公开(公告)号：US20050139389A1

公开(公告)日：2005-06-30

申请号：US11066153

申请日：2005-02-28

申请人： Tsuyoshi Yamamoto ,  Mitsuo Suehiro ,  Hiroshi Yamada

发明人： Tsuyoshi Yamamoto ,  Mitsuo Suehiro ,  Hiroshi Yamada

IPC分类号： H01L29/78 ,  H01L21/60 ,  H05K3/30 ,  H05K3/34 ,  H05K1/18

CPC分类号： H05K3/305 ,  H01L2224/29035 ,  H01L2224/29036 ,  H01L2224/73103 ,  H01L2224/73204 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/0129 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0182 ,  H05K2203/0475 ,  H05K2203/1105 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49169 ,  H01L2924/00012

摘要： When an electronic component is mounted on a substrate, the electronic component is first placed on the substrate with a solid support interposed between the electronic component and the substrate. The solid support serves to space a terminal conductor of the electronic component from a corresponding terminal pad on the substrate. A conductive bonding material is then melted on the terminal pad. The melted conductive bonding material gets exposed to the peripheral atmosphere over a larger area. Even if a bubble is generated within the melted conductive bonding material, the bubble is allowed to easily get out of the melted conductive bonding material. Removal of the gas is promoted in the melted conductive bonding material. The solid support is subsequently melted. The electronic component is moved down toward the substrate, thereby contacting the terminal conductor with the melted conductive bonding material on the corresponding terminal pad. Removal of the gas in this manner leads to improvement in the strength of bonding between the substrate and the electronic component.

摘要翻译： 当将电子部件安装在基板上时，首先将电子部件放置在基板上，并将固体支撑体插入在电子部件和基板之间。 固体支撑件用于将电子部件的端子导体从衬底上的对应的端子焊盘放置。 导电接合材料然后在端子焊盘上熔化。 熔融的导电接合材料在较大的面积上暴露于周围的气氛。 即使在熔融的导电接合材料内产生气泡，也允许气泡容易地从熔融的导电接合材料中脱出。 在熔融的导电接合材料中促进除去气体。 固体支持物随后熔化。 电子部件朝向基板移动，从而使端子导体与相应的端子焊盘上的熔融的导电接合材料接触。 以这种方式去除气体导致基板和电子部件之间的结合强度的改善。

公开(公告)号：US07159309B2

公开(公告)日：2007-01-09

申请号：US10073106

申请日：2002-02-12

申请人： Tsuyoshi Yamamoto ,  Mitsuo Suehiro ,  Hiroshi Yamada

发明人： Tsuyoshi Yamamoto ,  Mitsuo Suehiro ,  Hiroshi Yamada

IPC分类号： H05K3/30

CPC分类号： H05K3/305 ,  H01L2224/29035 ,  H01L2224/29036 ,  H01L2224/73103 ,  H01L2224/73204 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/0129 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0182 ,  H05K2203/0475 ,  H05K2203/1105 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49169 ,  H01L2924/00012

摘要： When an electronic component is mounted on a substrate, the electronic component is first placed on the substrate with a solid support interposed between the electronic component and the substrate. The solid support serves to space a terminal conductor of the electronic component from a corresponding terminal pad on the substrate. A conductive bonding material is then melted on the terminal pad. The melted conductive bonding material gets exposed to the peripheral atmosphere over a larger area. Even if a bubble is generated within the melted conductive bonding material, the bubble is allowed to easily get out of the melted conductive bonding material. Removal of the gas is promoted in the melted conductive bonding material. The solid support is subsequently melted. The electronic component is moved down toward the substrate, thereby contacting the terminal conductor with the melted conductive bonding material on the corresponding terminal pad. Removal of the gas in this manner leads to improvement in the strength of bonding between the substrate and the electronic component.

摘要翻译： 当将电子部件安装在基板上时，首先将电子部件放置在基板上，并将固体支撑体插入在电子部件和基板之间。 固体支撑件用于将电子部件的端子导体从衬底上的对应的端子焊盘放置。 导电接合材料然后在端子焊盘上熔化。 熔融的导电接合材料在较大的面积上暴露于周围的气氛。 即使在熔融的导电接合材料内产生气泡，也允许气泡容易地从熔融的导电接合材料中脱出。 在熔融的导电接合材料中促进除去气体。 固体支持物随后熔化。 电子部件朝向基板移动，从而使端子导体与相应的端子焊盘上的熔融的导电接合材料接触。 以这种方式去除气体导致基板和电子部件之间的结合强度的改善。

公开(公告)号：US10859932B2

公开(公告)日：2020-12-08

申请号：US15522567

申请日：2015-10-08

申请人： Tsuyoshi Sugimoto ,  Shinya Nakayama ,  Hiroshi Yamada ,  Hideyuki Santo ,  Ryuta Chiba ,  Suzuka Amemori ,  Kohsuke Nagata

发明人： Tsuyoshi Sugimoto ,  Shinya Nakayama ,  Hiroshi Yamada ,  Hideyuki Santo ,  Ryuta Chiba ,  Suzuka Amemori ,  Kohsuke Nagata

IPC分类号： G03G9/087

摘要： A toner, including: a polyester resin, wherein the polyester resin has a structure represented by any one of formulas 1) to 3) below: 1) R1-(NHCONH-R2)n-, 2) R1-(NHCOO-R2)n-, and 3) R1-(OCONH-R2)n-, where n is 3 or more, R1 represents an aromatic organic group or an aliphatic organic group, and R2 represents a group derived from a resin that is polyester formed of polycarboxylic acid, polyol, or both thereof; or that is a modified polyester obtained by modifying polyester with isocyanate.

公开(公告)号：US10303072B2

公开(公告)日：2019-05-28

申请号：US15889461

申请日：2018-02-06

申请人： Akira Tanaka ,  Hiroyuki Takeda ,  Junichi Awamura ,  Hiroshi Yamada ,  Daichi Hisakuni ,  Yasuo Kamada

发明人： Akira Tanaka ,  Hiroyuki Takeda ,  Junichi Awamura ,  Hiroshi Yamada ,  Daichi Hisakuni ,  Yasuo Kamada

IPC分类号： G03G9/087 ,  C08G63/42 ,  C08G63/20 ,  G03G15/00 ,  C08G63/195 ,  C08G63/16 ,  C08G63/66 ,  C08G18/75 ,  C08G18/42

摘要： A toner is provided. The toner contains a polyester resin. The toner has a glass transition temperature (Tg1st) at first temperature rising of differential scanning calorimetry (DSC) of from 45° C. to 65° C. The toner includes a component insoluble in tetrahydrofuran (THF) having two glass transition temperatures (Tga1st and Tgb1st) at the first temperature rising of DSC, where Tga1st is in a range of −45° C. to 5° C. and Tgb1st is in a range of 45° C. to 70° C. The toner includes a component soluble in THF having a glass transition temperature (Tg2nd) at second temperature rising of DSC of from 40° C. to 65° C.

公开(公告)号：US09785074B2

公开(公告)日：2017-10-10

申请号：US15116478

申请日：2015-01-06

申请人： Kohsuke Nagata ,  Shinya Nakayama ,  Tsuyoshi Sugimoto ,  Hiroshi Yamada ,  Susumu Chiba ,  Shinsuke Nagai ,  Suzuka Amemori

发明人： Kohsuke Nagata ,  Shinya Nakayama ,  Tsuyoshi Sugimoto ,  Hiroshi Yamada ,  Susumu Chiba ,  Shinsuke Nagai ,  Suzuka Amemori

IPC分类号： G03G9/08 ,  G03G9/087 ,  C08G63/12 ,  C08G63/133 ,  G03G15/08

CPC分类号： G03G9/08755 ,  C08G63/12 ,  C08G63/133 ,  G03G9/08793 ,  G03G9/08795 ,  G03G9/08797 ,  G03G15/08

摘要： A polyester resin for a toner, the polyester resin including: a segment derived from an alcohol component; and a segment derived from a carboxylic acid component, wherein the alcohol component includes a trivalent or higher aliphatic alcohol, and wherein the polyester resin satisfies Expressions (1) to (3) below: 500 ≤ Weight ⁢ ⁢ average ⁢ ⁢ molecular ⁢ ⁢ weight ⁢ ⁢ ( Mw ) ( Valence ⁢ ⁢ of ⁢ ⁢ the ⁢ ⁢ trivalent ⁢ ⁢ or higher ⁢ ⁢ aliphatic ⁢ ⁢ alcohol ) × ( Amount ⁢ ⁢ of ⁢ ⁢ the ⁢ ⁢ trivalent ⁢ ⁢ or higher ⁢ ⁢ aliphatic ⁢ ⁢ alcohol ) ≤ 4 , 000 ; Expression ⁢ ⁢ ( 1 ) 4,000≦Weight average molecular weight (Mw)≦25,000   Expression (2); and 0.5≦(Amount of the trivalent or higher aliphatic alcohol)≦6.5   Expression (3), where, in the Expressions (1) and (3), the Amount of the trivalent or higher aliphatic alcohol denotes a percent by mole of the trivalent or higher aliphatic alcohol relative to the alcohol component.

公开(公告)号：US09492309B2

公开(公告)日：2016-11-15

申请号：US13582213

申请日：2011-03-01

申请人： Hiroshi Yamada ,  Yosuke Taniguchi ,  Yoshiki Hattori ,  Kenji Hioki ,  Kae Fujiwara

发明人： Hiroshi Yamada ,  Yosuke Taniguchi ,  Yoshiki Hattori ,  Kenji Hioki ,  Kae Fujiwara

IPC分类号： A61F5/56 ,  A61M16/04 ,  A61F2/94

CPC分类号： A61F5/56 ,  A61F2/94 ,  A61M16/0406 ,  A61M16/0461

摘要： A nasal cavity insertion device is provided that includes a tubular main body part, at least one elastically deforming part disposed on the outer peripheral surface of the tubular main body part, and a water soluble holding part. The water soluble holding part holds the elastically deforming part in a diameter-reduced state.

摘要翻译： 提供了一种鼻腔插入装置，其包括管状主体部，设置在管状主体部的外周面上的至少一个弹性变形部和水溶性保持部。 水溶性保持部将弹性变形部保持在直径缩小状态。

公开(公告)号：US09475430B2

公开(公告)日：2016-10-25

申请号：US12907314

申请日：2010-10-19

申请人： Asako Kitaura ,  Seiya Shimizu ,  Hiroshi Yamada

发明人： Asako Kitaura ,  Seiya Shimizu ,  Hiroshi Yamada

IPC分类号： H04N7/18 ,  B60R1/00 ,  G06T5/00 ,  G06T3/40

CPC分类号： B60R1/00 ,  B60K35/00 ,  B60K2350/106 ,  B60R2300/105 ,  B60R2300/602 ,  G06T3/005 ,  G06T3/0056 ,  G06T3/4038 ,  G06T5/006 ,  G06T2207/30252 ,  H04N7/18 ,  H04N7/181

摘要： A vehicle image processing apparatus includes: a group of cameras; a drawing unit that converts a captured image into an image viewed along a line of sight running from a predetermined position in a predetermined direction; a viewing-line-of-sight changing unit that detects whether a first line of sight is switched to a second line of sight; and a viewing-line-of-sight generation/updating unit that acquires parameters concerning the first and second lines of sight after detecting the switching and generates a parameter which is gradually changed from the parameter of the first line of sight to the parameter of the second line of sight. Moreover, the drawing unit generates, on the basis of the gradually changed parameter, an image which is gradually changed from an image viewed along the first line of sight to an image viewed along the second line of sight.

摘要翻译： 车辆图像处理装置包括：一组相机; 绘制单元，其将捕获的图像转换成沿着从预定方向的预定位置运行的视线观察的图像; 观察视线改变单元，其检测第一视线是否切换到第二视线; 以及观察视线生成/更新单元，其在检测到切换之后获取与第一和第二视线有关的参数，并生成从第一视线的参数逐渐变化为参数的参数 第二线视线 此外，绘图单元基于逐渐改变的参数生成从沿着第一视线观看的图像逐渐变为沿着第二视线观看的图像的图像。

公开(公告)号：US09195156B2

公开(公告)日：2015-11-24

申请号：US14143601

申请日：2013-12-30

申请人： Ryota Inoue ,  Yoshihiro Moriya ,  Hiroshi Yamada ,  Tatsuru Moritani ,  Minoru Masuda ,  Akinori Saito ,  Yasutada Shitara ,  Kiyotada Katoh ,  Satoshi Takahashi

发明人： Ryota Inoue ,  Yoshihiro Moriya ,  Hiroshi Yamada ,  Tatsuru Moritani ,  Minoru Masuda ,  Akinori Saito ,  Yasutada Shitara ,  Kiyotada Katoh ,  Satoshi Takahashi

IPC分类号： B01J2/04 ,  B01J2/18 ,  G03G9/08 ,  G03G9/087 ,  G03G9/09

CPC分类号： G03G9/0804 ,  B01J2/04 ,  B01J2/18 ,  G03G9/0802 ,  G03G9/0806 ,  G03G9/0817 ,  G03G9/08755 ,  G03G9/08795 ,  G03G9/08797 ,  G03G9/0904

摘要： A particulate material production method is provided. The particulate material production method includes ejecting a particulate material composition liquid, which includes an organic solvent and a particulate material composition including at least a resin and dissolved or dispersed in the organic solvent, from at least one nozzle to form droplets of the particulate material composition liquid in a gas phase; and solidifying the droplets of the particulate material composition liquid to prepare particles of the particulate material composition. The droplet solidifying step includes contacting the droplets with a poor solvent for the particulate material composition.

摘要翻译： 提供了一种颗粒材料生产方法。 颗粒材料生产方法包括从至少一个喷嘴喷射包括有机溶剂和至少包含树脂并溶解或分散在有机溶剂中的颗粒材料组合物的颗粒材料组合物液体，以形成颗粒材料组合物的液滴 气相中的液体; 并固化颗粒状材料组合物液体的液滴以制备颗粒材料组合物的颗粒。 液滴固化步骤包括使液滴与用于颗粒材料组合物的不良溶剂接触。

公开(公告)号：US09034729B2

公开(公告)日：2015-05-19

申请号：US12438869

申请日：2007-08-22

申请人： Hiroshi Yamada ,  Katsuhiko Kitagawa ,  Kazuo Okada ,  Yuichi Morita ,  Hiroyuki Shinogi ,  Shinzo Ishibe ,  Yoshinori Seki ,  Takashi Noma

发明人： Hiroshi Yamada ,  Katsuhiko Kitagawa ,  Kazuo Okada ,  Yuichi Morita ,  Hiroyuki Shinogi ,  Shinzo Ishibe ,  Yoshinori Seki ,  Takashi Noma

IPC分类号： H01L21/30 ,  H01L27/146 ,  B81C1/00

CPC分类号： H01L27/14618 ,  B81C1/00269 ,  B81C2203/0118 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/13 ,  H01L2224/13025 ,  H01L2924/00014

摘要： An object of the invention is to provide a smaller semiconductor device of which the manufacturing process is simplified and the manufacturing cost is reduced and a method of manufacturing the same. Furthermore, an object of the invention is to provide a semiconductor device having a cavity. A first supporting body 5 having a penetration hole 6 penetrating it from the front surface to the back surface is attached to a front surface of a semiconductor substrate 2 with an adhesive layer 4 being interposed therebetween. A device element 1 and wiring layers 3 are formed on the front surface of the semiconductor substrate 2. A second supporting body 7 is attached to the first supporting body 5 with an adhesive layer 8 being interposed therebetween so as to cover the penetration hole 6. The device element 1 is sealed in a cavity 9 surrounded by the semiconductor substrate 2, the first supporting body 5 and the second supporting body 7.

摘要翻译： 本发明的目的是提供一种较小的半导体器件，其制造工艺简化并且制造成本降低，并且制造该半导体器件的方法。 此外，本发明的目的是提供一种具有空腔的半导体器件。 具有穿透孔6的从前表面到后表面穿透的第一支撑体5被粘附在半导体衬底2的前表面上，其间插入有粘合剂层4。 器件元件1和布线层3形成在半导体衬底2的前表面上。第二支撑体7被安装在第一支撑体5上，其中夹有粘合剂层8以覆盖穿透孔6。 器件元件1被密封在由半导体衬底2，第一支撑体5和第二支撑体7包围的空腔9中。

公开(公告)号：US08849625B2

公开(公告)日：2014-09-30

申请号：US13367837

申请日：2012-02-07

申请人： Takuro Ikeda ,  Eiji Kitagawa ,  Hiroshi Yamada

发明人： Takuro Ikeda ,  Eiji Kitagawa ,  Hiroshi Yamada

IPC分类号： G06F17/50 ,  G08G1/01

CPC分类号： G06F17/5009 ,  G06F17/5068 ,  G06F17/5095 ,  G08G1/0125

摘要： A simulator used in a distributed process simulation includes: a storage unit configured to store map information, agent information, and area allocation information; a simulation execution unit; a condition determination unit configured to determine the condition of the reference agent to be referenced by the simulation execution unit based on a movement state of the agent; an allocation discrimination unit configured to discriminate another computer allocated an area in which the reference agent corresponding to the condition can be located; and an agent information acquisition unit configured to acquire the information about the agent satisfying the condition of the reference agent from the other discriminated computer.

摘要翻译： 在分布式处理仿真中使用的模拟器包括：存储单元，被配置为存储地图信息，代理信息和区域分配信息; 模拟执行单元; 条件确定单元，被配置为基于所述代理的移动状态来确定由所述模拟执行单元引用的参考代理的状态; 分配鉴别单元，被配置为区分分配了与条件相对应的参考代理可以位于其中的区域的另一计算机; 以及代理信息获取单元，被配置为从另一个判别计算机获取关于所述参考代理的条件的代理的信息。