公开(公告)号：US5804467A

公开(公告)日：1998-09-08

申请号：US855647

申请日：1997-05-13

申请人： Toshimi Kawahara ,  Shinya Nakaseko ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai

发明人： Toshimi Kawahara ,  Shinya Nakaseko ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L21/568 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/49 ,  H01L2224/11003 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3011 ,  Y10T29/49146 ,  Y10T29/49171

摘要： A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.

摘要翻译： 半导体器件包括具有顶表面和底表面的衬底，安装在衬底的顶表面上的半导体元件和由树脂制成并封装半导体元件的树脂封装。 衬底包括至少一个树脂门孔，当通过树脂封装半导体元件时，能够通过树脂门孔从衬底的底表面引入树脂。

公开(公告)号：US6034428A

公开(公告)日：2000-03-07

申请号：US745203

申请日：1996-11-08

申请人： Toshimi Kawahara ,  Hiroyuki Ishiguro ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Shinya Nakaseko ,  Yoshitugu Katoh ,  Junichi Kasai

发明人： Toshimi Kawahara ,  Hiroyuki Ishiguro ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Shinya Nakaseko ,  Yoshitugu Katoh ,  Junichi Kasai

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H05K3/40 ,  H01L23/053

CPC分类号： H01L23/3121 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/49 ,  H05K3/4084 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K2201/0394 ,  H05K2203/0195 ,  H05K2203/063

摘要： A semiconductor device includes a semiconductor chip, and a multi-layered member connected to the semiconductor chip. The multi-layered member includes one or a plurality of wiring layers and one or a plurality of insulating layers alternately stacked. The one or the plurality of insulating layers have holes. The multi-layered member has electrode parts which include deformed portions of the above one or the plurality of wiring layers obtained by deforming the above one or the plurality of wiring layers via said holes.

摘要翻译： 半导体器件包括半导体芯片和连接到半导体芯片的多层构件。 多层构件包括交替堆叠的一个或多个布线层和一个或多个绝缘层。 一个或多个绝缘层具有孔。 多层构件具有电极部件，其包括通过所述孔使上述一个或多个布线层变形而获得的上述一个或多个布线层的变形部分。

公开(公告)号：US5679978A

公开(公告)日：1997-10-21

申请号：US330848

申请日：1994-10-24

申请人： Toshimi Kawahara ,  Shinya Nakaseko ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai

发明人： Toshimi Kawahara ,  Shinya Nakaseko ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H01L23/10

CPC分类号： H01L21/568 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/49 ,  H01L2224/11003 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3011 ,  Y10T29/49146 ,  Y10T29/49171

摘要： A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.

摘要翻译： 半导体器件包括具有顶表面和底表面的衬底，安装在衬底的顶表面上的半导体元件和由树脂制成并封装半导体元件的树脂封装。 衬底包括至少一个树脂门孔，当通过树脂封装半导体元件时，能够通过树脂门孔从衬底的底表面引入树脂。

公开(公告)号：US6111306A

公开(公告)日：2000-08-29

申请号：US944511

申请日：1997-10-06

申请人： Toshimi Kawahara ,  Sinya Nakaseko ,  Mitsunada Osawa ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai ,  Shinichirou Taniguchi ,  Yuji Sakurai

发明人： Toshimi Kawahara ,  Sinya Nakaseko ,  Mitsunada Osawa ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai ,  Shinichirou Taniguchi ,  Yuji Sakurai

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H01L23/02 ,  H01L23/15

CPC分类号： H01L21/568 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/11003 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49144 ,  Y10T29/53483

摘要： A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor element and having a hole which communicates to a space formed between the holding substrate and the frame body and the frame body and the holding substrate form a housing, a plurality of leads having inner lead portions connected to the semiconductor element and outer lead portions extending outside the frame body, and a resin filling the space and encapsulating the semiconductor element and the inner lead portions. All of the outer lead portions extend outside the housing from one side of the housing.

公开(公告)号：US06379997B1

公开(公告)日：2002-04-30

申请号：US09593658

申请日：2000-06-13

申请人： Toshimi Kawahara ,  Sinya Nakaseko ,  Mitsunada Osawa ,  Mayumi Osumi ,  Hiroyuki Ishiquro ,  Yoshitugu Katoh ,  Junichi Kasai ,  Shinichirou Taniguchi ,  Yuji Sakurai

发明人： Toshimi Kawahara ,  Sinya Nakaseko ,  Mitsunada Osawa ,  Mayumi Osumi ,  Hiroyuki Ishiquro ,  Yoshitugu Katoh ,  Junichi Kasai ,  Shinichirou Taniguchi ,  Yuji Sakurai

IPC分类号： H01L2144

CPC分类号： H01L21/568 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/11003 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49144 ,  Y10T29/53483 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01046 ,  H01L2924/3512 ,  H01L2924/00012

摘要： A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor element and having a hole which communicates to a space formed between the holding substrate and the frame body and the frame body and the holding substrate form a housing, a plurality of leads having inner lead portions connected to the semiconductor element and outer lead portions extending outside the frame body, and a resin filling the space and encapsulating the semiconductor element and the inner lead portions. All of the outer lead portions extend outside the housing from one side of the housing.

摘要翻译： 半导体器件包括半导体元件，保持半导体元件的保持基板，设置在保持基板上以围绕半导体元件并具有与保持基板和框体之间形成的空间连通的孔的框体，以及 框架体和保持基板形成壳体，多个引线具有连接到半导体元件的内部引线部分和在框架主体外部延伸的外部引线部分，以及填充该空间并将半导体元件和内部引线部分封装的树脂 。 所有外部引线部分从壳体的一侧延伸到壳体外部。

公开(公告)号：US5844309A

公开(公告)日：1998-12-01

申请号：US754061

申请日：1996-12-03

申请人： Yukio Takigawa ,  Shigeaki Yagi ,  Toshimi Kawahara ,  Mitsunada Osawa ,  Hiroyuki Ishiguro ,  Shinya Nakaseko ,  Takashi Hozumi ,  Masaaki Seki

发明人： Yukio Takigawa ,  Shigeaki Yagi ,  Toshimi Kawahara ,  Mitsunada Osawa ,  Hiroyuki Ishiguro ,  Shinya Nakaseko ,  Takashi Hozumi ,  Masaaki Seki

IPC分类号： H01L21/58 ,  H01L23/10 ,  H01L23/053

CPC分类号： H01L24/83 ,  H01L23/10 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/351

摘要： An adhesive composition including: a main component comprising a resin material, a solvent for dissolving said main component, and a filler added to said main component, wherein said filler has a particle size so as to make a concavo-convex depth of a surface of said adhesive composition equal to or less than 15 .mu.m after said adhesive composition is applied to an adherend and dried in order to evaporate said solvent before a thermocompression process. The present invention also discloses a semiconductor device using the adhesive composition, an adhering method using the adhesive composition and a method for producing a semiconductor device using the adhesive composition.

摘要翻译： 一种粘合剂组合物，其包括：主要成分，其包含树脂材料，用于溶解所述主要成分的溶剂和添加到所述主要成分中的填料，其中所述填料具有使得其表面的凹凸深度 所述粘合剂组合物在所述粘合剂组合物施加到被粘物上之后等于或小于15μm，并干燥以在热压缩过程之前蒸发所述溶剂。 本发明还公开了一种使用粘合剂组合物的半导体器件，使用粘合剂组合物的粘合方法和使用该粘合剂组合物的半导体器件的制造方法。

公开(公告)号：US06472744B2

公开(公告)日：2002-10-29

申请号：US09084097

申请日：1998-05-26

申请人： Mitsutaka Sato ,  Tetsuya Fujisawa ,  Shigeyuki Maruyama ,  Junichi Kasai ,  Toshimi Kawahara ,  Toshio Hamano ,  Yoshihiro Kubota ,  Mitsunada Osawa ,  Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Hirohisa Matsuki

发明人： Mitsutaka Sato ,  Tetsuya Fujisawa ,  Shigeyuki Maruyama ,  Junichi Kasai ,  Toshimi Kawahara ,  Toshio Hamano ,  Yoshihiro Kubota ,  Mitsunada Osawa ,  Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Hirohisa Matsuki

IPC分类号： H01L2500

CPC分类号： H01L25/105 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2924/09701 ,  H01L2924/1533 ,  H01L2924/3025 ,  H01R12/82 ,  H05K7/1431 ,  H01L2924/00

摘要： A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.

摘要翻译： 半导体模块包括多个半导体器件，每个半导体器件包括承载有单个存储器半导体芯片的电路衬底和用于可分离地保持半导体器件的插座。

公开(公告)号：US06881611B1

公开(公告)日：2005-04-19

申请号：US09635124

申请日：2000-08-08

申请人： Norio Fukasawa ,  Toshimi Kawahara ,  Muneharu Morioka ,  Mitsunada Osawa ,  Yasuhiro Shinma ,  Hirohisa Matsuki ,  Masanori Onodera ,  Junichi Kasai ,  Shigeyuki Maruyama ,  Masao Sakuma ,  Yoshimi Suzuki ,  Masashi Takenaka

发明人： Norio Fukasawa ,  Toshimi Kawahara ,  Muneharu Morioka ,  Mitsunada Osawa ,  Yasuhiro Shinma ,  Hirohisa Matsuki ,  Masanori Onodera ,  Junichi Kasai ,  Shigeyuki Maruyama ,  Masao Sakuma ,  Yoshimi Suzuki ,  Masashi Takenaka

IPC分类号： B29C43/18 ,  H01L21/301 ,  H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H01L29/06 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/568 ,  B29C43/18 ,  B29C2043/3444 ,  B29C2043/3628 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/566 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L29/0657 ,  H01L2221/68377 ,  H01L2224/02371 ,  H01L2224/04105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/85001 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1005 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0134 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01051 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method includes a resin sealing step of placing, in a cavity 28 of a mold 20, a substrate 16 to which semiconductor elements 11 on which bumps 12 are arranged, a resin sealing step of supplying resin 35 to positions of the bumps 12 so that a resin layer 13 sealing the bumps 12 is formed, a protruding electrode exposing step of exposing at least ends of the bumps 12 sealed by the resin layer 13 so that ends of the bumps 12 are exposed from the resin layer 13, and a separating step of cutting the substrate 16 together with the resin layer 13 so that the semiconductor elements 11 are separated from each other.

摘要翻译： 一种方法包括：树脂密封步骤，在模具20的空腔28中，将布置有凸块12的半导体元件11的基板16设置在树脂密封步骤中，将树脂35供应到凸块12的位置，使得 形成密封凸块12的树脂层13，使由树脂层13密封的凸块12的至少端部露出使突出部12的端部从树脂层13露出的突出电极曝光工序，以及分离工序 与树脂层13一起切割基板16，使得半导体元件11彼此分离。

公开(公告)号：US06696754B2

公开(公告)日：2004-02-24

申请号：US10214306

申请日：2002-08-08

申请人： Mitsutaka Sato ,  Tetsuya Fujisawa ,  Shigeyuki Maruyama ,  Junichi Kasai ,  Toshimi Kawahara ,  Toshio Hamano ,  Yoshihiro Kubota ,  Mitsunada Osawa ,  Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Hirohisa Matsuki

发明人： Mitsutaka Sato ,  Tetsuya Fujisawa ,  Shigeyuki Maruyama ,  Junichi Kasai ,  Toshimi Kawahara ,  Toshio Hamano ,  Yoshihiro Kubota ,  Mitsunada Osawa ,  Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Hirohisa Matsuki

IPC分类号： H01L2334

CPC分类号： H01L25/105 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2924/09701 ,  H01L2924/1533 ,  H01L2924/3025 ,  H01R12/82 ,  H05K7/1431 ,  H01L2924/00

摘要： A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.

摘要翻译： 半导体模块包括多个半导体器件，每个半导体器件包括承载有单个存储器半导体芯片的电路衬底和用于可拆卸地保持半导体器件的插座。

公开(公告)号：US06329711B1

公开(公告)日：2001-12-11

申请号：US09200846

申请日：1998-11-30

申请人： Toshimi Kawahara ,  Mamoru Suwa ,  Masanori Onodera ,  Syuichi Monma ,  Shinya Nakaseko ,  Takashi Hozumi ,  Yoshiyuki Yoneda ,  Ryuji Nomoto

发明人： Toshimi Kawahara ,  Mamoru Suwa ,  Masanori Onodera ,  Syuichi Monma ,  Shinya Nakaseko ,  Takashi Hozumi ,  Yoshiyuki Yoneda ,  Ryuji Nomoto

IPC分类号： H01L2304

CPC分类号： H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/83385 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85664 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01082 ,  H01L2924/00012

摘要： A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding from a mounting surface of the resin package, metallic film parts provided to the resin projections, connecting members electrically connecting electrode pads on the semiconductor element and the metallic film parts, and connection pads extending from the metallic film parts, the connecting members being connected to the connection pads.

摘要翻译： 半导体器件包括半导体元件，密封半导体元件的树脂封装，从树脂封装的安装表面突出的树脂突起，设置在树脂突起上的金属膜部分，将半导体元件上的电极焊盘电连接到金属 薄膜部分和从金属薄膜部分延伸的连接焊盘，连接部件连接到连接焊盘。