摘要:
An apparatus and method is provided to dry veneer or other items by vaporization of moisture in the item. Apparatus has an insulated chamber with a frame and a drawer with a door. A mesh surface of the drawer supports item for drying with a heater at sub-atmospheric pressure inside of the chamber. Item is placed on the layer of mesh of the drawer of the apparatus and secured with fasteners such as another layer of mesh. The drawer with fastened item is placed into the chamber of the apparatus. With the drawer fully engaged within the chamber, the drying apparatus is closed with an airtight seal. A pump draws a vacuum in the chamber and heat is directed at the item to raise the temperature of the item to less than 160° F., particularly between 120° F. to 150° F. Apparatus can dry veneer in less than five minutes.
摘要:
An apparatus and method is provided to dry veneer or other items by vaporization of moisture in the item. Apparatus has an insulated chamber with a frame and a drawer with a door. A mesh surface of the drawer supports item for drying with a heater at sub-atmospheric pressure inside of the chamber. Item is placed on the layer of mesh of the drawer of the apparatus and secured with fasteners such as another layer of mesh. The drawer with fastened item is placed into the chamber of the apparatus. With the drawer fully engaged within the chamber, the drying apparatus is closed with an airtight seal. A pump draws a vacuum in the chamber and heat is directed at the item to raise the temperature of the item to less than 160° F., particularly between 120° F. to 150° F. Apparatus can dry veneer in less than five minutes.
摘要:
A heating apparatus or platen is provided with a heating surface adjacent a heat exchange fluid area defined by the heating surface attached by side walls and end plates to a retainer plate. A flow through system pumps heat exchange fluid through a platen with holes in end plates. Optional walls partition the heat exchange fluid area into flow channels in the platen. An alternative circulating flow system circulates heat exchange fluid in a closed platen with solid end plates. A u-shaped wall and at least one internal wall create a continuous fluid flow channel inside the closed platen. Flow systems pump a heat exchange fluid through heat exchange fluid area for heating by at least one internal heating element within the platen. The temperature of the heat exchange fluid remains relatively constant as it passes through the platen from heat conduction by the internal heating elements.
摘要:
A heating apparatus or platen is provided with a heating surface adjacent a heat exchange fluid area defined by the heating surface attached by side walls and end plates to a retainer plate. A flow through system pumps heat exchange fluid through a platen with holes in end plates. Optional walls partition the heat exchange fluid area into flow channels in the platen. An alternative circulating flow system circulates heat exchange fluid in a closed platen with solid end plates. A u-shaped wall and at least one internal wall create a continuous fluid flow channel inside the closed platen. Flow systems pump a heat exchange fluid through heat exchange fluid area for heating by at least one internal heating element within the platen. The temperature of the heat exchange fluid remains relatively constant as it passes through the platen from heat conduction by the internal heating elements.
摘要:
The present invention relates to systems and methods for administering combination annuity products and to combination annuity products themselves. Certain embodiments of the invention can be used in connection with variable universal life insurance and variable life insurance contracts.
摘要:
Depletion drain-extended MOS transistor devices and fabrication methods for making the same are provided, in which a compensated channel region is provided with p and n type dopants to facilitate depletion operation at Vgs=0, and an adjust region is implanted in the substrate proximate the channel side end of the thick gate dielectric structure for improved breakdown voltage rating. The compensated channel region is formed by overlapping implants for an n-well and a p-well, and the adjust region is formed using a Vt adjust implant with a mask exposing the adjust region.
摘要:
Transgenic seed for crops with improved traits are provided by trait-improving recombinant DNA where plants grown from such transgenic seed exhibit one or more improved traits as compared to a control plant. Of particular interest are transgenic plants that have increased yield. The present invention also provides recombinant DNA molecules for expression of a protein, and recombinant DNA molecules for expression of mRNA complementary to at least a portion of an mRNA native to the target plant for use in gene suppression to suppress the expression of a protein.
摘要:
A method for manufacturing a semiconductor device that comprises forming an oxide layer over a substrate. A polysilicon layer is disposed outwardly from the oxide layer, wherein the polysilicon layer forms a floating gate. A PSG layer is disposed outwardly from the polysilicon layer and planarized. The device is pattern etched to form a capacitor channel, wherein the capacitor channel is disposed substantially above the floating gate formed from the polysilicon layer. A dielectric layer is formed in the capacitor channel disposed outwardly from the polysilicon layer. A tungsten plug operable to substantially fill the capacitor channel is formed.
摘要:
The present invention relates to a method for forming an anlog capacitor on a semiconductor substrate. The method comprises forming a field oxide over a portion of the substrate, and forming a polysilicon layer over the field oxide layer, and subsequently forming a silicide over the polysilicon layer. A first interlayer dielectric layer is formed over the substrate, and a capacitor masking pattern is formed. The first interlayer dielectric is etched using the capacitor masking pattern as a mask and the silicide layer as an etch stop, and a thin dielectric is formed over the substrate. A contact masking pattern is formed over the substrate, and a subsequent etch is performed on the thin dielectric and the first interlayer dielectric using the silicide and substrate as an etch stop. A metal layer is deposited over the substrate, and is subsequently planarized, thereby defining an analog capacitor.