HDP-CVD SYSTEM
    1.
    发明申请
    HDP-CVD SYSTEM 审中-公开
    HDP-CVD系统

    公开(公告)号:US20120000423A1

    公开(公告)日:2012-01-05

    申请号:US13229347

    申请日:2011-09-09

    IPC分类号: C23C16/50

    摘要: An HDP-CVD system is described, including an HDP-CVD chamber for depositing a material on a wafer, and a pre-heating chamber disposed outside of the HDP-CVD chamber to pre-heat the wafer, before the wafer is loaded in the HDP-CVD chamber, to a temperature higher than room temperature and required in the deposition step to be conducted in the HDP-CVD chamber. The pre-heating chamber is equipped with a heating lamp for the pre-heating. The wafer has been formed with a trench before being pre-heated.

    摘要翻译: 描述了一种HDP-CVD系统,其包括用于在晶片上沉积材料的HDP-CVD室和设置在HDP-CVD室外部的预热室,以在晶片装载到晶片之前预热晶片 HDP-CVD室至高于室温的温度,并且在沉积步骤中需要在HDP-CVD室中进行。 预热室配备有用于预热的加热灯。 在预加热之前,晶片已经形成有沟槽。