Charge trap memory device
    1.
    发明申请
    Charge trap memory device 审中-公开
    电荷陷阱记忆装置

    公开(公告)号:US20080087944A1

    公开(公告)日:2008-04-17

    申请号:US11905769

    申请日:2007-10-04

    IPC分类号: H01L29/792

    CPC分类号: H01L29/42332 H01L29/40114

    摘要: A charge trap memory device may include a tunnel insulating layer formed on a substrate. A charge trap layer may be formed on the tunnel insulating layer, wherein the charge trap layer is a higher-k dielectric insulating layer doped with one or more transition metals. The tunneling insulating layer may be relatively non-reactive with respect to metals in the charge trap layer. The tunneling insulating layer may also reduce or prevent metals in the charge trap layer from diffusing into the substrate.

    摘要翻译: 电荷陷阱存储器件可以包括形成在衬底上的隧道绝缘层。 电荷陷阱层可以形成在隧道绝缘层上,其中电荷陷阱层是掺杂有一种或多种过渡金属的较高k介电绝缘层。 隧穿绝缘层相对于电荷陷阱层中的金属可能是相对不反应的。 隧道绝缘层还可以减少或防止电荷陷阱层中的金属扩散到衬底中。

    Non-volatile memory devices and programming methods thereof including moving electrons through pad oxide layers between charge trap layers
    2.
    发明授权
    Non-volatile memory devices and programming methods thereof including moving electrons through pad oxide layers between charge trap layers 失效
    非易失性存储器件及其编程方法,包括通过电荷陷阱层之间的衬垫氧化物层移动电子

    公开(公告)号:US07668016B2

    公开(公告)日:2010-02-23

    申请号:US12078141

    申请日:2008-03-27

    IPC分类号: G11C16/04

    摘要: Non-volatile memory devices and methods of programming a non-volatile memory device in which electrons are moved between charge trap layers through a pad oxide layer are provided. The non-volatile memory devices include a charge trap layer on a semiconductor substrate and storing electrons, a pad oxide layer on the first charge trap layer, and a second trap layer on the pad oxide layer and storing electrons. In a programming mode in which data is written, the stored electrons are moved between a first position of the first charge trap layer and a first position of the second charge trap layer through the pad oxide layer or between a second position of the first charge trap layer and a second position of the second charge trap layer through the pad oxide layer.

    摘要翻译: 提供非易失性存储器件以及通过衬垫氧化物层对电子在电荷陷阱层之间移动的非易失性存储器件进行编程的方法。 非易失性存储器件包括半导体衬底上的电荷陷阱层,并且存储电子,在第一电荷陷阱层上形成焊盘氧化物层,并且在焊盘氧化物层上存储第二陷阱层并存储电子。 在写入数据的编程模式中,所存储的电子在第一电荷陷阱层的第一位置和第二电荷陷阱层的第一位置之间通过焊盘氧化物层或第一电荷陷阱的第二位置之间移动 层和第二电荷陷阱层的第二位置穿过衬垫氧化物层。

    Non-volatile memory devices and programming methods thereof including moving electrons through pad oxide layers between charge trap layers
    3.
    发明申请
    Non-volatile memory devices and programming methods thereof including moving electrons through pad oxide layers between charge trap layers 失效
    非易失性存储器件及其编程方法,包括通过电荷陷阱层之间的衬垫氧化物层移动电子

    公开(公告)号:US20090034341A1

    公开(公告)日:2009-02-05

    申请号:US12078141

    申请日:2008-03-27

    IPC分类号: G11C16/04 H01L29/792

    摘要: Non-volatile memory devices and methods of programming a non-volatile memory device in which electrons are moved between charge trap layers through a pad oxide layer are provided. The non-volatile memory devices include a charge trap layer on a semiconductor substrate and storing electrons, a pad oxide layer on the first charge trap layer, and a second trap layer on the pad oxide layer and storing electrons. In a programming mode in which data is written, the stored electrons are moved between a first position of the first charge trap layer and a first position of the second charge trap layer through the pad oxide layer or between a second position of the first charge trap layer and a second position of the second charge trap layer through the pad oxide layer.

    摘要翻译: 提供非易失性存储器件以及通过衬垫氧化物层对电子在电荷陷阱层之间移动的非易失性存储器件进行编程的方法。 非易失性存储器件包括半导体衬底上的电荷陷阱层,并且存储电子,在第一电荷陷阱层上形成焊盘氧化物层,并且在焊盘氧化物层上存储第二陷阱层并存储电子。 在写入数据的编程模式中,所存储的电子在第一电荷陷阱层的第一位置和第二电荷陷阱层的第一位置之间通过焊盘氧化物层或第一电荷陷阱的第二位置之间移动 层和第二电荷陷阱层的第二位置穿过衬垫氧化物层。

    Method of programming nonvolatile memory device
    5.
    发明授权
    Method of programming nonvolatile memory device 有权
    非易失性存储器件编程方法

    公开(公告)号:US07760551B2

    公开(公告)日:2010-07-20

    申请号:US12232082

    申请日:2008-09-10

    IPC分类号: G11C16/04

    摘要: A method of programming a nonvolatile memory device may include applying a program voltage to a memory cell. A supplementary pulse may be applied to the memory cell to facilitate thermalization of charges after the application of the program voltage. A recovery voltage may be applied to the memory cell after the application of the supplementary pulse. A program state of the memory cell may be verified using a verification voltage after the application of the recovery voltage.

    摘要翻译: 非易失性存储器件的编程方法可以包括将程序电压施加到存储单元。 补充脉冲可以施加到存储器单元,以便在施加编程电压之后促进电荷的热化。 在施加补充脉冲之后,可以将复原电压施加到存储单元。 可以在施加恢复电压之后使用验证电压来验证存储器单元的编程状态。

    Method of programming nonvolatile memory device
    7.
    发明申请
    Method of programming nonvolatile memory device 有权
    非易失性存储器件编程方法

    公开(公告)号:US20090067247A1

    公开(公告)日:2009-03-12

    申请号:US12232082

    申请日:2008-09-10

    IPC分类号: G11C16/04 G11C16/06

    摘要: A method of programming a nonvolatile memory device may include applying a program voltage to a memory cell. A supplementary pulse may be applied to the memory cell to facilitate thermalization of charges after the application of the program voltage. A recovery voltage may be applied to the memory cell after the application of the supplementary pulse. A program state of the memory cell may be verified using a verification voltage after the application of the recovery voltage.

    摘要翻译: 非易失性存储器件的编程方法可以包括将程序电压施加到存储单元。 补充脉冲可以施加到存储器单元,以便在施加编程电压之后促进电荷的热化。 在施加补充脉冲之后,可以将复原电压施加到存储单元。 可以在施加恢复电压之后使用验证电压来验证存储器单元的编程状态。

    Gate stack, capacitorless dynamic random access memory including the gate stack and methods of manufacturing and operating the same
    8.
    发明申请
    Gate stack, capacitorless dynamic random access memory including the gate stack and methods of manufacturing and operating the same 审中-公开
    门堆叠,无电容动态随机存取存储器,包括栅极堆栈及其制造和操作方法

    公开(公告)号:US20090021979A1

    公开(公告)日:2009-01-22

    申请号:US12007012

    申请日:2008-01-04

    摘要: Provided are a gate stack, a capacitorless dynamic random access memory (DRAM) including the gate stack and methods of manufacturing and operating the same. The gate stack for a capacitorless DRAM may include a tunnel insulating layer on a substrate, a first charge trapping layer on the tunnel insulating layer, an interlayer insulating layer on the first charge trapping layer, a second charge trapping layer on the interlayer insulating layer, a blocking insulating layer on the second charge trapping layer, and a gate electrode on the blocking insulating layer. The capacitorless DRAM may include the gate stack on the substrate, and a source and a drain in the substrate on both sides of the gate stack.

    摘要翻译: 提供了一种栅极堆叠,包括栅极堆叠的无电容动态随机存取存储器(DRAM)及其制造和操作的方法。 用于无电容器DRAM的栅极堆叠可以包括衬底上的隧道绝缘层,隧道绝缘层上的第一电荷俘获层,第一电荷俘获层上的层间绝缘层,层间绝缘层上的第二电荷俘获层, 第二电荷俘获层上的阻挡绝缘层,以及阻挡绝缘层上的栅电极。 无电容器DRAM可以包括衬底上的栅极堆叠,以及栅极叠层两侧的衬底中的源极和漏极。