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17 条记录 (耗时 0.022 秒)

    Thermosensitive deformation apparatus
    4.
    发明授权
    Thermosensitive deformation apparatus 有权

    公开(公告)号：US11955205B2

    公开(公告)日：2024-04-09

    申请号：US13375167

    申请日：2010-05-21

    申请人： Yoshimitsu Oda ,  Masaaki Ishio

    发明人： Yoshimitsu Oda ,  Masaaki Ishio

    IPC分类号： G12B1/02 ,  B32B15/01 ,  C22C38/08 ,  C22C38/12 ,  C22C38/40

    CPC分类号： G12B1/02 ,  B32B15/011 ,  C22C38/08 ,  C22C38/12 ,  C22C38/40 ,  Y10T428/12465

    摘要： A high-temperature bimetal capable of being inhibited from considerably shifting from an original position when the temperature has fallen to an ordinary temperature is provided. This high-temperature bimetal (1) includes a high thermal expansion layer (2) made of austenitic stainless steel and a low thermal expansion layer (3) made of a thermosensitive magnetic metal having a Curie point and bonded to the high thermal expansion layer. The high-temperature bimetal is employed over both a high temperature range of not less than the Curie point and a low temperature range of less than the Curie point, while an upper limit of operating temperatures in the high temperature range of not less than the Curie point is at least 500° C.

    Negative-electrode terminal for cell
    5.
    发明授权
    Negative-electrode terminal for cell 有权
    电池用负极端子

    公开(公告)号：US09017871B2

    公开(公告)日：2015-04-28

    申请号：US14236289

    申请日：2012-08-01

    申请人： Yoshimitsu Oda ,  Masaaki Ishio

    发明人： Yoshimitsu Oda ,  Masaaki Ishio

    IPC分类号： H01M2/30 ,  H01M2/02 ,  H01M2/06 ,  H01M2/20 ,  H01M2/26

    CPC分类号： H01M2/30 ,  H01M2/024 ,  H01M2/06 ,  H01M2/206 ,  H01M2/263 ,  H01M2/305

    摘要： A negative-electrode terminal for a cell in which separation between a first metal layer and a second metal layer hardly takes place is provided by suppressing excess formation of an intermetallic compound on a bond interface between the first metal layer and the second metal layer. This negative-electrode terminal for a cell includes a clad portion formed by bonding a first metal layer made of Al or an Al alloy and a second metal layer containing Ni and Cu and consisting of one or a plurality of layers to each other. The first metal layer includes a connected region connected with a cell terminal connecting plate and a stacked region adjacent to the connected region on the side of the same surface, while the second metal layer is bonded to the first metal layer in the stacked region and configured to be connectable to cell negative electrodes of cells.

    摘要翻译： 通过抑制金属间化合物在第一金属层和第二金属层之间的键合界面上的过量形成，提供了几乎不发生第一金属层和第二金属层之间的间隔的电池的负极端子。 用于电池的负极端子包括通过将由Al或Al合金制成的第一金属层和包含Ni和Cu的第二金属层彼此结合并由一个或多个层组成的包层部分。 第一金属层包括与电池端子连接板连接的连接区域和与相同表面侧的连接区域相邻的堆叠区域，而第二金属层在堆叠区域中接合到第一金属层并且被配置 可连接到细胞的细胞负极。

    ALUMINUM COPPER CLAD MATERIAL
    7.
    发明申请
    ALUMINUM COPPER CLAD MATERIAL 有权
    铝铜箔材料

    公开(公告)号：US20130071686A1

    公开(公告)日：2013-03-21

    申请号：US13701677

    申请日：2011-06-02

    申请人： Yoshimitsu Oda ,  Masaaki Ishio ,  Akio Hashimoto ,  Kenji Ikeuchi

    发明人： Yoshimitsu Oda ,  Masaaki Ishio ,  Akio Hashimoto ,  Kenji Ikeuchi

    IPC分类号： B23K20/02 ,  B32B15/01

    CPC分类号： C21D9/0068 ,  B23K20/02 ,  B32B15/017 ,  C21D1/26 ,  C22C9/00 ,  C22C9/04 ,  C22C21/00 ,  C22C21/08 ,  C22C21/10 ,  C22C21/14 ,  C22C21/16 ,  C22C21/18 ,  C22F1/04 ,  C22F1/047 ,  C22F1/053 ,  C22F1/057 ,  C22F1/08 ,  Y10T428/1275

    摘要： An aluminum copper clad material has excellent bonding strength and includes an aluminum layer and a copper layer that are bonded without a nickel layer interposed therebetween.The aluminum layer and the copper layer that are diffusion-bonded via an Al—Cu intermetallic compound layer. The copper layer satisfies Dcs≦0.5×Dcc, where Dcc represents the average crystal grain size of crystal grains in a central portion in the thickness direction of the copper layer, and Dcs represents the average crystal grain size of an interface adjacent portion C2 in the copper layer that is about 0.5 μm apart from the interface between the copper layer and the intermetallic compound layer. The intermetallic compound layer has an average thickness of about 0.5 μm to about 10 μm.

    摘要翻译： 铝铜合金材料具有优异的接合强度，并且包括铝层和铜层，其间没有镍层接合。 通过Al-Cu金属间化合物层扩散接合的铝层和铜层。 铜层满足Dcs＆nlE; 0.5×Dcc，其中Dcc表示铜层的厚度方向的中心部分的晶粒的平均晶粒尺寸，Dcs表示铜层的相邻部分C2的界面的平均晶粒尺寸 铜层与铜层和金属间化合物层之间的界面分开约0.5μm。 金属间化合物层的平均厚度为约0.5μm〜约10μm。

    Aluminum copper clad material
    8.
    发明授权
    Aluminum copper clad material 有权
    铝铜包材

    公开(公告)号：US09266188B2

    公开(公告)日：2016-02-23

    申请号：US13701677

    申请日：2011-06-02

    申请人： Yoshimitsu Oda ,  Masaaki Ishio ,  Akio Hashimoto ,  Kenji Ikeuchi

    发明人： Yoshimitsu Oda ,  Masaaki Ishio ,  Akio Hashimoto ,  Kenji Ikeuchi

    IPC分类号： B32B15/20 ,  B23K20/02 ,  B32B15/01

    CPC分类号： C21D9/0068 ,  B23K20/02 ,  B32B15/017 ,  C21D1/26 ,  C22C9/00 ,  C22C9/04 ,  C22C21/00 ,  C22C21/08 ,  C22C21/10 ,  C22C21/14 ,  C22C21/16 ,  C22C21/18 ,  C22F1/04 ,  C22F1/047 ,  C22F1/053 ,  C22F1/057 ,  C22F1/08 ,  Y10T428/1275

    摘要： An aluminum copper clad material has excellent bonding strength and includes an aluminum layer and a copper layer that are bonded without a nickel layer interposed therebetween. The aluminum layer and the copper layer are diffusion-bonded via an Al—Cu intermetallic compound layer. The copper layer satisfies Dcs≦0.5×Dcc, where Dcc represents the average crystal grain size of crystal grains in a central portion in the thickness direction of the copper layer, and Dcs represents the average crystal grain size of an interface adjacent portion C2 in the copper layer that is about 0.5 μm apart from the interface between the copper layer and the intermetallic compound layer. The intermetallic compound layer has an average thickness of about 0.5 μm to about 10 μm.

    摘要翻译： 铝铜合金材料具有优异的接合强度，并且包括铝层和铜层，其间没有镍层接合。 铝层和铜层通过Al-Cu金属间化合物层进行扩散接合。 铜层满足Dcs＆nlE; 0.5×Dcc，其中Dcc表示铜层的厚度方向的中心部分的晶粒的平均晶粒尺寸，Dcs表示铜层的相邻部分C2的界面的平均晶粒尺寸 铜层与铜层和金属间化合物层之间的界面分开约0.5μm。 金属间化合物层的平均厚度为约0.5μm〜约10μm。

    HIGH-TEMPERATURE BIMETAL
    9.
    发明申请
    HIGH-TEMPERATURE BIMETAL 审中-公开
    高温双金属

    公开(公告)号：US20120077056A1

    公开(公告)日：2012-03-29

    申请号：US13375167

    申请日：2010-05-21

    申请人： Yoshimitsu Oda ,  Masaaki Ishio

    发明人： Yoshimitsu Oda ,  Masaaki Ishio

    IPC分类号： B32B15/01

    CPC分类号： G12B1/02 ,  B32B15/011 ,  C22C38/08 ,  C22C38/12 ,  C22C38/40 ,  Y10T428/12465

    摘要： A high-temperature bimetal capable of being inhibited from considerably shifting from an original position when the temperature has fallen to an ordinary temperature is provided. This high-temperature bimetal (1) includes a high thermal expansion layer (2) made of austenitic stainless steel and a low thermal expansion layer (3) made of a thermosensitive magnetic metal having a Curie point and bonded to the high thermal expansion layer. The high-temperature bimetal is employed over both a high temperature range of not less than the Curie point and a low temperature range of less than the Curie point, while an upper limit of operating temperatures in the high temperature range of not less than the Curie point is at least 500° C.

    摘要翻译： 提供了一种高温双金属，当温度降至常温时，可以抑制其从初始位置的显着偏移。 该高温双金属（1）包括由奥氏体不锈钢制成的高热膨胀层（2）和具有居里点的热敏磁性金属制成的低热膨胀层（3），并与高热膨胀层接合。 在不低于居里点的高温范围和小于居里点的低温范围内使用高温双金属，而在不低于居里的高温范围内的工作温度的上限 点至少为500°C

    Connection plate for battery terminals and method for manufacturing connection plate for battery terminals
    10.
    发明授权
    Connection plate for battery terminals and method for manufacturing connection plate for battery terminals 有权
    电池端子用连接板及电池端子用连接板的制造方法

    公开(公告)号：US09350007B2

    公开(公告)日：2016-05-24

    申请号：US13981768

    申请日：2012-01-19

    申请人： Yoshimitsu Oda ,  Masaharu Yamamoto ,  Masaaki Ishio

    发明人： Yoshimitsu Oda ,  Masaharu Yamamoto ,  Masaaki Ishio

    IPC分类号： H01M2/20 ,  H01R11/11 ,  H01M10/0525

    CPC分类号： H01M2/202 ,  H01M2/206 ,  H01M10/0525 ,  H01R11/11 ,  Y02T10/7011 ,  Y10T29/49224

    摘要： A connection plate for battery terminals capable of inhibiting a first member and a second member from being detached from each other is provided. This bus bar 2 (connection plate for battery terminals) includes a first member (3) including a first hole (30) and an embedding hole (31), made of first metal and a second member (4) having a second hole (42), including a base (40) made of second metal, embedded in the embedding hole of the first member, while an intermetallic compound layer (5) containing at least one of the first metal and the second metal is formed on an interface between the embedding hole of the first member and the second member.

    摘要翻译： 提供了能够抑制第一构件和第二构件彼此分离的用于电池端子的连接板。 该汇流条2（电池端子用连接板）具备由第一金属构成的具备第一孔（30）和嵌入孔（31）的第一构件（3）和具有第二孔（42）的第二构件 ），包括嵌入在第一构件的嵌入孔中的由第二金属制成的基座（40），同时在第一金属和第二金属之间的界面上形成包含第一金属和第二金属中的至少一个的金属间化合物层（5） 第一构件和第二构件的嵌入孔。