公开(公告)号：US06602929B1

公开(公告)日：2003-08-05

申请号：US09635622

申请日：2000-08-10

申请人： Toshio Ohba ,  Shouhei Kozakai ,  Kazunori Kondo

发明人： Toshio Ohba ,  Shouhei Kozakai ,  Kazunori Kondo

IPC分类号： C08G1867

CPC分类号： C09D175/16 ,  C08G18/672 ,  C08G18/48

摘要： A liquid radiation-curable resin composition comprising the reaction product obtained by reacting (A) a polyether having a (meth)acryloyl group and a hydroxyl group at opposite ends with (B) a diisocyanate having two isocyanate groups in a molar ratio from 1.8/1 to 2.2/1 has a low viscosity enough to coat on an optical fiber at a high speed. Upon curing, it forms a coating having a minimized water absorption on the optical fiber.

摘要翻译： 一种液体辐射固化树脂组合物，其包含通过使（A）具有（甲基）丙烯酰基的聚醚和相对端的羟基与（B）具有两个异氰酸酯基的二异氰酸酯以摩尔比为1.8 / 1至2.2 / 1具有足够低的粘度以高速涂覆在光纤上。 在固化时，其形成在光纤上具有最小吸水率的涂层。

公开(公告)号：US06668122B2

公开(公告)日：2003-12-23

申请号：US10073158

申请日：2002-02-13

申请人： Shouhei Kozakai ,  Masatoshi Asano ,  Shigeru Konishi ,  Toshio Ohba

发明人： Shouhei Kozakai ,  Masatoshi Asano ,  Shigeru Konishi ,  Toshio Ohba

IPC分类号： G02B602

CPC分类号： C08G18/672 ,  C03C25/106 ,  C03C25/1065 ,  C03C25/12 ,  C08G18/6674 ,  C08G18/48

摘要： In a coated optical fiber comprising a quartz glass fiber, a primary coating and a secondary coating, the secondary coating is formed by curing a resin composition comprising (A) 20-90 wt % of a polyurethane (meth)acrylate oligomer which is synthesized from an alicyclic polyisocyanate, contains 5-90 wt % of a polyurethane (meth)acrylate oligomer having a Mn of up to 1,000, and has an overall Mn of up to 10,000, and (B) 80-10 wt % of an ethylenically unsaturated compound, with electron beams accelerated at 50-125 kV. The coated optical fiber has a minimized transmission loss.

公开(公告)号：US07820742B2

公开(公告)日：2010-10-26

申请号：US11706272

申请日：2007-02-15

申请人： Nobuhiro Ichiroku ,  Shouhei Kozakai

发明人： Nobuhiro Ichiroku ,  Shouhei Kozakai

IPC分类号： B32B27/38 ,  C08K3/36 ,  C08L63/02 ,  C08L79/08

CPC分类号： C09J163/00 ,  C08L63/00 ,  C08L79/08 ,  C08L2666/14 ,  C08L2666/20 ,  C09J183/10 ,  C08L2666/22

摘要： Provided is an adhesive composition, which exhibits a melt viscosity at 40 to 80° C. of not more than 10,000 Pa·s, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80° C. to (T+50)° C., exhibits a melt viscosity at a temperature of 100° C. to (T+30)° C. that is within a range from 100 to 10,000 Pa·s (wherein, T represents the curing start temperature for the composition). The adhesive composition is capable of forming a cured product that exhibits excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance. The adhesive composition is useful for providing an adhesive film and for producing a semiconductor device.

摘要翻译： 本发明提供一种粘合剂组合物，其在40〜80℃下的熔融粘度为10000Pa·s以下，在80℃以上的温度下加热1分钟〜2小时后， 至（T + 50）℃，在100℃〜100℃的范围内，在100℃〜（T + 30℃）的温度下具有熔融粘度（其中，T表示 组合物的固化开始温度）。 粘合剂组合物能够形成具有精细图案化电路的基材的优异填充性，低温下优异的层压性能，低弹性模量和优异的粘合性和耐热性水平的固化产物。 粘合剂组合物可用于提供粘合剂膜和用于制造半导体器件。

公开(公告)号：US5478907A

公开(公告)日：1995-12-26

申请号：US359383

申请日：1994-12-20

申请人： Shouhei Kozakai

发明人： Shouhei Kozakai

IPC分类号： G02B6/00 ,  C08L83/04 ,  C08L83/05 ,  C08L83/07 ,  G02B1/04 ,  C08G77/08

CPC分类号： C08L83/04 ,  G02B1/046 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  Y10T428/2962

摘要： An organopolysiloxane composition which is adapted for use as a core of plastic optical fibers comprises (A) an organopolysiloxane having a unit of the following general formula (1)RSiO.sub.1.5 (1)wherein R represents a substituted or unsubstituted monovalent hydrocarbon, and also having not less than 0.05 alkenyl groups directly bonded to the silicon atom thereof per unit silicon atom, (B) an organosilicon compound of the following general formula (2) ##STR1## wherein R.sup.1 's independently represent a monovalent hydrocarbon group, Q represents a divalent aromatic hydrocarbon group, and a is an integer of from 1 to 3, and (C) a platinum catalyst for crosslinking between the organopolysiloxane and the organosilicon compound. An optical fiber comprising a core made of a cured product of the composition is also described.

摘要翻译： 适用于塑料光纤芯的有机聚硅氧烷组合物包含（A）具有下列通式（1）单元的有机聚硅氧烷：RSiO1.5（1）其中R表示取代或未取代的单价烃， 具有不少于0.05个与单位硅原子的硅原子键合的烯基，（B）下述通式（2）的有机硅化合物其中，R 1独立地表示一价烃基，Q表示 二元芳香族烃基，a为1〜3的整数，（C）在有机聚硅氧烷与有机硅化合物之间交联的铂催化剂。 还描述了包含由该组合物的固化产物制成的芯的光纤。

公开(公告)号：US20070090299A1

公开(公告)日：2007-04-26

申请号：US11583699

申请日：2006-10-20

申请人： Shouhei Kozakai ,  Nobuhiro Ichiroku

发明人： Shouhei Kozakai ,  Nobuhiro Ichiroku

IPC分类号： G01T1/24 ,  G01T1/20 ,  H01L27/146 ,  H01L25/00 ,  H01L27/00

CPC分类号： C09J163/00 ,  C08L63/00 ,  C08L79/08 ,  C08L83/00 ,  C08L2666/14 ,  C08L2666/20 ,  C08L2666/22 ,  C09J7/22 ,  C09J7/38 ,  C09J179/08 ,  C09J183/10 ,  C09J2201/36 ,  C09J2201/622 ,  C09J2479/08 ,  C09J2483/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10T428/31663 ,  Y10T428/31721 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： An adhesive composition comprising 5 to 60 wt % of (A) a polyimidesilicone resin 5 to 60 wt % of (B) an epoxy resin having a softening point of 80° C. or lower, 0.001 to 20 wt % of (C) at least one epoxy resin curing catalyst selected from imidazole compounds and dicyandiamide 20 to 70 wt % of (D) spherical silica having an average diameter of 0.1 to 10 μm, and 5 to 30 wt % of (E) spherical fine particles of silicone rubber composite, wt % being based on a total weight of the composition.

摘要翻译： 一种粘合剂组合物，其包含5至60重量％的（A）聚酰亚胺硅酮树脂5至60重量％的（B）软化点为80℃或更低的环氧树脂，（C）在 选自咪唑化合物和双氰胺的至少一种环氧树脂固化催化剂20至70重量％的（D）平均直径为0.1至10微米的球形二氧化硅和5至30重量％的（E）球形微粒硅橡胶复合材料 ，wt％是基于组合物的总重量。

公开(公告)号：US07125948B2

公开(公告)日：2006-10-24

申请号：US10676146

申请日：2003-10-02

申请人： Shouhei Kozakai ,  Akio Suzuki

发明人： Shouhei Kozakai ,  Akio Suzuki

IPC分类号： C08G77/12

CPC分类号： C09J183/14 ,  C08K5/14 ,  C08L83/00 ,  C09J183/10

摘要： A silicone adhesive comprises (A) a reaction mixture obtained by subjecting a partially condensed mixture of (i) a hydroxy-terminated diorganopolysiloxane and (ii) an organopolysiloxane copolymer having hydroxyl and alkenyl radicals and comprising R33SiO1/2 units and SiO2 units, and (iii) a silicon compound having a silicon atom-bonded hydrogen atom and a silicon atom-bonded alkoxy radical to addition reaction in the presence of a platinum catalyst and (B) a crosslinking agent. The silicone adhesive exhibits at the initial a tackiness sufficient to fixedly secure a substrate. By press bonding another substrate to the adhesive-bearing substrate and heating them, the substrates can be firmly bonded together.

摘要翻译： 硅氧烷粘合剂包含（A）通过使（i）羟基封端的二有机聚硅氧烷和（ii）具有羟基和烯基的有机聚硅氧烷共聚物的部分冷凝的混合物（R 3 3） （iii）具有硅原子键合氢原子和硅原子的硅化合物 在铂催化剂和（B）交联剂的存在下进行加成反应。 硅氧烷粘合剂在初始时表现出足以固定基材的粘性。 通过将另一基板压接到承载基材并加热它们，可以将基板牢固地结合在一起。

公开(公告)号：US20050065296A1

公开(公告)日：2005-03-24

申请号：US10942077

申请日：2004-09-16

申请人： Shouhei Kozakai ,  Nobuhiro Ichiroku ,  Akio Suzuki ,  Toshio Shiobara

发明人： Shouhei Kozakai ,  Nobuhiro Ichiroku ,  Akio Suzuki ,  Toshio Shiobara

IPC分类号： C09J7/02 ,  C08L63/00 ,  C08L79/08 ,  C09J7/00 ,  C09J163/00 ,  C09J177/00 ,  C09J179/08 ,  C09J183/10 ,  H01L21/52 ,  C08L83/04

CPC分类号： C09J179/08 ,  C08L63/00 ,  C08L79/085 ,  C08L2666/14 ,  C08L2666/20 ,  C08L2666/22 ,  C09J7/10 ,  C09J163/00 ,  C09J183/10 ,  C09J2463/00 ,  C09J2479/08 ,  Y10T428/31511 ,  Y10T428/31663 ,  Y10T428/31721 ,  Y10T428/31786 ,  Y10T428/31855

摘要： An adhesive composition is provided comprising (A) a polyimide resin containing a diorganopolysiloxane linkage having vinyl groups as organic substituent groups on the backbone, (B) an epoxy resin, and (C) an epoxy resin-curing catalyst. An adhesive film prepared from the adhesive composition has a high bond strength to various substrates and to encapsulating resins when thermocompression bonded and heat cured thereto, and possesses a low modulus of elasticity and high heat resistance, ensuring manufacture of resin packaged semiconductor devices with high reliability.

摘要翻译： 提供了一种粘合剂组合物，其包含（A）在主链上含有具有乙烯基作为有机取代基的二有机聚硅氧烷键的聚酰亚胺树脂，（B）环氧树脂和（C）环氧树脂固化催化剂。 由粘合剂组合物制备的粘合剂膜对于各种基材具有高的粘合强度，并且当热压粘合并热固化时具有高的粘合强度，并且具有低弹性模量和高耐热性，确保制造具有高可靠性的树脂封装的半导体器件 。

公开(公告)号：US6075065A

公开(公告)日：2000-06-13

申请号：US985630

申请日：1997-12-04

申请人： Kyuya Yamazaki ,  Mitsuhiro Nishimura ,  Takashi Uemura ,  Akira Yamamoto ,  Shouhei Kozakai ,  Masatoshi Asano

发明人： Kyuya Yamazaki ,  Mitsuhiro Nishimura ,  Takashi Uemura ,  Akira Yamamoto ,  Shouhei Kozakai ,  Masatoshi Asano

IPC分类号： C03C25/10 ,  C08F2/46 ,  C08F2/50 ,  C08F290/06 ,  C08K5/5397 ,  C09J4/06 ,  C08G2/46 ,  C08J3/28

CPC分类号： C08K5/5397 ,  C03C25/106 ,  C08F290/067 ,  C09J4/06

摘要： The invention provides a photocurable resin composition which inhibits the deactivation of a bisacylphosphine oxide-series photopolymerization initiator and is useful for coating optical fibers. The photocurable resin composition comprises (A) a polyurethane (meth)acrylate oligomer, (B) an ethylenically unsaturated compound, (C) a bisacylphosphine oxide-series photopolymerization initiator, and (D) a tertiary amine and no tin component. Incorporation of the component (D) inhibits the decomposition and deactivation of the component (C). The component (A) may contain an aliphatic C.sub.14-40 polyol (hydrogenated dimerdiol, 12-hydroxystearyl alcohol) as a polyol component. This resin composition is used for a primary coating of a glass fiber or an indirect coating of an optical fiber through the primary layer, the coating layer being cured by light irradiation to provide an optical fiber coated with the resin composition.

摘要翻译： 本发明提供一种抑制双酰基氧化膦系光聚合引发剂失活的光固化性树脂组合物，可用于涂布光纤。 光固化性树脂组合物包含（A）聚氨酯（甲基）丙烯酸酯低聚物，（B）烯键式不饱和化合物，（C）双酰基氧化膦系光聚合引发剂，（D）叔胺和锡组分。 组分（D）的掺入抑制组分（C）的分解和失活。 组分（A）可以含有作为多元醇组分的脂肪族C14-40多元醇（氢化二聚体二醇，12-羟基硬脂醇）。 该树脂组合物用于通过初级层玻璃纤维的初级涂层或光纤的间接涂层，通过光照射固化涂层，以提供涂覆有树脂组合物的光纤。

公开(公告)号：US07488539B2

公开(公告)日：2009-02-10

申请号：US11583699

申请日：2006-10-20

申请人： Shouhei Kozakai ,  Nobuhiro Ichiroku

发明人： Shouhei Kozakai ,  Nobuhiro Ichiroku

IPC分类号： B32B9/04 ,  B32B27/00 ,  B32B27/06

CPC分类号： C09J163/00 ,  C08L63/00 ,  C08L79/08 ,  C08L83/00 ,  C08L2666/14 ,  C08L2666/20 ,  C08L2666/22 ,  C09J7/22 ,  C09J7/38 ,  C09J179/08 ,  C09J183/10 ,  C09J2201/36 ,  C09J2201/622 ,  C09J2479/08 ,  C09J2483/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10T428/31663 ,  Y10T428/31721 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： An adhesive composition comprising 5 to 60 wt % of (A) a polyimidesilicone resin 5 to 60 wt % of (B) an epoxy resin having a softening point of 80° C. or lower, 0.001 to 20 wt % of (C) at least one epoxy resin curing catalyst selected from imidazole compounds and dicyandiamide 20 to 70 wt % of (D) spherical silica having an average diameter of 0.1 to 10 μm, and 5 to 30 wt % of (E) spherical fine particles of silicone rubber composite, wt % being based on a total weight of the composition.

摘要翻译： 一种粘合剂组合物，其包含5至60重量％的（A）聚酰亚胺硅酮树脂5至60重量％的（B）软化点为80℃或更低的环氧树脂，（C）在 选自咪唑化合物和双氰胺的至少一种环氧树脂固化催化剂20至70重量％的（D）平均直径为0.1至10微米的球形二氧化硅和5至30重量％的（E）球形微粒硅橡胶复合材料 ，wt％是基于组合物的总重量。

公开(公告)号：US20070191552A1

公开(公告)日：2007-08-16

申请号：US11706272

申请日：2007-02-15

申请人： Nobuhiro Ichiroku ,  Shouhei Kozakai

发明人： Nobuhiro Ichiroku ,  Shouhei Kozakai

IPC分类号： C08L83/04 ,  C08L63/00 ,  C08G77/455

CPC分类号： C09J163/00 ,  C08L63/00 ,  C08L79/08 ,  C08L2666/14 ,  C08L2666/20 ,  C09J183/10 ,  C08L2666/22

摘要： Provided is an adhesive composition, which exhibits a melt viscosity at 40 to 80° C. of not more than 10,000 Pa·s, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80° C. to (T+50)° C., exhibits a melt viscosity at a temperature of 100° C. to (T+30)° C. that is within a range from 100 to 10,000 Pa·s (wherein, T represents the curing start temperature for the composition). The adhesive composition is capable of forming a cured product that exhibits excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance. The adhesive composition is useful for providing an adhesive film and for producing a semiconductor device.

摘要翻译： 提供一种粘合剂组合物，其在40〜80℃下的熔融粘度为10000Pa·s以下，在80℃以上的温度下加热1分钟〜2小时后， 至（T + 50）℃，在100℃至（T + 30）℃的温度下显示出在100至10,000Pa·s范围内的熔体粘度（其中，T表示 组合物的固化开始温度）。 粘合剂组合物能够形成具有精细图案化电路的基材的优异填充性，低温下优异的层压性能，低弹性模量和优异的粘合性和耐热性水平的固化产物。 粘合剂组合物可用于提供粘合剂膜和用于制造半导体器件。