 根据一个实施例，所述至少一个间隔元件可以在封装元件和集成电路芯片之间形成基本封闭的空腔。 根据另一个实施例，第一导电特征可以沿着顶表面从芯片的触点延伸，并且至少一些所述第一导电特征沿芯片的至少一个边缘表面延伸。

公开(公告)号：US07453139B2

公开(公告)日：2008-11-18

申请号：US11318815

申请日：2005-12-27

申请人： Michael J. Nystrom ,  Belgacem Haba ,  Giles Humpston

发明人： Michael J. Nystrom ,  Belgacem Haba ,  Giles Humpston

IPC分类号： H01L21/44 ,  H01L23/495

CPC分类号： H01L23/3114 ,  H01L23/525 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00

摘要： A compliant structure is provided on a semiconductor wafer. The compliant structure includes cavities. The compliant structure and the wafer seal the cavities during process steps used to form conductive elements on the compliant structure. After processing, vents are opened to connect the cavities to the exterior of the assembly. The vents may be formed by severing the wafer and compliant structure to form individual units, so that the severance planes intersect channels or other voids communicating with the cavities. Alternatively, the vents may be formed by forming holes in the compliant structure, or by opening bores extending through the wafer.

摘要翻译： 在半导体晶片上提供柔性结构。 顺应结构包括腔。 顺应结构和晶片在用于在柔性结构上形成导电元件的工艺步骤期间密封空腔。 处理后，通风口打开，将空腔连接到组件的外部。 通孔可以通过切断晶片和柔顺结构以形成单独的单元而形成，使得分离平面与通道或与空腔连通的其它空隙相交。 或者，可以通过在柔性结构中形成孔或通过打开延伸穿过晶片的孔而形成通气口。