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公开(公告)号：US20070144384A1
公开(公告)日：2007-06-28
申请号：US10591434
申请日：2005-05-18
IPC分类号： B41N3/00
CPC分类号： G03F7/2055 , G03F7/2057
摘要： The invention provides an image recording method and a lithographic printing method in which both high image quality and good fine line reproducibility can be achieved, and high sensitivity and safety under white light can be obtained, and the image recording method for a lithographic printing plate, which comprises imagewise exposing with an imaging time per pixel of 1 millisecond or less using a laser light with an emission wavelength of from 250 nm to 420 nm, wherein the lithographic printing plate precursor comprises a support and an image recording layer, in which the image recording layer contains (A) a polymerization initiator and (B) a polymeric compound and has an image recording layer which is photosensitive in a wavelength of from 250 nm to 420 nm, and the support has an anodized film with sealed micropores on the surface; and a lithographic printing method utilizing the same.
摘要翻译： 本发明提供一种图像记录方法和平版印刷方法，其中可以实现高图像质量和良好的细线再现性，并且可以获得白光下的高灵敏度和安全性，并且用于平版印刷版的图像记录方法， 其包括使用发射波长为250nm至420nm的激光，每1像素的成像时间成像曝光，其中平版印刷版前体包括载体和图像记录层，其中图像 记录层包含（A）聚合引发剂和（B）聚合物，并且具有在250nm至420nm的波长下是感光性的图像记录层，并且所述载体具有在表面上具有密封微孔的阳极氧化膜; 和使用该方法的平版印刷法。
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公开(公告)号：US20100047719A1
公开(公告)日：2010-02-25
申请号：US12612539
申请日：2009-11-04
IPC分类号： G03F7/20
CPC分类号： G03F7/2055 , G03F7/2057
摘要： The invention provides an image recording method and a lithographic printing method in which both high image quality and good fine line reproducibility can be achieved, and high sensitivity and safety under white light can be obtained, and the image recording method for a lithographic printing plate, which comprises imagewise exposing with an imaging time per pixel of 1 millisecond or less using a laser light with an emission wavelength of from 250 nm to 420 nm, wherein the lithographic printing plate precursor comprises a support and an image recording layer, in which the image recording layer contains (A) a polymerization initiator and (B) a polymeric compound and has an image recording layer which is photosensitive in a wavelength of from 250 nm to 420 nm, and the support has an anodized film with sealed micropores on the surface; and a lithographic printing method utilizing the same.
摘要翻译： 本发明提供一种图像记录方法和平版印刷方法，其中可以实现高图像质量和良好的细线再现性，并且可以获得白光下的高灵敏度和安全性，并且用于平版印刷版的图像记录方法， 其包括使用发射波长为250nm至420nm的激光，每1像素的成像时间成像曝光，其中平版印刷版前体包括载体和图像记录层，其中图像 记录层包含（A）聚合引发剂和（B）聚合物，并且具有在250nm至420nm的波长下是感光性的图像记录层，并且所述载体具有在表面上具有密封微孔的阳极氧化膜; 和使用该方法的平版印刷法。
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3.发明授权
公开(公告)号：US5830630A
公开(公告)日：1998-11-03
申请号：US735581
申请日：1996-10-23
申请人： Satoshi Hoshi , Hirokazu Sakaki , Yoshinori Hotta
发明人： Satoshi Hoshi , Hirokazu Sakaki , Yoshinori Hotta
CPC分类号： B41N1/083 , B22D11/06 , G03C1/77 , G03F7/0285 , G03F7/07 , G03F7/0952
摘要： A light-sensitive sheet comprises an aluminum alloy support and a light-sensitive layer. The aluminum alloy support contains grains of secondary phase. The maximum grain size of the grains of secondary phase essentially is less than 5 .mu.m. Silver halide light-sensitive materials having the aluminum alloy support are also disclosed.
摘要翻译： 感光片包括铝合金支架和感光层。 铝合金支架含有第二相晶粒。 第二相晶粒的最大晶粒尺寸基本上小于5μm。 还公开了具有铝合金支撑体的卤化银感光材料。
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公开(公告)号：US20120091495A1
公开(公告)日：2012-04-19
申请号：US13380779
申请日：2010-06-23
申请人： Yusuke Hatanaka , Yoshinori Hotta , Akio Uesugi
发明人： Yusuke Hatanaka , Yoshinori Hotta , Akio Uesugi
CPC分类号： H01L33/60 , H01L2224/16 , H01L2224/48091 , H01L2224/73265 , H01L2924/1301 , H01L2933/0058 , H01L2924/00014 , H01L2924/00
摘要： A light reflecting substrate comprises at least: an insulating layer and a metal layer disposed in contact with the insulating layer. The total reflectivity of light in the wavelength range of more than 320 nm and not more than 700 nm is not less than 50% and the total reflectivity of light in the wavelength range of 300 nm to 320 nm is not less than 60%. The light reflecting substrate further improves the emission power of the light-emitting device when used as the substrate therefor.
摘要翻译： 光反射基板至少包括：绝缘层和设置成与绝缘层接触的金属层。 在大于320nm且不大于700nm的波长范围内的光的总反射率不小于50％，并且在300nm至320nm的波长范围内的光的总反射率不小于60％。 光反射基板当用作基板时，进一步提高了发光装置的发光功率。
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公开(公告)号：US20110043239A1
公开(公告)日：2011-02-24
申请号：US12922378
申请日：2009-03-09
申请人： Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi , Yusuke Hatanaka
发明人： Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi , Yusuke Hatanaka
IPC分类号： G01R31/00
CPC分类号： G01R1/0735 , G01R3/00 , G01R31/2863 , H01R12/7076 , H01R12/7082 , H01R13/2414
摘要： An object of the present invention is to provide a probe card which has good stability of the connection between testing electrodes and test electrodes even after exposure to high temperatures in the burn-in test, and is less susceptible to displacements in the positions of contact between the testing electrodes and conductive portions or between the conductive portions and probe needles or the test electrodes even after repeated use of the probe card. The probe card of the present invention is a probe card which includes a testing circuit board having the testing electrodes formed so as to correspond to the test electrodes and an anisotropic conductive member electrically connecting the test electrodes with the testing electrodes. The testing electrodes are formed so that at least ends of the testing electrodes protrude from a surface of the testing circuit board, and the anisotropic conductive member is a member which has an insulating base made of an anodized aluminum film having micropores therein and a plurality of conductive paths made of a conductive material, insulated from one another, and extending through the insulating base in a thickness direction of the insulating base.
摘要翻译： 本发明的目的是提供一种探针卡，即使在老化试验中暴露于高温之后，测试电极和测试电极之间的连接也具有良好的稳定性，并且不太容易受到在 测试电极和导电部分，或者即使在重复使用探针卡之后，在导电部分和探针或测试电极之间。 本发明的探针卡是一种探针卡，其包括测试电路板，其具有形成为对应于测试电极的测试电极和将测试电极与测试电极电连接的各向异性导电部件。 测试电极形成为使得测试电极的至少一端从测试电路板的表面突出，并且各向异性导电构件是具有由其中具有微孔的阳极氧化铝膜制成的绝缘基底的构件，并且多个 由导电材料制成的导电路径彼此绝缘，并且在绝缘基底的厚度方向上延伸穿过绝缘基底。
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公开(公告)号：US20100264036A1
公开(公告)日：2010-10-21
申请号：US12743154
申请日：2008-08-21
申请人： Yusuke Hatanaka , Yoshinori Hotta , Akio Uesugi
发明人： Yusuke Hatanaka , Yoshinori Hotta , Akio Uesugi
CPC分类号： H05K3/423 , C25D11/045 , C25D11/12 , C25D11/20 , H01L23/49827 , H01L2924/0002 , H05K1/0306 , H05K3/002 , H05K2201/0116 , H05K2201/10378 , H05K2203/0315 , H05K2203/1142 , H05K2203/1476 , H01L2924/00
摘要： Disclosed is a microfine structure which can be used as an anisotropic conductive member. Also disclosed is a method for producing such a microfine structure. Specifically disclosed is a microfine structure which is composed of a base having penetrating micropores at a density of not less than 10,000,000 micropores/mm2. In this microfine structure, some penetrating micropores are filled with a substance other than the material of the base.
摘要翻译： 公开了可用作各向异性导电构件的微细结构。 还公开了这种微细结构的制造方法。 具体公开了一种微细结构，其由具有不小于10,000,000微孔/ mm 2的密度的穿透微孔的基底组成。 在这种微细结构中，一些穿透微孔填充有除基底材料之外的物质。
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公开(公告)号：US20080284042A1
公开(公告)日：2008-11-20
申请号：US12056336
申请日：2008-03-27
申请人： Yoshinori Hotta , Takashi Touma , Yusuke Hatanaka
发明人： Yoshinori Hotta , Takashi Touma , Yusuke Hatanaka
CPC分类号： H01L23/49827 , G01R1/06755 , G01R1/07378 , H01L21/486 , H01L2924/0002 , H01L2924/3025 , H05K3/4038 , H05K2201/0116 , H05K2203/0315 , H01L2924/00
摘要： An anisotropically conductive member has an insulating base material, and conductive paths composed of a conductive material which pass in a mutually insulated state through the insulating base material in a thickness direction thereof and which are provided in such a way that a first end of each conductive path is exposed on a first side of the insulating base material and a second end of each conductive path is exposed on a second side of the insulating base material. The conductive paths have a density of at least 2 million paths/mm2 and the insulating base material is a structure composed of an anodized aluminum film having micropores therein.
摘要翻译： 各向异性导电部件具有绝缘性基材，导电性通路由导电性材料构成，该导电性材料通过绝缘性基材在厚度方向上以相互绝缘的状态通过，并且以导电性的方式使第一端 路径暴露在绝缘基材的第一侧上，并且每个导电路径的第二端在绝缘基材的第二侧上露出。 导电路径具有至少200万路径/ mm 2的密度，绝缘基材是由其中具有微孔的阳极氧化铝膜构成的结构。
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8.发明授权
公开(公告)号：US6156135A
公开(公告)日：2000-12-05
申请号：US41300
申请日：1998-03-12
摘要： An aluminum substrate for lithographic printing plates which forms uniform pits on electrolytic etching without undergoing dissolution, the substrate being obtained by electrolytic etching an aluminum plate prepared by continuous casting in a twin roll mold process, rolling, and annealing, in which the annealing is carried out in such a manner that the resulting aluminum plate may have a total electric current density of not more than 1.85.times.10.sup.-2 C/dm.sup.2 when scanned at a potential from -100 mV up to 1500 mV.
摘要翻译： 一种用于平版印刷版的铝基板，其在电解蚀刻中形成均匀的凹坑而不经历溶解，所述基板通过电解蚀刻通过连续铸造制备的铝板而获得，所述铝板通过双辊模制工艺，轧制和退火进行，其中进行退火 以使得当在-100mV至1500mV的电位下扫描时，所得铝板的总电流密度可以不大于1.85×10 -2 C / dm 2。
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公开(公告)号：US20100294547A1
公开(公告)日：2010-11-25
申请号：US12747128
申请日：2008-12-01
CPC分类号： H01L23/5389 , H01L23/49827 , H01L2924/0002 , H01R12/714 , Y10T29/49126 , Y10T29/4921 , Y10T428/24074 , Y10T428/24083 , Y10T428/24091 , Y10T428/24174 , Y10T428/24917 , Y10T428/249953 , Y10T428/249956 , H01L2924/00
摘要： An anisotropic conductive joint package in which an anisotropic conductive film is joined to at least one conductive material selected from among the group consisting of gold (Au), silver (Ag), copper (Cu), aluminum (Al), magnesium (Mg), nickel (Ni), a tin oxide doped with indium (ITO), molybdenum (Mo), iron (Fe), palladium (Pd), beryllium (Be), and rhenium (Re). The package is characterized in that: the anisotropic conductive film has an insulating base and conductive paths composed of conductive members, insulated from one another, and extending through the insulating base in the direction of the thickness of the insulating base, one ends of the conductive paths are exposed from one side of the insulating base, the other ends are exposed from the other side, the density of the conductive paths is 3,000,000 pieces/mm2 or more, the insulating base is a structural body composed of an anodic oxide film of an aluminum substrate having micropores, and each micropore does not have a branch structure along the depth. The package can be used as an anisotropic conductive member of an electronic component of a semiconductor device or the like or a connector for inspection even if the structure has a much higher degree of integration realized by drastically improving the installation density of the conductive paths.
摘要翻译： 一种各向异性导电接头封装，其中各向异性导电膜与至少一种选自金（Au），银（Ag），铜（Cu），铝（Al），镁（Mg） ，镍（Ni），掺有铟（ITO），钼（Mo），铁（Fe），钯（Pd），铍（Be）和铼（Re）的氧化锡。 封装的特征在于：各向异性导电膜具有绝缘基底和由导电构件构成的导电路径，彼此绝缘并且在绝缘基底的厚度方向上延伸穿过绝缘基底，导电的一端 路径从绝缘基体的一侧露出，另一端从另一侧露出，导电路径的密度为3,000,000个/ mm 2以上，绝缘基底是由阳极氧化膜 铝基板具有微孔，并且每个微孔不具有沿深度的分支结构。 该封装可以用作半导体器件等的电子部件的各向异性导电部件或用于检查的连接器，即使通过显着提高导电路径的安装密度而实现的结构具有高得多的集成度。
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公开(公告)号：US07722754B2
公开(公告)日：2010-05-25
申请号：US11808502
申请日：2007-06-11
申请人： Yusuke Hatanaka , Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi
发明人： Yusuke Hatanaka , Tadabumi Tomita , Yoshinori Hotta , Akio Uesugi
CPC分类号： C25D11/12 , C25D11/045 , C25D11/18 , Y10T428/249953
摘要： A method of manufacturing a microstructure wherein an aluminum member having an aluminum substrate and a micropore-bearing anodized film present on a surface of the aluminum substrate is subjected at least to, in order, a pore-ordering treatment which involves performing one or more cycles of a step that includes a first film dissolution treatment for dissolving the anodized film until a barrier layer has a thickness of 3 to 50 nm, and an anodizing treatment which follows the first film dissolution treatment; and a second film dissolution treatment for dissolving the anodized film so that a ratio of a diameter of a micropore opening “a” to a micropore diameter at a height “a/2” from a micropore bottom “b” (a/b) is in a range of 0.9 to 1.1, whereby the microstructure having micropores formed on a surface thereof is obtained. The manufacturing method enables microstructures having an ordered array of pits to be obtained in a short period of time.
摘要翻译： 一种制造微结构的方法，其中具有铝基板和存在于铝基板表面上的具有微孔阳极氧化膜的铝构件至少依次进行包括执行一个或多个循环的孔序处理 包括用于溶解阳极氧化膜直到阻挡层具有3至50nm的厚度的第一膜溶解处理和在第一膜溶解处理之后的阳极氧化处理的步骤; 以及用于溶解阳极化膜的第二膜溶解处理，使得微孔开口“a”的直径与微孔底部“b”（a / b）的高度“a / 2”处的微孔直径的比率为 在0.9〜1.1的范围内，由此得到其表面上形成微孔的微结构。 该制造方法能够在短时间内获得具有有序排列阵列的微结构。
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