摘要:
An encapsulation method enabling high throughput production of semiconductor die packages. In an exemplary embodiment, a mold is provided with an upper mold platen having a plurality of cavities for encapsulating interconnections on a first side of a multi-chip carrier substrate. The mold further includes a lower mold platen having a cavity for encapsulating substantially the entire second side of the carrier substrate, including a plurality IC chips mounted thereon. Substrate support elements, in the form of standoff pins, are provided for supporting the carrier substrate during the encapsulation process to prevent substrate deflection. The standoff pins may be integral to a mold cavity or may be removable. The standoff pins may further be aligned along lines representing individual device package edges. Cutting along marks left in the encapsulant by the support elements provides individual device packages.
摘要:
A polyolefin composition is provided which consists essentially of isotactic polypropylene and, optionally, one or more comonomers, wherein the total comonomer content of the polyolefin composition is from 0 to 20 mole percent, and further, wherein the weight average branching index g′ for the lower molecular weight region of the polyolefin composition is less than 0.93. Additionally, a process is provided for producing a polyolefin composition comprising: a) contacting, in solution, at a temperature from about 90° C. to about 120° C., propylene monomers with a catalyst composition comprising a first chiral, stereorigid transition metal catalyst compound capable of producing isotactic polypropylene; b) copolymerizing the product of a) with propylene and, optionally, one or more copolymerizable monomers, in a polymerization reactor under suitable polypropylene polymerization conditions using a second chiral, stereorigid transition metal catalyst capable of producing isotactic polypropylene; and c) recovering a branched olefin polymer.
摘要:
A method for fabricating a semiconductor package is performed using a mold tooling fixture having a mold cavity and a pair of flash control cavities on either side of the mold cavity. The semiconductor package includes a substrate and a semiconductor die attached to the substrate. The substrate includes a pattern of conductors wire bonded to the die, and an array of solder balls bonded to ball bonding pads on the conductors. In addition, the substrate includes a die encapsulant encapsulating the die, and a wire bond encapsulant encapsulating the wire bonds. During molding of the wire bond encapsulant, the flash control cavities collect flash, and provide pressure relief for venting the mold cavity. In addition, the flash control cavities restrict the flash to a selected area of the package substrate, such that the ball bonding pads and solder balls are not contaminated.
摘要:
An improved multiple channel, wide-angle visual image projection system producing a movable displayed image. The system permits the use of two or more light projectors for high resolution wide-angle image display while eliminating image abutment and alignment problems. The system forms a composite image from two or more projectors in a strategically aligned prism array, the composite image being optically transferred to a single wide-angle projection lens, gimballed in azimuth and elevation, through a pair of movable servo-driven prisms for projection onto a two-dimensional screen. The projection system is especially suited for use in an area-of-interest, helmet-slaved visual display in a flight simulator.
摘要:
A method and apparatus for presenting a scene generated by an electronic visual scene generator to an observer looking through a pair of binoculars 32 is disclosed. The scene presented by the binoculars is an enlarged or magnified portion of a panoramic scene presented on a screen 12 also generated by the visual scene generator 28 and suitable for viewing by the observers unaided eye. In the described embodiment, electronic signals representative of a scene are generated by digital generator 28. These electrical signals are then applied to three small CRT's 72, 74 and 70 each of which has a different color such as red, green and blue where the visual scene is produced by the CRT's three colors. The three CRT's colored images are then combined by means of beam splitters, filters and mirrors 44 to provide a single full colored scene which is then transported to both eye pieces of a pair of hand held binoculars 32 or to the eye piece of a periscope 48 by means of a fiber optic cable 36 and 50 respectively. A panoramic scene on screen 12 and suitable for viewing by the unaided eye and generated by the digital generator 28 is also provided by suitable means such as a CRT projector 14. Thus, by monitoring the orientation of the binoculars 32 a magnified or enlarged view (such as 8.times.) of a portion of the panoramic view can be provided by the binoculars, for example, according to the orientation. Thus, in accordance with the embodiment described the observer or tank commander can closely inspect by means of the binoculars a selected portion of the panoramic scene as would be the case in a real life situation.
摘要:
A simulated view on a viewing surface of a raster scan television display of a changeable illuminated area located on a plane surface is provided. The source of illumination is a cone of light whose apex can be located at any distance from an eyepoint and the plane surface and whose conical surface intersects the plane surface creating the illuminated area. Electronic components determine when a line of sight from the eyepoint through the viewing surface intersects the illuminated area. For each line of sight intersection point lying within the illuminated area, a corresponding illumination is created on the viewing surface.
摘要:
A method for fabricating a semiconductor package is performed using a mold tooling fixture having a mold cavity and a pair of flash control cavities on either side of the mold cavity. The semiconductor package includes a substrate and a semiconductor die attached to the substrate. The substrate includes a pattern of conductors wire bonded to the die, and an array of solder balls bonded to ball bonding pads on the conductors. In addition, the substrate includes a die encapsulant encapsulating the die, and a wire bond encapsulant encapsulating the wire bonds. During molding of the wire bond encapsulant, the flash control cavities collect flash, and provide pressure relief for venting the mold cavity. In addition, the flash control cavities restrict the flash to a selected area of the package substrate, such that the ball bonding pads and solder balls are not contaminated.
摘要:
A thermoplastic elastomer is provided comprising a branched olefin polymer having crystalline sidechains and an amorphous backbone wherein at least 90 mole percent of the sidechains are isotactic or syndiotactic polypropylene and at least 80 mole percent of the backbone is atactic polypropylene. Additionally, a process is provided for producing a thermoplastic elastomer composition comprising: a) contacting, in solution, at a temperature from about 90° C. to about 120° C., propylene monomers with a catalyst composition comprising a chiral, stereorigid transition metal catalyst compound capable of producing isotactic or syndiotactic polypropylene; b) copolymerizing the product of a) with propylene and, optionally, one or more copolymerizable monomers, in a polymerization reactor using an achiral transition metal catalyst capable of producing atactic polypropylene; and c) recovering a branched olefin polymer.
摘要:
An image or pictorial scene generated by a raster scan is continuously maintained in proper alignment during normal operation of a visual display system by the use of photosensitive devices mounted to the display surface outside of the field of view. In the described embodiment, the photosensitive device is mounted in a position suitable for monitoring a selected retrace path of the raster scan pattern. During operation, the retrace of the raster is unblanked as it passes the photosensitive device such that elements of the photosensitive device are turned on. The output of the photosensitive elements are compared to signals representative of a properly positioned raster image, and differences between the stored signals and the received signals are then used to generate a correction signal in the feedback loop to vary the position of the moving energy beam such that the raster scan is properly aligned.
摘要:
Over wide altitude ranges, signals representative of the altitude of an eyepoint viewing a synthetic grid pattern on a ground reference plane are scaled to provide strong signals. These strong signals are used to electronically define the intersection of a line of sight from the eyepoint to the grid pattern so that a clearly defined grid pattern as viewed over the wide altitude range can be displayed.