公开(公告)号：US20140291843A1

公开(公告)日：2014-10-02

申请号：US13853982

申请日：2013-03-29

申请人： Hongjin Jiang ,  Arun Kumar C. Nallani ,  Rajen S. Sidhu ,  Martha A. Dudek ,  Weihua Tang

发明人： Hongjin Jiang ,  Arun Kumar C. Nallani ,  Rajen S. Sidhu ,  Martha A. Dudek ,  Weihua Tang

IPC分类号： H01L23/498 ,  H01L23/00

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/066 ,  H05K2201/068 ,  H05K2201/1056 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/047 ,  Y10S428/929 ,  Y10T428/12181 ,  Y10T428/12479 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/81805

摘要： Hybrid solder for solder balls and filled paste are described. A solder ball may be formed of a droplet of higher temperature solder and a coating of lower temperature solder. This may be used with a solder paste that has an adhesive and a filler of low temperature solder particles, the filler comprising less than 80 weight percent of the paste. The solder balls and paste may be used in soldering packages for microelectronic devices. A package may be formed by applying a solder paste to a bond pad of a substrate, attaching a hybrid solder ball to each pad using the paste, and attaching the package substrate to a microelectronic substrate by reflowing the hybrid solder balls to form a hybrid solder interconnect.

摘要翻译： 描述了用于焊球和填充糊的混合焊料。 焊球可以由较高温度焊料液滴和低温焊料涂层形成。 这可以与具有粘合剂和低温焊料颗粒的填料的焊膏一起使用，填料包含少于膏体的80重量％。 焊球和糊剂可用于微电子器件的焊接封装。 可以通过将焊膏施加到基板的接合焊盘来形成封装，使用该膏将混合焊球附着到每个焊盘，以及通过回流混合焊球来将封装衬底附着到微电子衬底以形成混合焊料 互连。

公开(公告)号：US08920934B2

公开(公告)日：2014-12-30

申请号：US13853982

申请日：2013-03-29

申请人： Hongjin Jiang ,  Arun Kumar C. Nallani ,  Rajen S. Sidhu ,  Martha A. Dudek ,  Weihua Tang

发明人： Hongjin Jiang ,  Arun Kumar C. Nallani ,  Rajen S. Sidhu ,  Martha A. Dudek ,  Weihua Tang

IPC分类号： B32B5/18 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/066 ,  H05K2201/068 ,  H05K2201/1056 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/047 ,  Y10S428/929 ,  Y10T428/12181 ,  Y10T428/12479 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/81805

摘要： Hybrid solder for solder balls and filled paste are described. A solder ball may be formed of a droplet of higher temperature solder and a coating of lower temperature solder. This may be used with a solder paste that has an adhesive and a filler of low temperature solder particles, the filler comprising less than 80 weight percent of the paste. The solder balls and paste may be used in soldering packages for microelectronic devices. A package may be formed by applying a solder paste to a bond pad of a substrate, attaching a hybrid solder ball to each pad using the paste, and attaching the package substrate to a microelectronic substrate by reflowing the hybrid solder balls to form a hybrid solder interconnect.

摘要翻译： 描述了用于焊球和填充糊的混合焊料。 焊球可以由较高温度焊料液滴和低温焊料涂层形成。 这可以与具有粘合剂和低温焊料颗粒的填料的焊膏一起使用，填料包含少于膏体的80重量％。 焊球和糊剂可用于微电子器件的焊接封装。 可以通过将焊膏施加到基板的接合焊盘来形成封装，使用该膏将混合焊球附着到每个焊盘，以及通过回流混合焊球来将封装衬底附接到微电子衬底以形成混合焊料 互连。

公开(公告)号：US20140225265A1

公开(公告)日：2014-08-14

申请号：US13976192

申请日：2012-03-29

申请人： Rajen S. Sidhu ,  Ashay A. Dadi ,  Martha A. Dudek

发明人： Rajen S. Sidhu ,  Ashay A. Dadi ,  Martha A. Dudek

IPC分类号： H01L23/532 ,  H01L21/768

CPC分类号： H01L23/53209 ,  H01L21/76882 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14505 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16507 ,  H01L2224/81191 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2924/1461 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/00

摘要： Interconnect packaging technology for direct-chip-attach, package-on-package, or first level and second level interconnect stack-ups with reduced Z-heights relative to ball technology. In embodiments, single or multi-layered interconnect structures are deposited in a manner that permits either or both of the electrical and mechanical properties of specific interconnects within a package to be tailored, for example based on function. Functional package interconnects may vary one of more of at least material layer composition, layer thickness, number of layers, or a number of materials to achieve a particular function, for example based on an application of the component(s) interconnected or an application of the assembly as a whole. In embodiments, parameters of the multi-layered laminated structures are varied dependent on the interconnect location within an area of a substrate, for example with structures having higher ductility at interconnect locations subject to higher stress.

摘要翻译： 互连封装技术，用于直接芯片连接，封装封装或一级和二级互连叠层，相对于球技术，Z高度降低。 在实施例中，单层或多层互连结构以允许例如基于功能来定制封装内的特定互连的电气和机械特性之一或两者的方式被沉积。 功能性封装互连可以改变至少材料层组成，层厚度，层数或多个材料中的一个以实现特定功能，例如基于互连部件的应用或应用 整个集会。 在实施例中，多层叠层结构的参数取决于衬底区域内的互连位置，例如具有较高应力的互连位置处具有较高延展性的结构。

公开(公告)号：US20140175160A1

公开(公告)日：2014-06-26

申请号：US13725279

申请日：2012-12-21

申请人： Rajen S. Sidhu ,  Mukul P. Renavikar ,  Ashay A. Dani ,  Martha A. Dudek

发明人： Rajen S. Sidhu ,  Mukul P. Renavikar ,  Ashay A. Dani ,  Martha A. Dudek

IPC分类号： B23K1/20 ,  B23K35/24 ,  B23K35/362

CPC分类号： B23K1/203 ,  B23K1/0016 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/24 ,  B23K35/26 ,  B23K35/262 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  B23K35/362 ,  B23K2101/42

摘要： A composition including a solder flux including a rosin material have a property to maintain a less than 10 percent drop in tackiness from an initial tackiness value of 20 gf to 120 gf over a temperature regime of 20° C. to 200° C. A composition including a solder powder; and a solder flux including a rosin material including a softening temperature of 150° C. to 200° C. and a molecular weight of 300 g/mol to 600 g/mol. A method including introducing a solder paste to one or more contact pads of a substrate, the solder paste including a solder powder and a solder flux including a rosin material including a softening temperature of 150° C. to 190° C. and a molecular weight of 300 g/mol to 600 g/mol; contacting the solder paste with a solder ball of a package substrate; and heating the solder paste.

摘要翻译： 包含包含松香材料的焊剂的组合物具有在20℃至200℃的温度范围内保持从20gf的初始粘性值至少低于10％的粘性降低的性质。组合物 包括焊粉; 以及包含软化温度为150℃〜200℃，分子量为300g / mol〜600g / mol的松香材料的焊剂。 一种方法，包括将焊膏引入到衬底的一个或多个接触焊盘中，所述焊膏包括焊料粉末和包含松香材料的助焊剂，所述助焊剂包括150℃至190℃的软化温度和分子量 为300g / mol至600g / mol; 使焊膏与封装衬底的焊球接触; 并加热焊膏。

公开(公告)号：US09024453B2

公开(公告)日：2015-05-05

申请号：US13976192

申请日：2012-03-29

申请人： Rajen S. Sidhu ,  Ashay A. Dani ,  Martha A. Dudek

发明人： Rajen S. Sidhu ,  Ashay A. Dani ,  Martha A. Dudek

IPC分类号： H01L23/48 ,  H01L23/532 ,  H01L23/00 ,  H01L21/768

CPC分类号： H01L23/53209 ,  H01L21/76882 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14505 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16507 ,  H01L2224/81191 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2924/1461 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/00

摘要： Interconnect packaging technology for direct-chip-attach, package-on-package, or first level and second level interconnect stack-ups with reduced Z-heights relative to ball technology. In embodiments, single or multi-layered interconnect structures are deposited in a manner that permits either or both of the electrical and mechanical properties of specific interconnects within a package to be tailored, for example based on function. Functional package interconnects may vary one of more of at least material layer composition, layer thickness, number of layers, or a number of materials to achieve a particular function, for example based on an application of the component(s) interconnected or an application of the assembly as a whole. In embodiments, parameters of the multi-layered laminated structures are varied dependent on the interconnect location within an area of a substrate, for example with structures having higher ductility at interconnect locations subject to higher stress.

摘要翻译： 互连封装技术，用于直接芯片连接，封装封装或一级和二级互连叠层，相对于球技术，Z高度降低。 在实施例中，单层或多层互连结构以允许例如基于功能来定制封装内的特定互连的电气和机械特性之一或两者的方式被沉积。 功能性封装互连可以改变至少材料层组成，层厚度，层数或多个材料中的一个以实现特定功能，例如基于互连部件的应用或应用 整个集会。 在实施例中，多层叠层结构的参数取决于衬底区域内的互连位置，例如具有较高应力的互连位置处具有较高延展性的结构。

公开(公告)号：US20140319682A1

公开(公告)日：2014-10-30

申请号：US14328599

申请日：2014-07-10

申请人： Rajen S. Sidhu ,  Wei Hu ,  Carl L. Deppisch ,  Martha A. Dudek

发明人： Rajen S. Sidhu ,  Wei Hu ,  Carl L. Deppisch ,  Martha A. Dudek

IPC分类号： H01L23/00 ,  B23K35/02

CPC分类号： H01L24/14 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/22 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/362 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49816 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed towards multi-solder techniques and configurations for integrated circuit (IC) package assembly. In one embodiment, a method includes depositing a plurality of solder balls on a plurality of pads of a package substrate, the plurality of solder balls corresponding with the plurality of pads and performing a solder reflow process to form a solder joint between the plurality of solder balls and the plurality of pads. Individual solder balls of the plurality of solder balls include a first solder material and a second solder material, the first solder material having a liquidus temperature that is greater than a peak temperature of the solder reflow process and the second solder material having a liquidus temperature that is less than the peak temperature of the solder reflow process. Other embodiments may be described and/or claimed.

公开(公告)号：US20140124925A1

公开(公告)日：2014-05-08

申请号：US13670687

申请日：2012-11-07

申请人： Rajen S. Sidhu ,  Wei Hu ,  Carl L. Deppisch ,  Martha A. Dudek

发明人： Rajen S. Sidhu ,  Wei Hu ,  Carl L. Deppisch ,  Martha A. Dudek

IPC分类号： H01L23/498 ,  B23K1/20 ,  B23K35/14 ,  B23K31/02

CPC分类号： H01L24/14 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/22 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/362 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49816 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed towards multi-solder techniques and configurations for integrated circuit (IC) package assembly. In one embodiment, a method includes depositing a plurality of solder balls on a plurality of pads of a package substrate, the plurality of solder balls corresponding with the plurality of pads and performing a solder reflow process to form a solder joint between the plurality of solder balls and the plurality of pads. Individual solder balls of the plurality of solder balls include a first solder material and a second solder material, the first solder material having a liquidus temperature that is greater than a peak temperature of the solder reflow process and the second solder material having a liquidus temperature that is less than the peak temperature of the solder reflow process. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例涉及用于集成电路（IC）封装组件的多焊接技术和配置。 在一个实施例中，一种方法包括在封装衬底的多个焊盘上沉积多个焊球，所述多个焊球对应于所述多个焊盘并且执行焊料回流工艺以在所述多个焊料之间形成焊接点 球和多个垫。 多个焊球的单个焊球包括第一焊料材料和第二焊料材料，第一焊料材料具有大于焊料回流工艺的峰值温度的液相线温度，第二焊料材料具有液相线温度， 小于焊料回流工艺的峰值温度。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09950393B2

公开(公告)日：2018-04-24

申请号：US13976001

申请日：2011-12-23

申请人： Rajen S. Sidhu ,  Martha A. Dudek ,  James C. Matayabas, Jr. ,  Michelle S. Phen ,  Wei Tan

发明人： Rajen S. Sidhu ,  Martha A. Dudek ,  James C. Matayabas, Jr. ,  Michelle S. Phen ,  Wei Tan

IPC分类号： B23K35/02 ,  B23K35/362 ,  H01L23/00 ,  H05K3/34 ,  H01L23/488 ,  H01L23/498 ,  H01L21/48

CPC分类号： B23K35/025 ,  B23K35/362 ,  H01L21/4853 ,  H01L23/488 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0381 ,  H01L2224/03828 ,  H01L2224/03829 ,  H01L2224/03849 ,  H01L2224/0401 ,  H01L2224/05794 ,  H01L2224/058 ,  H01L2224/05809 ,  H01L2224/05811 ,  H01L2224/05813 ,  H01L2224/05817 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/11334 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/046 ,  H01L2924/014 ,  H01L2924/01032 ,  H01L2924/01105 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/0103 ,  H01L2924/01083

摘要： Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed.

公开(公告)号：US20140084461A1

公开(公告)日：2014-03-27

申请号：US13626869

申请日：2012-09-25

申请人： Rajen S. Sidhu ,  Martha A. Dudek ,  Wei Tan

发明人： Rajen S. Sidhu ,  Martha A. Dudek ,  Wei Tan

IPC分类号： H01L23/492 ,  B23K35/362 ,  H01L21/28

CPC分类号： B23K35/362 ,  B23K35/0244 ,  B23K35/3612 ,  H01L21/4853 ,  H01L23/49816 ,  H01L2224/16225

摘要： Embodiments of the present disclosure are directed towards flux materials for heated solder placement and associated techniques and configurations. In one embodiment, a method includes depositing a flux material on one or more pads of a package substrate, the flux material including a rosin material and a thixotropic agent and depositing one or more solder balls on the flux material disposed on the one or more pads, wherein depositing the one or more solder balls on the flux material is performed at a temperature greater than 80° C., and wherein the rosin material and the thixotropic agent are configured to resist softening at the temperature greater than 80° C. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例涉及用于加热的焊料放置和相关联的技术和构造的助焊剂材料。 在一个实施例中，一种方法包括在封装基板的一个或多个焊盘上沉积焊剂材料，焊剂材料包括松香材料和触变剂，并且将一个或多个焊球沉积在设置在一个或多个焊盘上的焊剂材料上 其中将所述一个或多个焊球沉积在所述焊剂材料上在大于80℃的温度下进行，并且其中所述松香材料和所述触变剂构造成在大于80℃的温度下抵抗软化。其它实施方案 可以被描述和/或要求保护。

公开(公告)号：US20130341379A1

公开(公告)日：2013-12-26

申请号：US13976001

申请日：2011-12-23

申请人： Rajen S. Sidhu ,  Martha A. Dudek ,  James C. Matayabas ,  Michelle S. Phen ,  Wei Tan

发明人： Rajen S. Sidhu ,  Martha A. Dudek ,  James C. Matayabas ,  Michelle S. Phen ,  Wei Tan

IPC分类号： B23K35/02 ,  B23K35/362

CPC分类号： B23K35/025 ,  B23K35/362 ,  H01L21/4853 ,  H01L23/488 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0381 ,  H01L2224/03828 ,  H01L2224/03829 ,  H01L2224/03849 ,  H01L2224/0401 ,  H01L2224/05794 ,  H01L2224/058 ,  H01L2224/05809 ,  H01L2224/05811 ,  H01L2224/05813 ,  H01L2224/05817 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/11334 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/046 ,  H01L2924/014 ,  H01L2924/01032 ,  H01L2924/01105 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/0103 ,  H01L2924/01083

摘要： Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed.

摘要翻译： 描述了在制造电子器件组件期间的焊剂配方和焊料附着。 一种助熔剂组合包括助熔剂组分和金属颗粒组分，金属颗粒组分的存在量为助熔剂配方的5-35体积％。 在某些实施方案的一个特征中，金属颗粒组分包括焊料颗粒。 描述和要求保护其他实施例。