公开(公告)号：US5804467A

公开(公告)日：1998-09-08

申请号：US855647

申请日：1997-05-13

申请人： Toshimi Kawahara ,  Shinya Nakaseko ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai

发明人： Toshimi Kawahara ,  Shinya Nakaseko ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L21/568 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/49 ,  H01L2224/11003 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3011 ,  Y10T29/49146 ,  Y10T29/49171

摘要： A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.

摘要翻译： 半导体器件包括具有顶表面和底表面的衬底，安装在衬底的顶表面上的半导体元件和由树脂制成并封装半导体元件的树脂封装。 衬底包括至少一个树脂门孔，当通过树脂封装半导体元件时，能够通过树脂门孔从衬底的底表面引入树脂。

公开(公告)号：US6034428A

公开(公告)日：2000-03-07

申请号：US745203

申请日：1996-11-08

申请人： Toshimi Kawahara ,  Hiroyuki Ishiguro ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Shinya Nakaseko ,  Yoshitugu Katoh ,  Junichi Kasai

发明人： Toshimi Kawahara ,  Hiroyuki Ishiguro ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Shinya Nakaseko ,  Yoshitugu Katoh ,  Junichi Kasai

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H05K3/40 ,  H01L23/053

CPC分类号： H01L23/3121 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/49 ,  H05K3/4084 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K2201/0394 ,  H05K2203/0195 ,  H05K2203/063

摘要： A semiconductor device includes a semiconductor chip, and a multi-layered member connected to the semiconductor chip. The multi-layered member includes one or a plurality of wiring layers and one or a plurality of insulating layers alternately stacked. The one or the plurality of insulating layers have holes. The multi-layered member has electrode parts which include deformed portions of the above one or the plurality of wiring layers obtained by deforming the above one or the plurality of wiring layers via said holes.

摘要翻译： 半导体器件包括半导体芯片和连接到半导体芯片的多层构件。 多层构件包括交替堆叠的一个或多个布线层和一个或多个绝缘层。 一个或多个绝缘层具有孔。 多层构件具有电极部件，其包括通过所述孔使上述一个或多个布线层变形而获得的上述一个或多个布线层的变形部分。

公开(公告)号：US5679978A

公开(公告)日：1997-10-21

申请号：US330848

申请日：1994-10-24

申请人： Toshimi Kawahara ,  Shinya Nakaseko ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai

发明人： Toshimi Kawahara ,  Shinya Nakaseko ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H01L23/10

CPC分类号： H01L21/568 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/49 ,  H01L2224/11003 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3011 ,  Y10T29/49146 ,  Y10T29/49171

摘要： A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.

摘要翻译： 半导体器件包括具有顶表面和底表面的衬底，安装在衬底的顶表面上的半导体元件和由树脂制成并封装半导体元件的树脂封装。 衬底包括至少一个树脂门孔，当通过树脂封装半导体元件时，能够通过树脂门孔从衬底的底表面引入树脂。

公开(公告)号：US6111306A

公开(公告)日：2000-08-29

申请号：US944511

申请日：1997-10-06

申请人： Toshimi Kawahara ,  Sinya Nakaseko ,  Mitsunada Osawa ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai ,  Shinichirou Taniguchi ,  Yuji Sakurai

发明人： Toshimi Kawahara ,  Sinya Nakaseko ,  Mitsunada Osawa ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai ,  Shinichirou Taniguchi ,  Yuji Sakurai

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H01L23/02 ,  H01L23/15

CPC分类号： H01L21/568 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/11003 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49144 ,  Y10T29/53483

摘要： A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor element and having a hole which communicates to a space formed between the holding substrate and the frame body and the frame body and the holding substrate form a housing, a plurality of leads having inner lead portions connected to the semiconductor element and outer lead portions extending outside the frame body, and a resin filling the space and encapsulating the semiconductor element and the inner lead portions. All of the outer lead portions extend outside the housing from one side of the housing.

公开(公告)号：US06379997B1

公开(公告)日：2002-04-30

申请号：US09593658

申请日：2000-06-13

申请人： Toshimi Kawahara ,  Sinya Nakaseko ,  Mitsunada Osawa ,  Mayumi Osumi ,  Hiroyuki Ishiquro ,  Yoshitugu Katoh ,  Junichi Kasai ,  Shinichirou Taniguchi ,  Yuji Sakurai

发明人： Toshimi Kawahara ,  Sinya Nakaseko ,  Mitsunada Osawa ,  Mayumi Osumi ,  Hiroyuki Ishiquro ,  Yoshitugu Katoh ,  Junichi Kasai ,  Shinichirou Taniguchi ,  Yuji Sakurai

IPC分类号： H01L2144

CPC分类号： H01L21/568 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/11003 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49144 ,  Y10T29/53483 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01046 ,  H01L2924/3512 ,  H01L2924/00012

摘要： A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor element and having a hole which communicates to a space formed between the holding substrate and the frame body and the frame body and the holding substrate form a housing, a plurality of leads having inner lead portions connected to the semiconductor element and outer lead portions extending outside the frame body, and a resin filling the space and encapsulating the semiconductor element and the inner lead portions. All of the outer lead portions extend outside the housing from one side of the housing.

摘要翻译： 半导体器件包括半导体元件，保持半导体元件的保持基板，设置在保持基板上以围绕半导体元件并具有与保持基板和框体之间形成的空间连通的孔的框体，以及 框架体和保持基板形成壳体，多个引线具有连接到半导体元件的内部引线部分和在框架主体外部延伸的外部引线部分，以及填充该空间并将半导体元件和内部引线部分封装的树脂 。 所有外部引线部分从壳体的一侧延伸到壳体外部。

公开(公告)号：US06383842B1

公开(公告)日：2002-05-07

申请号：US09131367

申请日：1998-08-07

申请人： Akira Takashima ,  Mitsutaka Sato ,  Shinichirou Taniguchi

发明人： Akira Takashima ,  Mitsutaka Sato ,  Shinichirou Taniguchi

IPC分类号： H01L2144

CPC分类号： H01L23/49503 ,  H01L23/4951 ,  H01L23/49513 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/078 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of manufacturing a semiconductor device which includes a semiconductor chip and a plastic package of a thermosetting polymer, including the steps of performing an ultraviolet cleaning process on the bottom surface of the semiconductor chip and, encapsulating the semiconductor chip through a molding process. The thermosetting polymer of the plastic package fully or partially covers the bottom surface of the semiconductor chip.

摘要翻译： 一种制造半导体器件的方法，其包括半导体芯片和热固性聚合物的塑料封装，包括以下步骤：在半导体芯片的底表面上进行紫外线清洁处理，并通过模制工艺封装半导体芯片。 塑料封装的热固性聚合物完全或部分地覆盖半导体芯片的底表面。

公开(公告)号：US5821613A

公开(公告)日：1998-10-13

申请号：US919170

申请日：1997-08-28

申请人： Akira Takashima ,  Mitsutaka Sato ,  Shinichirou Taniguchi

发明人： Akira Takashima ,  Mitsutaka Sato ,  Shinichirou Taniguchi

IPC分类号： H01L23/28 ,  H01L21/304 ,  H01L21/56 ,  H01L23/495

CPC分类号： H01L23/49503 ,  H01L23/4951 ,  H01L23/49513 ,  H01L24/32 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/078 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/351

摘要： A method of manufacturing a semiconductor device which includes a semiconductor chip and a plastic package of a thermosetting polymer encapsulating the semiconductor chip through a molding process. The thermosetting polymer of the plastic package fully or partially covers a bottom surface of the semiconductor chip. An ultraviolet cleaning process is performed for cleaning the bottom surface of the semiconductor chip prior to the molding process.

摘要翻译： 一种制造半导体器件的方法，其包括半导体芯片和通过模制工艺封装半导体芯片的热固性聚合物的塑料封装。 塑料封装的热固性聚合物完全或部分地覆盖半导体芯片的底表面。 进行紫外线清洁处理，以在模制过程之前清洁半导体芯片的底表面。