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    Method and apparatus for encapsulating a multi-chip substrate array
    3.
    发明授权
    Method and apparatus for encapsulating a multi-chip substrate array 失效
    用于封装多芯片衬底阵列的方法和装置

    公开(公告)号：US06576496B1

    公开(公告)日：2003-06-10

    申请号：US09643193

    申请日：2000-08-21

    申请人： Todd O. Bolken ,  David L. Peters

    发明人： Todd O. Bolken ,  David L. Peters

    IPC分类号： H01L2144

    CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

    摘要： The present invention provides an encapsulation method and apparatus that allows high throughput production of reliable, high quality board-on-chip packages, or other semiconductor die packages, from a multi-chip array arrangement on a carrier substrate. In an exemplary embodiment relating to a board-on-chip array, a mold is provided with an upper mold platen and a plurality of upper mold platen cavities for encapsulating wire bonds and related interconnections on a first side of a multi-chip carrier substrate. The mold further includes a lower mold platen and a lower mold platen cavity for encapsulating substantially the entire second side of the carrier substrate, to include a plurality IC chips mounted thereon in array fashion. Substrate support elements, in the form of standoffs pins or bosses, are provided for supporting the multi-chip carrier substrate during the encapsulation process. The standoff pins or bosses are configured to contact, or nearly contact, the die side area of the multi-chip carrier substrate to prevent or minimize substrate deflection during the fill of the mold cavities with encapsulant material. The standoff pins or bosses may be integral to a mold cavity or may be removable. The standoff pins or bosses may further be aligned along edges of lines representing a series of individual device packages. A singulation saw may be used to cut along marks left in the encapsulation to define individual device packages. The individual packages formed by the methods of the present invention may be used to construct a semiconductor device assembly.

    摘要翻译： 本发明提供一种封装方法和装置，其允许从载体基板上的多芯片阵列布置高可靠地生产可靠的，高质量的片上芯片封装或其他半导体管芯封装。 在与片上电路板阵列相关的示例性实施例中，模具设置有上模具压板和多个上模板压板空腔，用于在多芯片载体衬底的第一侧封装引线键合和相关互连。 模具还包括下模具压板和用于基本上封装载体基板的整个第二侧的下模板压板腔，以包括以阵列方式安装在其上的多个IC芯片。 提供以支座引脚或凸台的形式的衬底支撑元件用于在封装过程期间支撑多芯片载体衬底。 对接销或凸起被配置为接触或接近多芯片载体衬底的管芯侧面区域，以防止或最小化在用密封剂材料填充模腔期间的衬底挠曲。 支座销或凸台可以与模腔一体，也可以是可拆卸的。 间隔销或凸台可以进一步沿着表示一系列单独的装置包装的线的边缘对准。 切割锯可用于切割封装中留下的标记以限定单个器件封装。 通过本发明的方法形成的单个包装可以用于构造半导体器件组件。

    Propylene polymers incorporating macromers
    7.
    发明授权
    Propylene polymers incorporating macromers 失效
    掺入大分子单体的丙烯聚合物

    公开(公告)号：US06197910B1

    公开(公告)日：2001-03-06

    申请号：US09020306

    申请日：1998-02-06

    申请人： Weiqing Weng ,  Armen Dekmezian ,  Eric J. Markel ,  Avinash Gadkari ,  David L. Peters

    发明人： Weiqing Weng ,  Armen Dekmezian ,  Eric J. Markel ,  Avinash Gadkari ,  David L. Peters

    IPC分类号： C08F11006

    CPC分类号： C08L51/06 ,  C08F4/65912 ,  C08F10/00 ,  C08F10/06 ,  C08F110/06 ,  C08F255/00 ,  C08F255/02 ,  C08F290/042 ,  C08F297/08 ,  C08F297/083 ,  Y10S526/943 ,  C08F4/65927 ,  C08F2500/15 ,  C08F2500/03 ,  C08F2500/06 ,  C08F2500/09

    摘要： A polyolefin composition is provided which consists essentially of isotactic polypropylene and, optionally, repeating units of one or more comonomers, wherein the total comonomer repeating unit content of the polyolefin composition is from 0 to 20 mole percent, and further, wherein the weight average branching index g′ for the lower molecular weight region of the polyolefin composition is less than 0.93. Additionally, a process is provided for producing a polyolefin composition comprising: a) contacting, in solution, at a temperature from about 90° C. to about 120° C., propylene monomers with a catalyst composition comprising a first chiral, stereorigid transition metal catalyst compound capable of producing isotactic polypropylene; b) copolymerizing the product of a) with propylene and, optionally, one or more copolymerizable monomers, in a polymerization reactor under suitable polypropylene polymerization conditions using a second chiral, stereorigid transition metal catalyst capable of producing isotactic polypropylene; and c) recovering a branched olefin polymer.

    摘要翻译： 提供了聚烯烃组合物，其基本上由全同立构聚丙烯和任选的一种或多种共聚单体的重复单元组成，其中聚烯烃组合物的总共聚单体重复单元含量为0至20摩尔％，此外，其中重均分子量 聚烯烃组合物的较低分子量区域的指数g'小于0.93。 此外，提供了一种用于制备聚烯烃组合物的方法，其包括：a）在约90℃至约120℃的温度下在溶液中使丙烯单体与催化剂组合物接触，所述催化剂组合物包含第一手性立体刚性过渡金属 能够产生全同立构聚丙烯的催化剂化合物; b）在合适的聚丙烯聚合条件下，使用能够产生全同立构的第二手性立体刚性过渡金属催化剂，在聚合反应器中将a）的产物与丙烯和任选的一种或多种可共聚的单体共聚 聚丙烯; 和c）回收支链烯烃聚合物。

    Elastomeric propylene polymers
    8.
    发明授权
    Elastomeric propylene polymers 失效
    弹性丙烯聚合物

    公开(公告)号：US06184327B2

    公开(公告)日：2001-02-06

    申请号：US09020305

    申请日：1998-02-06

    申请人： Weiqing Weng ,  Armen H. Dekmezian ,  Eric J. Markel ,  David L. Peters

    发明人： Weiqing Weng ,  Armen H. Dekmezian ,  Eric J. Markel ,  David L. Peters

    IPC分类号： C08F11060

    CPC分类号： C08L51/06 ,  C08F255/00 ,  C08F255/02 ,  C08F290/04 ,  Y10S526/943 ,  C08L2666/04

    摘要： A thermoplastic elastomer is provided comprising a branched olefin polymer having crystalline sidechains and an amorphous backbone wherein at least 90 mole percent of the sidechains are isotactic or syndiotactic polypropylene and at least 80 mole percent of the backbone is atactic polypropylene. Additionally, a process is provided for producing a thermoplastic elastomer composition comprising: a) contacting, in solution, at a temperature from about 90° C. to about 120° C., propylene monomers with a catalyst composition comprising a chiral, stereorigid transition metal catalyst compound capable of producing isotactic or syndiotactic polypropylene; b) copolymerizing the product of a) with propylene and, optionally, one or more copolymerizable monomers, in a polymerization reactor using an achiral transition metal catalyst capable of producing atactic polypropylene; and c) recovering a branched olefin polymer.

    摘要翻译： 提供了一种热塑性弹性体，其包括具有结晶侧链和无定形骨架的支链烯烃聚合物，其中至少90摩尔％的侧链是全同立构或间同立构聚丙烯，并且至少80摩尔％的主链是无规聚丙烯。 此外，提供了一种制备热塑性弹性体组合物的方法，其包括：a）在约90℃至约120℃的温度下，在溶液中使丙烯单体与催化剂组合物接触，所述催化剂组合物包含手性立体刚性过渡金属 能够产生全同立构或间同立构聚丙烯的催化剂化合物; b）使用能够生产无规聚丙烯的非手性过渡金属催化剂，在聚合反应器中使a）的产物与丙烯和任选的一种或多种可共聚单体共聚; 和c）回收支链烯烃聚合物。

    Vinyl-containing stereospecific polypropylene macromers
    9.
    发明授权
    Vinyl-containing stereospecific polypropylene macromers 失效
    含乙烯基立体定向聚丙烯大分子单体

    公开(公告)号：US6117962A

    公开(公告)日：2000-09-12

    申请号：US20101

    申请日：1998-02-06

    申请人： Weiqing Weng ,  Armen Dekmezian ,  Eric J. Markel ,  Avinash Gadkari ,  David L. Peters

    发明人： Weiqing Weng ,  Armen Dekmezian ,  Eric J. Markel ,  Avinash Gadkari ,  David L. Peters

    IPC分类号： C08F290/04 ,  C08F4/645 ,  C08F4/659 ,  C08F4/6592 ,  C08F110/06

    CPC分类号： C08F110/06 ,  C08F4/65908 ,  C08F4/65912

    摘要： Stereospecific polypropylene macromers having a high percentage of vinyl terminal bonds and a method for preparing them are provided. The stereospecific polypropylene macromers have number average molecular weights (M.sub.n) of about 2,000 Daltons to about 50,000 Daltons, and the total number of vinyl groups per 1000 carbon atoms is greater than or equal to 7000.div.M.sub.n. The method for preparing the macromers involves:a) contacting, in solution, at a temperature from about 90.degree. C. to about 120.degree. C., two or more propylene monomers with a catalyst composition comprising a chiral, stereorigid transition metal catalyst compound; andb) recovering stereospecific polypropylene chains having number average molecular weights of about 2,000 Daltons to about 50,000 Daltons and significant vinyl unsaturation.

    摘要翻译： 提供了具有高百分比乙烯基端键的立体特异性聚丙烯大分子单体及其制备方法。 立体有择性聚丙烯大分子单体的数均分子量（Mn）为约2,000道尔顿至约50,000道尔顿，每1000个碳原子的乙烯基总数大于或等于7000分子量Mn。 制备大分子单体的方法包括：a）在溶液中，在约90℃至约120℃的温度下接触两种或多种具有包含手性立体刚性过渡金属催化剂化合物的催化剂组合物的丙烯单体; 和b）回收数均分子量为约2,000道尔顿至约50,000道尔顿的立体有择聚丙烯链和显着的乙烯基不饱和度。

    Variable gain screen permitting off-axis viewing with image brightness remaining constant
    10.
    发明授权
    Variable gain screen permitting off-axis viewing with image brightness remaining constant 失效
    可变增益屏幕允许离轴观看，图像亮度保持不变

    公开(公告)号：US4354737A

    公开(公告)日：1982-10-19

    申请号：US191968

    申请日：1980-09-29

    申请人： Martin Dotsko ,  Robert E. Klemm ,  David L. Peters

    发明人： Martin Dotsko ,  Robert E. Klemm ,  David L. Peters

    IPC分类号： G03B21/56

    CPC分类号： G03B21/56

    摘要： The invention is a variable gain non-Lambertian screen surface (12) for employment in a visual display system. The screen surface provides constant image brightness, independent of changes in viewing angle (22). It is therefore suitable for off-axis viewing. The screen gain continuously varies from a magnitude of one to infinity at different portions on the screen surface in such a manner that the equivalent gain preceived by an off-axis viewer (16) corresponds to the viewer perceiving constant image brightness, independent of changes in the viewing angle.

    摘要翻译： 本发明是用于视觉显示系统中的可变增益非朗伯屏幕表面（12）。 屏幕表面提供恒定的图像亮度，独立于视角的变化（22）。 因此适用于离轴观察。 屏幕增益在屏幕表面的不同部分连续地从一个到无穷大的范围变化，使得由离轴观察者（16）所预期的等效增益对应于观众感知恒定图像亮度，而不管变化如何 视角。