摘要:
According to one aspect of the present invention, provided is a method of manufacturing a semiconductor device, including: forming a first metal film on a substrate having a recessed portion in a surface thereof, by a plating method so as to bury the first metal film in at least part of the recessed portion; forming a second metal film on the first metal film by a film deposition method different from the plating method, the second metal film including, as a main component, a metal that is a main component of the first metal film and containing an impurity whose concentration is lower than concentration of an impurity contained in the first metal film; heat-treating the first and second metal films; and removing the first and second metal films except portions buried in the recessed portion.
摘要:
According to an embodiment of the present invention, a plating apparatus, including: a plating solution tank configured to store a plating solution; a holder configured to hold a substrate on which a seed layer is formed in said plating solution tank; a first anode disposed in said plating solution tank, composed of a more anodic material in its oxidation-reduction potential than the oxidation-reduction potential of a metal composing the seed layer, and electrically connectable to the seed layer of the substrate held by said holder; and a second anode disposed in said plating solution tank, capable of applying a voltage between the seed layer of the substrate held by holder, is provided.
摘要:
A thin display apparatus equipped with a video display panel controls rise in temperature of a disk drive by heat-transfer from high temperature internals of the apparatus. A thermal insulating recess is formed in a face of a rear side casing which faces a disk drive unit, and a surface of the disk drive unit mounted on the rear side casing seals the thermal insulating recess. An area of the thermal insulating recess sealed by the disk drive unit becomes a thermal insulating layer between the rear side casing and the disk drive unit, and the thermal insulating layer interrupts thermal transfer from the high temperature internals of the apparatus to the disk drive unit.
摘要:
A method of manufacturing a semiconductor device, including the following processes of forming a structure in which a barrier metal containing at least of Ti and Ta and a copper wiring are exposed on its surface, or a structure in which at least one substance selected from the group consisting of Ti, W, and Cu and Al are exposed on its surface, above a semiconductor substrate, and supplying a hydrogen-dissolved solution dissolving hydrogen gas to the surface of the structure.
摘要:
A case of an airbag unit has a case body for forming a storage room for accommodating an airbag. The case body has a bottom section, a pair of first side walls, and a pair of second side walls. The case also has a movable component disposed adjacent to an outer surface of one of the first side walls, and retractable toward a base end along the case body in response to an external force applied to the case. One of the first side walls has a plurality of pillars extending upwardly from the bottom to form cut-off portions therebetween extending downwardly from the upper opening.
摘要:
In order reduce the number of components of a horn switch device that is mounted to a steering wheel for vehicles, an airbag module of a steering device is constructed such that guide nuts are used as both fixing means for fixing a link mechanism to a retainer and fixing means for fixing an inflator to the retainer.
摘要:
A semiconductor wafer including an underlying layer including an insulating film having at least one recess therein and a metallic material layer formed over a top surface of the underlying layer and filling the recess, on a semiconductor substrate, is subjected to a polishing treatment while supplying a basic CMP slurry containing metal ions on the semiconductor wafer to at least partially remove the metallic material layer. Then, an organic acid which chelates the metal ions is added to the basic CMP slurry, and polishing is conducted, using the organic acid-added CMP slurry, until a surface of the insulating film is exposed.
摘要:
A television receiver (3) is a portable display device having a handle (not illustrated) in which a power receiving coil (8) for contactless power supply is embedded.
摘要:
There is provided an airbag folding method for folding an airbag. The method includes in the following order: (a) folding the inner panel and the outer panel into a symmetrical substantially rectangular shape such that a groove of the concave region is located along a center line, wherein the center line passes through a center of the introduction port and symmetrically divides the inner and outer panels; (b) folding the inner and outer panels along fold lines from right and left edges thereof toward the center line, wherein the fold lines are substantially parallel to the center line; and (c) folding and rolling up the inner and outer panels from both ends of the center line toward the introduction port.
摘要:
The positioning of an airbag plate with respect to an inflator is achieved so as to prevent the generation of a rattle that may otherwise be caused by vibrations during vehicle travel. The bottom side of a column-shaped inflator that injects pressurized fluid is supported by a retainer. An opening edge of an airbag body is clamped between an airbag plate and the retainer when the airbag plate, which is located on the upper side of the inflator, is engaged with the retainer. The edge of the bottom opening of the airbag body is clamped between the airbag plate and the inflator. In one embodiment, shoulders, which are provided on the airbag plate, abut both ends of the inflator. In another embodiment, tongue strips, which are provided on the airbag plate, abut both ends of the inflator.