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    COMPONENT CRIMPING APPARATUS CONTROL METHOD, COMPONENT CRIMPING APPARATUS, AND MEASURING TOOL
    1.
    发明申请
    COMPONENT CRIMPING APPARATUS CONTROL METHOD, COMPONENT CRIMPING APPARATUS, AND MEASURING TOOL 有权
    组件打击装置控制方法，组件打击装置和测量工具

    公开(公告)号：US20090288462A1

    公开(公告)日：2009-11-26

    申请号：US12440776

    申请日：2007-09-25

    申请人： Tomotaka Nishimoto ,  Yasuhiro Okada ,  Chihiro Jgarashi ,  Takanori Yoshitake ,  Nobuhisa Watanabe

    发明人： Tomotaka Nishimoto ,  Yasuhiro Okada ,  Chihiro Jgarashi ,  Takanori Yoshitake ,  Nobuhisa Watanabe

    IPC分类号： B21C51/00

    CPC分类号： H05K3/323 ,  H05K3/3494 ,  H05K3/361 ,  H05K2201/10151 ,  H05K2201/10204 ,  H05K2203/0195 ,  H05K2203/163

    摘要： To provide a component crimping apparatus control method which enables a measuring tool to directly measure a temperature of a part pressed by a pressing head.The component crimping apparatus control method is applied to a component crimping apparatus which crimps a component onto a plate-shaped work, and causes a measuring tool shaped identically as the work to measure a temperature or a pressure of a pressed part in a pressing process of pressing a component onto the work using a heated pressing head. The method includes acquiring information indicating whether or not the measuring tool is held in the component crimping apparatus, and, in the case where the information indicating that the measuring tool is held is acquired, positioning the measuring tool identically as the work, and executing the pressing process on the component to be attached to the measuring tool after the positioning.

    摘要翻译： 提供一种能够使测量工具直接测量由按压头按压的部位的温度的部件压接装置控制方法。 将部件压接装置控制方法应用于将部件压接在板状工件上的部件压接装置，并且使得形成为相同形状的测量工具作为工件，以在压制过程中测量压制部件的温度或压力 使用加热的压头将部件压在工件上。 该方法包括获取指示测量工具是否保持在部件压接装置中的信息，并且在获取表示测量工具的信息被获取的情况下，将测量工具相同地定位为工件，并且执行 定位后要附着在测量工具上的部件按压过程。

    Component crimping apparatus control method, component crimping apparatus, and measuring tool
    2.
    发明授权
    Component crimping apparatus control method, component crimping apparatus, and measuring tool 有权
    部件压接装置控制方法，部件压接装置和测量工具

    公开(公告)号：US08078310B2

    公开(公告)日：2011-12-13

    申请号：US12440776

    申请日：2007-09-25

    申请人： Tomotaka Nishimoto ,  Yasuhiro Okada ,  Chihiro Igarashi ,  Takanori Yoshitake ,  Nobuhisa Watanabe

    发明人： Tomotaka Nishimoto ,  Yasuhiro Okada ,  Chihiro Igarashi ,  Takanori Yoshitake ,  Nobuhisa Watanabe

    IPC分类号： G06F19/00 ,  D02G1/00 ,  D01D10/00

    CPC分类号： H05K3/323 ,  H05K3/3494 ,  H05K3/361 ,  H05K2201/10151 ,  H05K2201/10204 ,  H05K2203/0195 ,  H05K2203/163

    摘要： A component crimping apparatus control method which enables a measuring tool to directly measure a temperature of a part pressed by a pressing head. The component crimping apparatus control method is applied to a component crimping apparatus which crimps a component onto a plate-shaped workpiece, and causes a measuring tool shaped identically as the workpiece to measure a temperature or a pressure of a pressed part in a pressing process of pressing a component onto the workpiece using a heated pressing head. The method includes acquiring information indicating whether or not the measuring tool is held in the component crimping apparatus, and, in the case where the information indicating that the measuring tool is held is acquired, positioning the measuring tool identically as the workpiece, and executing the pressing process on the component to be attached to the measuring tool after the positioning.

    摘要翻译： 一种部件压接装置控制方法，其使得测量工具能够直接测量由按压头按压的部件的温度。 将部件压接装置控制方法应用于将部件压接到板状工件上的部件压接装置，并且使得形成为相同的工件的测量工具在压制过程中测量压制部件的温度或压力 使用加热的压头将部件压在工件上。 该方法包括获取指示测量工具是否保持在部件压接装置中的信息，并且在获取表示测量工具被保持的信息的情况下，将测量工具相同地定位为工件，并执行 定位后要附着在测量工具上的部件按压过程。

    Electronic device, signal transmission device, and signal transmission method
    5.
    发明授权
    Electronic device, signal transmission device, and signal transmission method 有权
    电子装置，信号传输装置和信号传输方法

    公开(公告)号：US09007981B2

    公开(公告)日：2015-04-14

    申请号：US13384120

    申请日：2010-08-09

    申请人： Norihito Mihota ,  Hirofumi Kawamura ,  Yasuhiro Okada ,  Naoto Nakamura ,  Yoshiyuki Akiyama

    发明人： Norihito Mihota ,  Hirofumi Kawamura ,  Yasuhiro Okada ,  Naoto Nakamura ,  Yoshiyuki Akiyama

    IPC分类号： H04H20/71 ,  H04B7/02 ,  H04B7/04

    CPC分类号： H04B7/022 ,  H04B7/0413

    摘要： Signal distribution, signal switching, and signal collection are performed with a simple configuration. An electronic device comprises a transmission unit (108) for transmitting, as a wireless signal, a signal to be transmitted and a reception unit (208) for receiving the wireless signal transmitted from the transmission unit. In the electronic device, a plurality of pairs of wireless signal transmission points in the transmission unit and wireless signal reception points in the reception unit can be formed. Using the pairs of transmission points and reception points make it possible to execute at least either one of signal distribution in which the same signal to be transmitted from a transmission point is transmitted to the multiple reception points and signal switching in which a signal to be transmitted from a transmission point is selectively transmitted to any of the multiple reception points. The signal to be transmitted is transmitted as a wireless signal. In this case, the signal distribution, signal switching, and signal collection are performed in a wireless signal portion. Since a portion where a signal transmission is performed through electric wiring does not interpose the portion where the signal distribution, signal switching, and signal collection are performed, the signal distribution, signal switching, and signal collection can be performed with a simple configuration.

    摘要翻译： 以简单的配置进行信号分配，信号切换和信号采集。 电子设备包括用于作为无线信号发送要发送的信号的发送单元（108）和用于接收从发送单元发送的无线信号的接收单元（208）。 在电子设备中，可以形成发送单元中的多对无线信号发送点和接收单元中的无线信号接收点。 使用发送点和接收点对可以执行信号分配中的至少一个，其中从发送点发送的相同信号被发送到多个接收点，并且其中要发送的信号的信号切换 从发送点选择性地发送到多个接收点中的任一个。 要发送的信号作为无线信号发送。 在这种情况下，在无线信号部分中执行信号分配，信号切换和信号采集。 由于通过电线执行信号传输的部分不会插入执行信号分配，信号切换和信号收集的部分，所以可以以简单的配置进行信号分配，信号切换和信号收集。

    SOLAR CELL ELEMENT MANUFACTURING METHOD, SOLAR CELL ELEMENT, AND SOLAR CELL MODULE
    6.
    发明申请
    SOLAR CELL ELEMENT MANUFACTURING METHOD, SOLAR CELL ELEMENT, AND SOLAR CELL MODULE 有权
    太阳能电池元件制造方法，太阳能电池元件和太阳能电池模块

    公开(公告)号：US20140000675A1

    公开(公告)日：2014-01-02

    申请号：US13982230

    申请日：2012-01-27

    申请人： Manabu Komoda ,  Yasuhiro Okada ,  Yuusuke Nagou ,  Takeshi Ito ,  Hitohiko Nakamura

    发明人： Manabu Komoda ,  Yasuhiro Okada ,  Yuusuke Nagou ,  Takeshi Ito ,  Hitohiko Nakamura

    IPC分类号： H01L31/0352

    CPC分类号： H01L31/0352 ,  H01L31/02363 ,  H01L31/068 ,  Y02E10/547

    摘要： A method for manufacturing a solar cell element is disclosed. The method includes two different etching processes followed by forming a semiconductor layer. A semiconductor substrate having a first conductor type is etched by using a first acid aqueous solution containing hydrofluoric acid, nitric acid, and sulfuric acid. Then, the semiconductor substrate is etched by using a second acid aqueous solution containing hydrofluoric acid and nitric acid with substantially no sulfuric acid to make an uneven surface. A semiconductor layer of second conductivity type different from the first conductivity type is formed on at least a part of the uneven surface of the semiconductor substrate.

    摘要翻译： 公开了太阳能电池元件的制造方法。 该方法包括随后形成半导体层的两种不同的蚀刻工艺。 通过使用含有氢氟酸，硝酸和硫酸的第一酸性水溶液来蚀刻具有第一导体类型的半导体衬底。 然后，通过使用含有基本上不含硫酸的氢氟酸和硝酸的第二酸性水溶液来蚀刻半导体衬底以形成不均匀的表面。 在半导体衬底的不平坦表面的至少一部分上形成不同于第一导电类型的第二导电类型的半导体层。

    WAVE DIELECTRIC TRANSMISSION DEVICE, MANUFACTURING METHOD THEREOF, AND IN-MILLIMETER WAVE DIELECTRIC TRANSMISSION METHOD
    7.
    发明申请
    WAVE DIELECTRIC TRANSMISSION DEVICE, MANUFACTURING METHOD THEREOF, AND IN-MILLIMETER WAVE DIELECTRIC TRANSMISSION METHOD 有权
    波导电力传输装置及其制造方法，以及内置波导传输方法

    公开(公告)号：US20110165839A1

    公开(公告)日：2011-07-07

    申请号：US13063057

    申请日：2009-09-15

    申请人： Hirofumi Kawamura ,  Yasuhiro Okada

    发明人： Hirofumi Kawamura ,  Yasuhiro Okada

    IPC分类号： H04B5/00 ,  H01Q15/08 ,  H01P11/00

    CPC分类号： H01P3/16 ,  G01S7/032 ,  G01S2013/9371 ,  H01P5/02 ,  H01Q9/0407 ,  H01Q9/045 ,  H04B1/3822 ,  H04B10/00 ,  H04B10/501 ,  H04B10/5161 ,  H04B10/556 ,  Y10T29/49016

    摘要： Provided is an in-millimeter wave dielectric transmission device including a first signal processing board for processing a millimeter wave signal, a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal, and a viscoelastic member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The viscoelastic member constitutes a dielectric transmission path. With such a configuration, the viscoelastic member absorbs vibration when external force is applied to the signal processing boards, so that vibration of the first signal processing board and the second signal processing board can be reduced, and a millimeter wave signal between the signal processing boards can be transmitted through the viscoelastic member at a high speed without using connectors and cables.

    摘要翻译： 提供了一种毫米波介质传输装置，其包括用于处理毫米波信号的第一信号处理板，信号耦合到第一信号处理板以接收毫米波信号的第二信号处理板，并执行关于 毫米波信号和设置在第一信号处理板和第二信号处理板之间并具有预定的相对介电常数和预定的介电损耗系数的粘弹元件。 粘弹性构件构成电介质传输路径。 通过这样的结构，当对信号处理板施加外力时，粘弹性体吸收振动，能够降低第一信号处理板和第二信号处理板的振动，并且信号处理板之间的毫米波信号 可以高速传输通过粘弹性部件，而不使用连接器和电缆。

    Pallet exchange apparatus
    8.
    发明授权
    Pallet exchange apparatus 失效
    托盘交换装置

    公开(公告)号：US5368150A

    公开(公告)日：1994-11-29

    申请号：US74582

    申请日：1993-06-11

    申请人： Yasuhiro Okada ,  Yukio Hoshino ,  Yasuhiro Hattori ,  Hidekazu Hirano

    发明人： Yasuhiro Okada ,  Yukio Hoshino ,  Yasuhiro Hattori ,  Hidekazu Hirano

    IPC分类号： B23Q7/00 ,  B23Q7/14 ,  B65G37/00

    CPC分类号： B23Q7/1431 ,  Y10T29/5196

    摘要： A pallet exchange apparatus has a bed and an arm assembly supported on the bed to be rotatable between a workpiece loading-and-unloading station and workpiece machining station. A pair of cylindrical holes are formed at both ends of the arm assembly for receiving the pallets. The apparatus is further provided with driving means for rotating the arm assembly, a turntable rotatably mounted on the bed at a position corresponding to the workpiece machining station, first engagement portions formed at the ends of the arm assembly, second engagement portions formed on the pallets so as to be engaged with the first engagement portions for preventing the rotation of the pallets, and a moving device disposed on the turntable for moving the pallet located at the workpiece machining station in the vertical direction. When the pallet is lowered by the moving device, the pallet is separated from the turntable and the second engagement portion of the pallet is engaged with the first engagement portion. When the pallet is raised, the pallet is thrust against the turntable and the second engagement portion is disengaged from the second engagement portion.

    摘要翻译： 托盘交换装置具有床和臂组件，其支撑在床上以在工件装载站和工件加工站之间旋转。 在臂组件的两端形成一对圆柱形的孔，用于接收托盘。 该装置还设置有用于使臂组件旋转的驱动装置，可转动地安装在床上的与工件加工台相对应的位置的转盘，形成在臂组件端部的第一接合部分，形成在托盘上的第二接合部 以便与用于防止托盘旋转的第一接合部分接合，以及设置在转台上用于沿垂直方向移动位于工件加工站的托盘的移动装置。 当托盘被移动装置降低时，托盘与转台分离，托盘的第二接合部分与第一接合部分接合。 当托盘升起时，托盘被推靠在转盘上，第二接合部分从第二接合部分脱离。

    Terminal pin
    9.
    发明授权
    Terminal pin 失效
    端子针脚

    公开(公告)号：US4795378A

    公开(公告)日：1989-01-03

    申请号：US95627

    申请日：1987-09-14

    申请人： Motoyuki Tomizu ,  Yasuhiro Okada

    发明人： Motoyuki Tomizu ,  Yasuhiro Okada

    IPC分类号： H01R12/34 ,  H01R13/428

    CPC分类号： H01R12/585

    摘要： A terminal pin, having a compressed portion the cross section of which is roughly V-shaped, has a pair of arms and a pair of convex contact edges with a concave trail between the convex contact edges. The pair of arms have a uniform thickness and are deformed inwardly when pressed into a through hole defined in a PCB. After being pressed into the through hole, the compressed portion contacts the internal surface of the through hole at four locations, namely, at a pair of external surfaces provided at the ends of the pair of arms and the pair of convex contact edges.