摘要:
A method for fabricating a thin film pattern on a substrate, includes the steps of: forming a concave part on the substrate that conforms to the thin film pattern; and applying a function liquid into the concave part.
摘要:
A method for fabricating a thin film pattern on a substrate, includes the steps of: forming a concave part on the substrate that conforms to the thin film pattern; and applying a function liquid into the concave part.
摘要:
A method for fabricating a thin film pattern on a substrate, includes the steps of: forming a concave part on the substrate that conforms to the thin film pattern; and applying a function liquid into the concave part.
摘要:
A pattern forming method is provided which discharges droplets of a liquid material on a substrate and forms a film pattern W. The method comprises a first step of forming a central pattern W1 of the film pattern W on the substrate, a second step of forming a first side pattern W2 with respect to the central pattern W1, and a third step of forming a second side pattern W3 with respect to the central part W1.
摘要:
The invention provides a surface treatment method by which a substrate with desired uniform lyophilicity is obtained in order to enhance the formation of a film pattern by an ink-jet process; a surface-treated substrate obtained by the surface treatment; and a method of forming a film pattern.A surface of a substrate is subjected to lyophobic treatment by forming a self-assembled layer composed of organic molecules. The lyophobicity is then modified by ultraviolet irradiation or the like to obtain desired lyophobicity.
摘要:
A contact angle for a liquid on a substrate is set by a surface treatment process such that defects do not occur in a thin film pattern. In particular, the contact angle is set in a range of 15° to 45°. By doing this, it is possible to provide a device, a conductive thin film wiring device, and a method for forming a thin film pattern in which defects such as disconnections and short circuits can be prevented in a thin film pattern which is formed by an ink jet method.
摘要:
A process of providing a hydrophobic property to the surface of a plate, and a process of providing a hydrophilic property to the surface by irradiating energy light (radiation) on the surface of the plate, which is provided with the hydrophobic property are provided Variations in the accumulated illumination intensity of radiation on the surface of the plate are controlled to 20% or less.
摘要:
The invention provides an apparatus for fabricating a device, in which a high operation efficiency is maintained in a drying treatment for a multilayer-interconnection device. The device can also be fabricated inexpensively. An apparatus for fabricating a device has an inkjet unit that can dispose a liquid material on a substrate, and a preparatory dryer to blow a gas heated at a predetermined temperature to the substrate.
摘要:
A contact angle for a liquid on a substrate is set by a surface treatment process such that defects do not occur in a thin film pattern. In particular, the contact angle is set in a range of 15° to 45°. By doing this, it is possible to provide a device, a conductive thin film wiring device, and a method for forming a thin film pattern in which defects such as disconnections and short circuits can be prevented in a thin film pattern which is formed by an ink jet method.
摘要:
A process of providing a hydrophobic property to the surface of a plate, and a process of providing a hydrophilic property to the surface by irradiating energy light (radiation) on the surface of the plate, which is provided with the hydrophobic property are provided. Variations in the accumulated illumination intensity of radiation on the surface of the plate are controlled to 20% or less.