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公开(公告)号：US20050036748A1
公开(公告)日：2005-02-17
申请号：US10916678
申请日：2004-08-11
申请人： William Freeman , Ming Shi , Hongjin Jiang
发明人： William Freeman , Ming Shi , Hongjin Jiang
CPC分类号： G02B27/0006 , G02B1/11 , G02B6/264 , G02B6/4248
摘要： Methods and structures for reducing the moisture penetration in an optical device such as an isolator, collimator, filters, circulators, and the like. Methods can include placing an optical cover over the opening(s) of the housing of the optical device. The optical cover can be bonded by epoxy or metallic seal. A moisture prevention coating can be placed over the seal line between the optical cover and the housing to further enhance moisture prevention.
摘要翻译： 用于减少诸如隔离器，准直器，过滤器，循环器等的光学装置中的水分渗透的方法和结构。 方法可以包括将光学盖放置在光学装置的壳体的开口上。 光学盖可以通过环氧树脂或金属密封接合。 可以将防潮涂层放置在光学盖和壳体之间的密封线上，以进一步增强防潮性。
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公开(公告)号：US07490999B2
公开(公告)日：2009-02-17
申请号：US10916678
申请日：2004-08-11
申请人： William Freeman , Ming Shi , Hongjin Jiang
发明人： William Freeman , Ming Shi , Hongjin Jiang
IPC分类号： G02B6/36
CPC分类号： G02B27/0006 , G02B1/11 , G02B6/264 , G02B6/4248
摘要： Methods and structures for reducing the moisture penetration in an optical device such as an isolator, collimator, filters, circulators, and the like. Methods can include placing an optical cover over the opening(s) of the housing of the optical device. The optical cover can be bonded by epoxy or metallic seal. A moisture prevention coating can be placed over the seal line between the optical cover and the housing to further enhance moisture prevention.
摘要翻译： 用于减少诸如隔离器，准直器，过滤器，循环器等的光学装置中的水分渗透的方法和结构。 方法可以包括将光学盖放置在光学装置的壳体的开口上。 光学盖可以通过环氧树脂或金属密封接合。 可以将防潮涂层放置在光学盖和壳体之间的密封线上，以进一步增强防潮性。
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公开(公告)号：US20140291843A1
公开(公告)日：2014-10-02
申请号：US13853982
申请日：2013-03-29
IPC分类号： H01L23/498 , H01L23/00
CPC分类号： H01L23/49816 , H01L21/4853 , H01L23/49833 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L2224/13101 , H01L2224/16225 , H01L2224/1703 , H01L2224/32245 , H01L2224/73253 , H01L2924/00011 , H01L2924/01322 , H01L2924/15311 , H01L2924/16235 , H01L2924/16251 , H01L2924/3511 , H05K3/3436 , H05K3/3478 , H05K3/3484 , H05K3/3494 , H05K2201/066 , H05K2201/068 , H05K2201/1056 , H05K2203/041 , H05K2203/0435 , H05K2203/047 , Y10S428/929 , Y10T428/12181 , Y10T428/12479 , H01L2924/014 , H01L2924/00 , H01L2224/81805
摘要： Hybrid solder for solder balls and filled paste are described. A solder ball may be formed of a droplet of higher temperature solder and a coating of lower temperature solder. This may be used with a solder paste that has an adhesive and a filler of low temperature solder particles, the filler comprising less than 80 weight percent of the paste. The solder balls and paste may be used in soldering packages for microelectronic devices. A package may be formed by applying a solder paste to a bond pad of a substrate, attaching a hybrid solder ball to each pad using the paste, and attaching the package substrate to a microelectronic substrate by reflowing the hybrid solder balls to form a hybrid solder interconnect.
摘要翻译： 描述了用于焊球和填充糊的混合焊料。 焊球可以由较高温度焊料液滴和低温焊料涂层形成。 这可以与具有粘合剂和低温焊料颗粒的填料的焊膏一起使用，填料包含少于膏体的80重量％。 焊球和糊剂可用于微电子器件的焊接封装。 可以通过将焊膏施加到基板的接合焊盘来形成封装，使用该膏将混合焊球附着到每个焊盘，以及通过回流混合焊球来将封装衬底附着到微电子衬底以形成混合焊料 互连。
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公开(公告)号：US20140151096A1
公开(公告)日：2014-06-05
申请号：US13693403
申请日：2012-12-04
CPC分类号： H05K3/3436 , H01L23/488 , H01L23/49816 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L2224/131 , H01L2224/13562 , H01L2224/13564 , H01L2224/16058 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2924/01322 , H01L2924/15311 , H01L2924/301 , H01L2924/3511 , H01L2924/3841 , H05K3/3463 , H05K3/3494 , H05K2203/041 , Y02P70/613 , Y10T29/49144 , H01L2924/0665 , H01L2924/014 , H01L2224/136 , H01L2924/00
摘要： Embodiments of the present description relate to the field of fabricating microelectronic structures, wherein a microelectronic package may be attached to a microelectronic substrate with a hybrid solder interconnect. The hybrid solder interconnect may comprise a homogenous mixture of low temperature solder and a high temperature solder extending between at least one bond pad on a microelectronic package and at least one bond pad on a microelectronic substrate, wherein the relatively low reflow temperature used during the formation of the hybrid solder interconnect may prevent solder defects caused by warpage which may occur during the attachment of the microelectronic package to the microelectronic substrate.
摘要翻译： 本说明书的实施例涉及制造微电子结构的领域，其中微电子封装可以用混合焊料互连连接到微电子衬底。 混合焊料互连可以包括低温焊料和在微电子封装上的至少一个焊盘和微电子衬底上的至少一个焊盘之间延伸的高温焊料的均匀混合物，其中在形成期间使用的相对低的回流温度 的混合焊料互连可以防止在微电子封装附着到微电子衬底期间可能发生的翘曲引起的焊料缺陷。
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公开(公告)号：US08920934B2
公开(公告)日：2014-12-30
申请号：US13853982
申请日：2013-03-29
IPC分类号： B32B5/18 , H01L23/498 , H01L23/00
CPC分类号： H01L23/49816 , H01L21/4853 , H01L23/49833 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L2224/13101 , H01L2224/16225 , H01L2224/1703 , H01L2224/32245 , H01L2224/73253 , H01L2924/00011 , H01L2924/01322 , H01L2924/15311 , H01L2924/16235 , H01L2924/16251 , H01L2924/3511 , H05K3/3436 , H05K3/3478 , H05K3/3484 , H05K3/3494 , H05K2201/066 , H05K2201/068 , H05K2201/1056 , H05K2203/041 , H05K2203/0435 , H05K2203/047 , Y10S428/929 , Y10T428/12181 , Y10T428/12479 , H01L2924/014 , H01L2924/00 , H01L2224/81805
摘要： Hybrid solder for solder balls and filled paste are described. A solder ball may be formed of a droplet of higher temperature solder and a coating of lower temperature solder. This may be used with a solder paste that has an adhesive and a filler of low temperature solder particles, the filler comprising less than 80 weight percent of the paste. The solder balls and paste may be used in soldering packages for microelectronic devices. A package may be formed by applying a solder paste to a bond pad of a substrate, attaching a hybrid solder ball to each pad using the paste, and attaching the package substrate to a microelectronic substrate by reflowing the hybrid solder balls to form a hybrid solder interconnect.
摘要翻译： 描述了用于焊球和填充糊的混合焊料。 焊球可以由较高温度焊料液滴和低温焊料涂层形成。 这可以与具有粘合剂和低温焊料颗粒的填料的焊膏一起使用，填料包含少于膏体的80重量％。 焊球和糊剂可用于微电子器件的焊接封装。 可以通过将焊膏施加到基板的接合焊盘来形成封装，使用该膏将混合焊球附着到每个焊盘，以及通过回流混合焊球来将封装衬底附接到微电子衬底以形成混合焊料 互连。
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公开(公告)号：US08575539B2
公开(公告)日：2013-11-05
申请号：US12669420
申请日：2008-07-23
申请人： Alan Mosley , Gihan Ryu , Hongjin Jiang
发明人： Alan Mosley , Gihan Ryu , Hongjin Jiang
IPC分类号： G02F1/01
CPC分类号： G01N21/645
摘要： A detector apparatus and method for detecting radiation emitted from a target comprising: a first transmissive polarizer (302) for polarizing radiation incident on the target; a second transmissive polarizer (304) for polarizing the radiation emitted from the target (303) and absorbing any remaining light polarized by the first polarizer; and at least one reflective polarizer (306) arranged between the first and second transmissive polarizers.
摘要翻译： 一种用于检测从目标发射的辐射的检测器装置和方法，包括：用于偏振入射在靶上的辐射的第一透射偏振器（302） 第二透射偏振器（304），用于使从所述靶（303）发射的辐射偏振并吸收由所述第一偏振器偏振的剩余光; 以及布置在第一和第二透射偏振器之间的至少一个反射偏振器（306）。
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公开(公告)号：US20100264337A1
公开(公告)日：2010-10-21
申请号：US12669420
申请日：2008-07-23
申请人： Alan Mosley , Gihan Ryu , Hongjin Jiang
发明人： Alan Mosley , Gihan Ryu , Hongjin Jiang
CPC分类号： G01N21/645
摘要： A detector apparatus and method for detecting radiation emitted from a target comprising: a first transmissive polariser (302) for polarising radiation incident on the target; a second transmissive polariser (304) for polarising the radiation emitted from the target (303) and absorbing any remaining light polarised by the first polariser; and at least one reflective polariser (306) arranged between the first and second transmissive polarisers.
摘要翻译： 一种用于检测从目标发射的辐射的检测器装置和方法，包括：用于偏振入射在目标上的辐射的第一透射偏振器（302）; 第二透射偏振器（304），用于使从所述靶（303）发射的辐射偏振并吸收由所述第一偏振器偏振的任何剩余光; 以及布置在第一和第二透射偏振器之间的至少一个反射偏振器（306）。
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