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    DYE-SENSITIZED SOLAR CELLS AND MOBILE DEVICE INCLUDING THE SAME
    6.
    发明申请
    DYE-SENSITIZED SOLAR CELLS AND MOBILE DEVICE INCLUDING THE SAME 审中-公开
    透明的太阳能电池和包括它的移动装置

    公开(公告)号：US20110061707A1

    公开(公告)日：2011-03-17

    申请号：US12650198

    申请日：2009-12-30

    申请人： Woon-Chun KIM ,  Hyun-Seop Shim ,  Soon-Gyu Yim

    发明人： Woon-Chun KIM ,  Hyun-Seop Shim ,  Soon-Gyu Yim

    IPC分类号： H01L31/042

    CPC分类号： H01G9/2068 ,  H01G9/2031 ,  H01G9/2059 ,  H01L51/0028 ,  Y02E10/542 ,  Y02E10/549 ,  Y02P70/521

    摘要： A dye-sensitized solar cell and a mobile device including the same are disclosed. The dye-sensitized solar cell includes a first transparent substrate, which allows sunlight incident to pass through, a second substrate, which is formed apart from the first substrate, and a plurality of cells, which includes a first electrode, a second electrode, a light absorption layer and an electrolyte. Here, the first electrode and the second electrode are interposed between the first substrate and the second substrate, the first electrode is disposed on a rear surface of the first substrate, the second electrode is disposed on a front surface of the second substrate, the light absorption layer is interposed between the first electrode and the second electrode and includes metal oxide and a dye absorbed in the metal oxide, and the electrolyte is interposed between the first electrode and the second electrode.

    摘要翻译： 公开了一种染料敏化太阳能电池及其制造方法。 染料敏化太阳能电池包括允许阳光入射通过的第一透明基板，与第一基板分开形成的第二基板，以及多个单元，其包括第一电极，第二电极， 光吸收层和电解质。 这里，第一电极和第二电极介于第一基板和第二基板之间，第一电极设置在第一基板的后表面上，第二电极设置在第二基板的前表面上，光 吸收层插入在第一电极和第二电极之间，并且包括金属氧化物和吸收在金属氧化物中的染料，并且电解质介于第一电极和第二电极之间。

    MOBILE PHONE
    7.
    发明申请
    MOBILE PHONE 审中-公开
    移动电话

    公开(公告)号：US20110124382A1

    公开(公告)日：2011-05-26

    申请号：US12755764

    申请日：2010-04-07

    申请人： Woon-Chun Kim ,  Soon-Gyu Yim ,  Won-Tae Choi

    发明人： Woon-Chun Kim ,  Soon-Gyu Yim ,  Won-Tae Choi

    IPC分类号： H04B1/38 ,  H01L31/00

    CPC分类号： H04M19/08 ,  G06F1/1656 ,  G06F1/181 ,  H01G9/2031 ,  H01G9/2059 ,  H01G9/2068 ,  H04B1/3833 ,  Y02E10/542 ,  Y02P70/521

    摘要： Disclosed is a mobile phone that includes a body having a base layer formed on one surface thereof and a dye-sensitized solar cell mounted on one surface of the body to face the base layer and providing electricity to the body. The dye-sensitized solar cell includes a first transparent substrate, a first electrode, a second electrode, a light absorption layer, a catalytic layer, an electrolyte and a second substrate, and the base layer forms a background against a pattern formed by a dye such that the pattern can be identified when viewed from the outside.

    摘要翻译： 公开了一种移动电话，其包括具有在其一个表面上形成的基底层的主体和安装在主体的一个表面上以面向基底层并且向身体提供电力的染料敏化太阳能电池。 染料敏化太阳能电池包括第一透明基板，第一电极，第二电极，光吸收层，催化层，电解质和第二基板，并且基层与由染料形成的图案形成背景 使得当从外部观察时可以识别图案。

    ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    8.
    发明申请
    ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 有权
    电子元件嵌入式印刷电路板及其制造方法

    公开(公告)号：US20100101847A1

    公开(公告)日：2010-04-29

    申请号：US12416472

    申请日：2009-04-01

    申请人： Woon-Chun KIM ,  Soon-Gyu Yim

    发明人： Woon-Chun KIM ,  Soon-Gyu Yim

    IPC分类号： H05K1/02 ,  H05K3/30

    CPC分类号： H05K1/186 ,  H01L24/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H05K3/061 ,  H05K3/323 ,  H05K3/4652 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/063 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49142 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened.

    摘要翻译： 公开了一种具有电子部件嵌入式印刷电路板的印刷电路板及其制造方法。 根据本发明的实施例，制造具有在其一个表面上形成有凹槽的嵌入式电子部件和形成在凹槽内的电极的印刷电路板的制造方法包括：在第一电极的一个表面上形成第一电路图案 金属层 将第一金属层压在第一绝缘体上; 通过选择性地蚀刻第一金属层的另一个表面来形成第一导电突起; 以及通过设置导电粘合剂层来安装第一电子部件，使得第一电子部件的电极和第一导电突起彼此电连接。 因此，可以容易且可靠地安装不具有向外突出的电极的电子部件，并且可以缩短制造时间。

    CAPACITOR
    9.
    发明申请
    CAPACITOR 审中-公开
    电容器

    公开(公告)号：US20100142116A1

    公开(公告)日：2010-06-10

    申请号：US12482104

    申请日：2009-06-10

    申请人： Woon-Chun KIM ,  Sung Yi ,  Soon-Gyu Yim

    发明人： Woon-Chun KIM ,  Sung Yi ,  Soon-Gyu Yim

    IPC分类号： H01G4/255 ,  H01G4/06

    CPC分类号： H01G4/206 ,  H01G4/255

    摘要： A capacitor is disclosed. The capacitor in accordance with an embodiment of the present invention includes a first electrode, a dielectric substance, which is formed on the first electrode, a second electrode, which is formed on the dielectric substance, and a magnetic layer, which is interposed between the dielectric substance and at least one of the first electrode and the second electrode. In accordance with the present embodiment, dielectric loss can be reduced while minimizing the reduction of capacitance of the capacitor.

    摘要翻译： 公开了一种电容器。 根据本发明的实施例的电容器包括形成在第一电极上的第一电极，电介质，形成在电介质上的第二电极和介于物质之间的磁性层， 电介质物质和第一电极和第二电极中的至少一个。 根据本实施例，可以减小电容器的电容的减小同时减小介质损耗。

    MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD
    10.
    发明申请
    MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板的制造方法

    公开(公告)号：US20100140100A1

    公开(公告)日：2010-06-10

    申请号：US12482122

    申请日：2009-06-10

    申请人： Woon-Chun KIM ,  Soon-Gyu Yim ,  Young-Ju Kim ,  Hwa-Jan Jung

    发明人： Woon-Chun KIM ,  Soon-Gyu Yim ,  Young-Ju Kim ,  Hwa-Jan Jung

    IPC分类号： H05K3/10 ,  C25D5/02

    CPC分类号： H05K3/205 ,  H05K3/108 ,  H05K2201/0376 ,  H05K2203/1152 ,  H05K2203/1536

    摘要： Disclosed is a method of manufacturing a printed circuit board. The method can include providing a carrier formed with a release layer, performing a roughening treatment on the release layer such that the release layer has surface roughness, forming a circuit pattern on the release layer, stacking the carrier on an insulating layer such that the circuit pattern is buried in the insulating layer, and separating the release layer and the carrier from the insulating layer and the circuit pattern.

    摘要翻译： 公开了印刷电路板的制造方法。 该方法可以包括提供形成有释放层的载体，对剥离层进行粗糙化处理，使得剥离层具有表面粗糙度，在剥离层上形成电路图案，将载体堆叠在绝缘层上，使得电路 将图案掩埋在绝缘层中，并且将隔离层和载体与绝缘层和电路图案分离。