Multi-bit memory device using multi-plug
    6.
    发明授权
    Multi-bit memory device using multi-plug 有权
    多位存储设备使用多插头

    公开(公告)号:US07929330B2

    公开(公告)日:2011-04-19

    申请号:US12379894

    申请日:2009-03-04

    IPC分类号: G11C17/06

    CPC分类号: H01L27/101 G11C11/5692

    摘要: A memory device may include a cathode, an anode, a link connected to the anode, and a first connection element that connects the link to the cathode. The link and the anode may be located in a position lower than that of the cathode or the link and the anode may be located in a position higher than that of the cathode. Also, the cathode, the anode, the link, and the first connection element may be formed on the same plane.

    摘要翻译: 存储器件可以包括阴极,阳极,连接到阳极的连杆以及将连杆连接到阴极的第一连接元件。 连接件和阳极可以位于比阴极或连接件低的位置,并且阳极可以位于比阴极高的位置。 此外,阴极,阳极,连接件和第一连接元件也可以形成在同一平面上。

    Charge trap memory device
    7.
    发明申请
    Charge trap memory device 审中-公开
    电荷陷阱记忆装置

    公开(公告)号:US20080087944A1

    公开(公告)日:2008-04-17

    申请号:US11905769

    申请日:2007-10-04

    IPC分类号: H01L29/792

    CPC分类号: H01L29/42332 H01L29/40114

    摘要: A charge trap memory device may include a tunnel insulating layer formed on a substrate. A charge trap layer may be formed on the tunnel insulating layer, wherein the charge trap layer is a higher-k dielectric insulating layer doped with one or more transition metals. The tunneling insulating layer may be relatively non-reactive with respect to metals in the charge trap layer. The tunneling insulating layer may also reduce or prevent metals in the charge trap layer from diffusing into the substrate.

    摘要翻译: 电荷陷阱存储器件可以包括形成在衬底上的隧道绝缘层。 电荷陷阱层可以形成在隧道绝缘层上,其中电荷陷阱层是掺杂有一种或多种过渡金属的较高k介电绝缘层。 隧穿绝缘层相对于电荷陷阱层中的金属可能是相对不反应的。 隧道绝缘层还可以减少或防止电荷陷阱层中的金属扩散到衬底中。