摘要:
Each of a pair of magnetic core halves includes a substrate and a thin magnetic metal film formed on the substrate. The substrate is notched with a winding groove. The pair of the magnetic core halves are integrally bonded to each other so that a gap filling film is formed between the facing surfaces of the thin magnetic metal films. The zero depth position of the magnetic gap which is determined by the length of the facing thin magnetic metal films is offset to a magnetic recording medium sliding surface of the magnetic head from the notching start position of the winding groove on the side of the magnetic gap. Hence, the shape of the thin magnetic metal film exposed on the magnetic recording medium sliding surface is maintained constant from the initial position to the depth zero position.
摘要:
A magnetic head is disclosed which is formed by magnetic core halves constituted of an oxide magnetic material and soft magnetic thin films, wherein the boundary surfaces between the thin films and the oxide magnetic material runs substantially parallel to the gap surface in the vicinity of the magnetic gap. The soft magnetic thin films are soft magnetic thin films of the Fe-Ga-Si system consisting essentially of Fe, Ga and Si.
摘要:
The present invention provides an antenna apparatus which can realize favorable communication properties while achieving downsizing of a casing of an electronic device when incorporated in an electronic device. An antenna module (1a) which is incorporated in a mobile phone (130) and which is enabled to perform communication by receiving a magnetic field transmitted from a reader/writer (120) comprises an antenna coil (11a) which is wound in a clearance (132) between an end portion (133b) of a metallic plate (133a) opposing the reader/writer (120) within a casing (131) of the mobile phone (130) and an inner peripheral wall (131a) of the casing (131) so as not to surround an outer peripheral portion of the metallic plate (133a) and which is inductively coupled with the reader/writer (120).
摘要:
The present invention provides a communication device that can reduce a housing of an electronic device in size and thickness when the communication device is built in the electronic device. The communication device includes: an antenna coil (11a) arranged on an outer peripheral portion (134) of a housing (131) surface facing a reader/writer (120) of a mobile phone (130); a magnetic sheet (13) that attracts a magnetic field transmitted from the reader/writer (120) to the antenna coil (11a); and a communication processing unit (12) that is driven by a current flowing in the antenna coil (11a) and performs communication with the reader/writer (120), wherein the magnetic sheet (13) is arranged on the reader/writer (120) side of the antenna coil (11a) at a center portion (132a), and the antenna coil (11a) is arranged on the reader/writer (120) side on an outer periphery (130d) side.
摘要:
A communication device that, when incorporated in an electronic device, can reduce the size and the thickness of a housing of the electronic device while maintaining communication characteristics. The communication device includes an antenna coil that is arranged on a peripheral part of a housing surface facing a reader-writer of a mobile phone, a magnetic sheet that attracts the magnetic filed transmitted from the reader-writer to the antenna coil, and a communication processing unit that is driven by a current flowing through the antenna coil and communicates with the reader-writer. The magnetic sheet is arranged to be closer to reader-writer than the antenna coil in the central part, and the antenna coil is arranged to be closer to the reader-writer on the outer periphery side, and at least a part of the conductive line of the antenna coil is superimposed in a direction orthogonal to a circuit board.
摘要:
An infrared sensor includes a series capacitor element and a reference capacitor element each exhibiting a predetermined capacitance value; an infrared-detecting capacitor element whose capacitance value varies depending on an intensity of infrared light incident on the element; and an output node being a node at which a first terminal of the series capacitor element, a first terminal of the reference capacitor element and a first terminal of the infrared-detecting capacitor element are connected to one another. The intensity of infrared light is output as a potential difference between the reference potential which is brought to a potential by applying a predetermined voltage between the series capacitor element and the reference capacitor element and the detection potential which is brought to a potential by applying a predetermined voltage between the series capacitor element and the infrared-detecting capacitor element.
摘要:
A semiconductor device has a Group III nitride semiconductor layer and a gate electrode formed on the Group III nitride semiconductor layer. The gate electrode contains an adhesion enhancing element. A thermally oxidized insulating film is interposed between the Group III nitride semiconductor layer and the gate electrode.
摘要:
An insulating-gate semiconductor device has a first nitride semiconductor layer formed over a substrate and an insulating oxidation layer obtained by oxidizing a second nitride semiconductor layer formed on the first nitride semiconductor layer. A gate electrode is formed on the insulating oxidation layer.
摘要:
A semiconductor device has: a buffer layer formed on a conductive substrate and made of AlxGa1-xN with a high resistance; an element-forming layer formed on the buffer layer, having a channel layer, and made of undoped GaN and N-type AlyGa1-yN; and a source electrode, a drain electrode and a gate electrode which are selectively formed on the element-forming layer. The source electrode is filled in a through hole provided in the buffer layer and the element-forming layer, and is thus electrically connected to the conductive substrate.
摘要翻译:半导体器件具有:形成在导电基板上并具有高电阻的Al x Ga 1-x N的缓冲层; 形成在缓冲层上的元件形成层,具有沟道层,由未掺杂的GaN和N型Al y Ga 1-y N制成; 以及选择性地形成在元件形成层上的源电极,漏电极和栅电极。 源电极被填充在设置在缓冲层和元件形成层中的通孔中,因此电连接到导电基板。
摘要:
An object of the present invention is to reduce the resistance of an electrode of a Group III nitride semiconductor. A thin Si film and a thin Ti film are formed selectively in a contact formation region on a surface of an AlGaN layer as a Group III nitride semiconductor layer formed on a substrate, and the resulting substrate is heat-treated at a high temperature. By the heat treatment, Si is diffused into the AlGaN layer in the ohmic contact formation region at a concentration of about 1020 cm3. Further, an electron density sufficiently high to provide an ohmic characteristic through a reaction between Si and Ti is provided. Thus, a low resistance TiSi2 portion resulting from the reaction between Si and Ti, a TiN portion resulting from a reaction between Ti and AlGaN and a Group III metal portion of Ga and Al devoid of nitrogen are formed in the contact formation region thereby to provide a low resistance electrode film mainly comprising TiSi2.
摘要翻译:本发明的目的是降低III族氮化物半导体的电极的电阻。 在AlGaN层的表面上的接触形成区域中选择性地形成薄的Si膜和薄的Ti膜,作为形成在衬底上的III族氮化物半导体层,并将所得到的衬底在高温下进行热处理。 通过热处理,Si在欧姆接触形成区域中扩散到约10 20 cm 3的浓度的AlGaN层中。 此外,提供足够高的电子密度以通过Si和Ti之间的反应提供欧姆特性。 因此,形成由Si和Ti之间的反应产生的低电阻TiSi 2 H 2部分,由Ti和AlGaN之间的反应导致的TiN部分和缺少氮的Ga和Al的III族金属部分 在接触形成区域中,由此提供主要包含TiSi 2 N的低电阻电极膜。