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公开(公告)号：US07261003B2
公开(公告)日：2007-08-28
申请号：US11324830
申请日：2006-01-03
申请人： William G. McDonald , David J. Monk
发明人： William G. McDonald , David J. Monk
CPC分类号： G01F1/40 , A61M5/16886 , A61M16/08 , A61M16/0866 , A61M2016/0036 , A61M2205/0244 , A61M2205/3331 , G01F1/44 , Y10T29/49002
摘要： A flowmeter is provided that comprises a leadframe assembly (140) and a body (144) disposed at least partially around the leadframe assembly (140). The body (144) has a flow passage therethrough that comprises a first channel (178) having a first port (166), a second channel (180) having a second port (168), and a flow altering element (182) disposed within the second channel (180). First and second pressure sensors (174 and 176) are disposed within the body (144) and coupled to the leadframe assembly (140) for measuring a first pressure within the first channel (178) and a second pressure within the second channel (180), respectively. An integrated circuit (155), which is coupled to the leadframe assembly (140), to the first pressure sensor (174), and to the second pressure sensor (176), is configured to determine the rate of flow through the flow passage from the first pressure and the second pressure.
摘要翻译： 提供了一种流量计，其包括引线框组件（140）和至少部分地围绕引线框架组件（140）设置的主体（144）。 主体（144）具有穿过其的流动通道，其包括具有第一端口（166）的第一通道（178），具有第二端口（168）的第二通道（180）和设置在内部的流动变化元件（182） 第二通道（180）。 第一和第二压力传感器（174和176）设置在主体（144）内并且联接到引线框架组件（140），用于测量第一通道（178）内的第一压力和第二通道（180）内的第二压力， ， 分别。 被耦合到引线框组件（140）到第一压力传感器（174）和第二压力传感器（176）的集成电路（155）被配置成确定通过流动通道 第一压力和第二压力。
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公开(公告)号：US06769319B2
公开(公告)日：2004-08-03
申请号：US09901366
申请日：2001-07-09
IPC分类号： G01D1124
CPC分类号： G01L19/0636 , G01D11/245 , G01L19/141 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49113 , H01L2224/73265 , Y10T29/49007 , H01L2924/00014 , H01L2924/00
摘要： A component includes a housing (110, 1110) at least partially defining a cavity (125, 1125), a sensor element (105) located in the cavity, and a support member (340, 1140) located over the cavity, located over at least a portion of the housing, and having a hole (341, 1141) over the cavity. The component also includes a filter (345, 700, 800, 1045) located over the support member and located over the hole in the support member.
摘要翻译： 组件包括至少部分地限定空腔（125,1125），位于空腔中的传感器元件（105）和位于空腔上方的位于空腔上方的支撑构件（340,1140）的壳体（110,1110） 壳体的至少一部分，并且在空腔上方具有孔（341,1141）。 该部件还包括位于支撑构件上并位于支撑构件上的孔上方的过滤器（345,700,800,10505）。
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公开(公告)号：US07437951B2
公开(公告)日：2008-10-21
申请号：US11842776
申请日：2007-08-21
申请人： William G. McDonald , David J. Monk
发明人： William G. McDonald , David J. Monk
CPC分类号： G01F1/40 , A61M5/16886 , A61M16/08 , A61M16/0866 , A61M2016/0036 , A61M2205/0244 , A61M2205/3331 , G01F1/44 , Y10T29/49002
摘要： A flowmeter is provided that comprises a leadframe assembly (140) and a body (144) disposed at least partially around the leadframe assembly (140). The body (144) has a flow passage therethrough that comprises a first channel (178) having a first port (166), a second channel (180) having a second port (168), and a flow altering element (182) disposed within the second channel (180). First and second pressure sensors (174 and 176) are disposed within the body (144) and coupled to the leadframe assembly (140) for measuring a first pressure within the first channel (178) and a second pressure within the second channel (180), respectively. An integrated circuit (155), which is coupled to the leadframe assembly (140), to the first pressure sensor (174), and to the second pressure sensor (176), is configured to determine the rate of flow through the flow passage from the first pressure and the second pressure.
摘要翻译： 提供了一种流量计，其包括引线框组件（140）和至少部分地围绕引线框架组件（140）设置的主体（144）。 主体（144）具有穿过其的流动通道，其包括具有第一端口（166）的第一通道（178），具有第二端口（168）的第二通道（180）和设置在内部的流动变化元件（182） 第二通道（180）。 第一和第二压力传感器（174和176）设置在主体（144）内并且联接到引线框架组件（140），用于测量第一通道（178）内的第一压力和第二通道（180）内的第二压力， ， 分别。 被耦合到引线框组件（140）到第一压力传感器（174）和第二压力传感器（176）的集成电路（155）被配置成确定通过流动通道 第一压力和第二压力。
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公开(公告)号：US09146170B2
公开(公告)日：2015-09-29
申请号：US13562853
申请日：2012-07-31
申请人： Jian Wen , William G. McDonald
发明人： Jian Wen , William G. McDonald
CPC分类号： G01L19/14 , G01L19/0038 , G01L19/0654 , G01L19/141 , G01L19/145 , H01L2224/48091 , H01L2224/48145 , H01L2924/16235 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： An overmolded pressure sensor package is provided. The pressure sensor die (Pcell) is capped so that the Pcell has enhanced rigidity to withstand stress effects produced by the molding encapsulant. The Pcell cap includes a hole located away from the Pcell diaphragm, so that external gas pressure can be experienced by the Pcell, while at the same time directing moisture away from the diaphragm. Gel does not need to be used, and instead a soft film can be deposited on the Pcell to protect the Pcell diaphragm from excess moisture, if needed. The Pcell cap can take the form of, for example, a dummy silicon wafer or a functional ASIC.
摘要翻译： 提供了包覆成型的压力传感器封装。 压力传感器模具（Pcell）被封盖，使得Pcell具有增强的刚度以承受由模制密封剂产生的应力效应。 Pcell帽包括一个远离Pcell隔膜的孔，使得Pcell能够承受外部气体压力，同时将水分从隔膜引导出来。 凝胶不需要使用，相反，如果需要，可以在Pcell上沉积软膜以保护Pcell隔膜免受过多的水分。 Pcell帽可以采取例如虚拟硅晶片或功能ASIC的形式。
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公开(公告)号：US07489026B2
公开(公告)日：2009-02-10
申请号：US11590327
申请日：2006-10-31
申请人： James J. Wang , William G. McDonald
发明人： James J. Wang , William G. McDonald
IPC分类号： H01L23/02
CPC分类号： H01L23/4951 , H01L23/49541 , H01L23/49551 , H01L24/45 , H01L24/48 , H01L2224/06135 , H01L2224/06136 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/1461 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： Methods and apparatus are provided for decreasing the size of Quad Flat No-Lead (QFN) packages (300, 400) down to chip-scale packages. Such QFN packages include a first semiconductor chip (310, 410), a plurality of recessed leads (306, 406, 408, 411) having mold lock features, and a mold material 340, 440 substantially encasing all sides of the semiconductor chip. An active surface (314, 414) of the semiconductor chip is oriented toward a mounting side (307, 407) of the QFN package, and a plurality of wire bonds 330, 430 disposed between the active surface and the mounting side couple the active side to the leads. The QFN packages may also include a second semiconductor chip (452) coupled to a plurality of leads (408) and to the first semiconductor chip via wire bonds (431, 432) in a manner similar to the first semiconductor chip.
摘要翻译： 提供了将Quad Flat No-Lead（QFN）封装（300,400）的尺寸缩小到芯片级封装的方法和装置。 这种QFN封装包括第一半导体芯片（310,410），具有模具锁定特征的多个凹陷引线（306,406,408,411）以及基本上封装半导体芯片的所有侧面的模具材料340,440。 半导体芯片的有源表面（314,414）朝向QFN封装的安装侧（307,407）取向，并且设置在有源表面和安装侧之间的多个引线接合330,430将活动侧 到线索 QFN封装还可以包括以类似于第一半导体芯片的方式通过引线键合（431,432）耦合到多个引线（408）的第二半导体芯片（452）和第一半导体芯片（431）。
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6.发明授权Substrate contact for a capped MEMS and method of making the substrate contact at the wafer level 有权用于封装的MEMS的衬底接触和在晶片级使衬底接触的方法公开(公告)号：US07316965B2
公开(公告)日：2008-01-08
申请号：US11158793
申请日：2005-06-21
IPC分类号： H01L21/00
CPC分类号： B81B3/0086 , B81B2201/0235 , B81B2207/07 , B81B2207/098 , B81C2203/0118 , G01P15/0802 , G01P15/125 , G01P2015/0814
摘要： A MEMS device (100) is provided that includes a handle layer (108) having a sidewall (138), a cap (132) overlying said handle layer (108), said cap (132) having a sidewall (138), and a conductive material (136) disposed on at least a portion of said sidewall of said cap (138) and said sidewall of said handle layer (138) to thereby electrically couple said handle layer (108) to said cap (132). A wafer-level method for manufacturing the MEMS device from a substrate (300) comprising a handle layer (108) and a cap (132) overlying the handle layer (108) is also provided. The method includes making a first cut through the cap (132) and at least a portion of the substrate (300) to form a first sidewall (138), and depositing a conductive material (136) onto the first sidewall (138) to electrically couple the cap (132) to the substrate (300).
摘要翻译： 提供了一种MEMS器件（100），其包括具有侧壁（138）的手柄层（108），覆盖所述手柄层（108）的盖（132），所述盖（132）具有侧壁（138） 导电材料（136），设置在所述盖子（138）的所述侧壁和所述手柄层（138）的所述侧壁的至少一部分上，从而将所述手柄层（108）电耦合到所述盖子（132）。 还提供了用于从包括手柄层（108）和覆盖在手柄层（108）上的盖子（132）的衬底（300）制造MEMS器件的晶片级方法。 该方法包括通过帽（132）和基底（300）的至少一部分进行第一次切割以形成第一侧壁（138），以及将导电材料（136）沉积到第一侧壁（138）上以电 将盖（132）耦合到基板（300）。
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7.发明授权Methods and apparatus having wafer level chip scale package for sensing elements 有权具有用于感测元件的晶片级芯片级封装的方法和装置公开(公告)号：US07109055B2
公开(公告)日：2006-09-19
申请号：US11039688
申请日：2005-01-20
IPC分类号： H01L21/00
CPC分类号： B81C1/00309 , B81C2201/053
摘要： Methods are provided for manufacturing a sensor. The method comprises depositing a sacrificial material at a first predetermined thickness onto a wafer having at least one sense element mounted thereon, the sacrificial material deposited at least partially onto the at least one sense element, forming an encapsulating layer at a second predetermined thickness less than the first predetermined thickness over the wafer and around the deposited sacrificial material, and removing the sacrificial material. Apparatus for a sensor manufactured by the aforementioned method are also provided.
摘要翻译： 提供了制造传感器的方法。 该方法包括将第一预定厚度的牺牲材料沉积到具有安装在其上的至少一个感测元件的晶片上，所述牺牲材料至少部分地沉积在所述至少一个感测元件上，形成第二预定厚度的封装层， 在晶片上方并围绕沉积的牺牲材料的第一预定厚度，以及去除牺牲材料。 还提供了通过上述方法制造的传感器的装置。
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8.发明授权公开(公告)号：US07014888B2
公开(公告)日：2006-03-21
申请号：US10326675
申请日：2002-12-23
CPC分类号： G01L19/141 , G01L19/0069 , G01L19/147 , H01L2224/48091 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/3025 , H01L2924/00 , H01L2224/45099
摘要： A method and structure that protects interior electrical components of a pressure sensor (4) from corrosive particles using a sacrificial gel dome (30) to form a vent (34) in a protective gel (32) that covers electrical components that can be corroded such as wires (16), bond pads (18), and electrical leads (14). Sacrificial gel dome (30) is dispensed over a diaphragm (28) of pressure sensor (4) to form vent (34) enabling diaphragm (28) to sense pressure variations without the influence of protective gel (32). Sacrificial gel dome (30) is removed through a water rinsing process (42) to expose vent (34).
摘要翻译： 一种方法和结构，其使用牺牲凝胶圆顶（30）来保护压力传感器（4）的内部电气部件免受腐蚀性颗粒的影响，以在保护性凝胶（32）中形成通风口（34），所述保护性凝胶覆盖可被腐蚀的电气部件 作为电线（16），接合焊盘（18）和电引线（14）。 牺牲凝胶圆顶（30）被分配在压力传感器（4）的隔膜（28）上以形成通气孔（34），使得隔膜（28）能够感测压力变化而不受保护凝胶（32）的影响。 牺牲凝胶圆顶（30）通过水冲洗过程（42）去除以暴露通气孔（34）。
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9.发明授权公开(公告)号：US08476087B2
公开(公告)日：2013-07-02
申请号：US13092001
申请日：2011-04-21
申请人： Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
发明人： Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
IPC分类号： H01L21/66
CPC分类号： B81C1/0023 , B81B2201/0264 , G01L19/141 , G01L19/148 , H01L2224/48247
摘要： Fabrication methods are provided for a sensor device packages. An exemplary fabrication method involves bonding a sensor structure and another structure using a sealing structure. The sealing structure surrounds a diaphragm region of the sensor structure and provides an airtight seal between the sensor structure and the other structure to establish a fixed reference pressure on one side of the diaphragm region.
摘要翻译： 为传感器装置提供制造方法。 示例性的制造方法包括使用密封结构粘合传感器结构和另一结构。 密封结构围绕传感器结构的隔膜区域，并且在传感器结构和另一结构之间提供气密密封，以在隔膜区域的一侧上建立固定的参考压力。
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公开(公告)号：US08307714B1
公开(公告)日：2012-11-13
申请号：US13151404
申请日：2011-06-02
IPC分类号： G01L7/00
CPC分类号： G01L19/141 , G01L13/025 , G01L19/0038
摘要： A dual port pressure sensor has a lead frame having a flag having a first opening and a second opening. The lead frame has a flag having a first opening and a second opening. An encapsulant holds the lead frame. The encapsulant is over a top of the flag and a bottom of the flag is uncovered by the encapsulant. A first opening in the encapsulant is aligned with and larger than the first opening in the flag, and a second opening in the encapsulant is aligned with the second opening in the flag. A pressure sensor transducer is attached to the bottom of the flag and covers the first opening in the flag and provides an electrically detectable correlation to a pressure differential based on a first pressure received on its top side and a second pressure received on its bottom side. An integrated circuit is attached to the bottom of the flag and is electrically coupled to the pressure sensor. A lid forming an enclosure with the bottom of the flag. The pressure sensor transducer receives the first pressure through the first opening in the encapsulant and the first opening in the flag and the second pressure through the second opening in the encapsulant, the second opening in the flag, and the enclosure.
摘要翻译： 双端口压力传感器具有带有具有第一开口和第二开口的标志的引线框架。 引线框架具有具有第一开口和第二开口的标志。 密封剂保持引线框架。 密封剂在标志的顶部之上，标志的底部被封装剂覆盖。 密封剂中的第一开口与标志中的第一开口对准并且大于标志中的第一开口，并且密封剂中的第二开口与标记中的第二开口对齐。 压力传感器传感器连接到标志的底部并覆盖标志中的第一开口，并且基于在其顶侧接收的第一压力和在其底侧上接收的第二压力而提供与压力差的电可检测的相关性。 集成电路连接到标志的底部并且电耦合到压力传感器。 盖子形成与旗子底部的封闭物。 压力传感器传感器通过密封剂中的第一开口和标志中的第一开口接收第一压力，并且通过密封剂中的第二开口，标志中的第二开口和外壳接收通过第二压力的第一压力。
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