摘要:
The present invention provides a capacitor including: a bottom electrode; a first dielectric layer formed on the bottom electrode; a conductive polymer layer formed on the first dielectric layer; a second dielectric layer formed on the conductive polymer layer; and a top electrode formed on the second dielectric layer, and a method of manufacturing the same.
摘要:
A radio frequency identification (RFID) tag includes a circuit chip including a pad for an electrical connection on one surface thereof, a molding part receiving the circuit chip therein while exposing the pad to the outside, and an antenna formed on an outer surface of the molding part, having a predetermined pattern shape and electrically connected to the pad.
摘要:
An electronic component embedded printed circuit board and a manufacturing method thereof. The electronic component embedded printed circuit board includes an insulating layer forming a core layer; an electronic component inserted to project a part thereof on an upper part of the insulating layer; a metallic seed layer formed on the insulating layer including a projected surface of the electronic component; a plating layer formed on the metallic seed layer; circuit patterns electrically connected to pads of the electronic component through via-holes formed on the insulating layer; and a solder resist layer which is formed on the insulating layer and has solder balls attached onto the via-holes electrically connected to the circuit patterns. In the electronic component embedded printed circuit board, a heat radiation characteristic can be maximized and a thickness of the printed circuit board can be minimized. In case that the insulating is made of a thermoplastic resin, the electronic component can be reutilized, thereby saving product cost.
摘要:
A display array substrate according to an aspect of the invention may include: a substrate wafer having cutting grooves curved inward; and a transparent electrode coated over one surface of the substrate wafer, wherein shock, occurring when cutting the substrate wafer, is prevented from being transmitted to the transparent electrode by cutting the substrate wafer along the cutting grooves having a different height from the transparent electrode.
摘要:
There is provided a radio frequency identification (RFID) tag. The RFID tag includes a base formed of an insulating material, a circuit chip adhered to one surface of the base and including a pad for an electrical connection, and an antenna formed by jetting a conductive material onto the one surface of the base and electrically connected to the pad.
摘要:
A display array substrate according to an aspect of the invention may include: a substrate wafer having a plurality of substrates and cutting portions connecting the plurality of substrates to a dummy area, the substrate wafer being diced to provide individual substrates by cutting the cutting portions; and a transparent electrode part coated over one surface of the substrate wafer.
摘要:
There is provided a radio frequency identification (RFID) tag. The RFID tag includes a base formed of an insulating material, a circuit chip adhered to one surface of the base and including a pad for an electrical connection, and an antenna formed by jetting a conductive material onto the one surface of the base and electrically connected to the pad.
摘要:
Disclosed herein is a semiconductor chip, including: a first substrate having a concave formed on one surface thereof and an opening formed on a bottom surface of the concave; a second substrate contacting the other surface of the first substrate; and a semiconductor chip mounted in the concave.
摘要:
Disclosed is a wafer level package having a cylindrical capacitor, which is capable of increasing electrostatic capacity thanks to the use of a cylindrical capacitor structure and which includes a wafer chip having a bonding pad formed thereon and an insulating layer formed thereon and exposing the bonding pad, a redistribution layer connected to the bonding pad and extending to one side of the insulating layer, a cylindrical outer electrode connected to the redistribution layer and having a center opening therein, a cylindrical inner electrode formed in the center opening of the outer electrode so as to be separated from the outer electrode, a dielectric layer formed between the outer electrode and the inner electrode, and a resin sealing portion formed on the insulating layer to cover the redistribution layer, the inner electrode, the outer electrode and the dielectric layer and having a first recess for exposing an upper surface of the inner electrode. A method of fabricating the wafer level package having a cylindrical capacitor is also provided.
摘要:
Disclosed herein is an apparatus and method for inspecting defects in the circuit pattern of a substrate. The apparatus for inspecting defects in a circuit pattern of a substrate includes a pin probe configured to input a voltage while coming into contact with an inspection target circuit pattern of a substrate. A capacitor sensor is provided with a membrane electrode which is opposite a connection circuit pattern to be electrically connected to the inspection target circuit pattern in a non-contact manner, and is configured to detect both capacitance and capacitance variation, generated due to displacement of the membrane electrode attributable to electrostatic attractive force acting from the connection circuit pattern on the membrane electrode. A capacitance measurement unit is connected to the capacitor sensor and is configured to measure capacitance attributable to the displacement of the membrane electrode, which is input from the capacitor sensor.