公开(公告)号：US20150084089A1

公开(公告)日：2015-03-26

申请号：US14555186

申请日：2014-11-26

申请人： Young Ki LEE ,  Seog Moon CHOI ,  Sang Hyun SHIN

发明人： Young Ki LEE ,  Seog Moon CHOI ,  Sang Hyun SHIN

IPC分类号： H01L33/48 ,  H01L33/62

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H05K3/28 ,  H05K2203/0315 ,  H05K2203/0542

摘要： An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

摘要翻译： 一种用于高温条件的绝缘结构及其制造方法。 在绝缘结构中，衬底具有形成在其至少一个表面上的用于电连接器件的导电图案。 通过阳极氧化在导电图案的预定部分上形成金属氧化物层图案，金属氧化物层图案由选自Al，Ti和Mg的一种形成。

公开(公告)号：US20130020111A1

公开(公告)日：2013-01-24

申请号：US13253866

申请日：2011-10-05

申请人： Kyu Hwan Oh ,  Jong Man Kim ,  Seog Moon Choi ,  Young Hoon Kwak ,  Kwang Soo Kim ,  Young Ki Lee

发明人： Kyu Hwan Oh ,  Jong Man Kim ,  Seog Moon Choi ,  Young Hoon Kwak ,  Kwang Soo Kim ,  Young Ki Lee

IPC分类号： H05K1/05 ,  H05K1/02 ,  H05K3/10 ,  H05K1/00

CPC分类号： H05K1/053 ,  H01L23/142 ,  H01L2924/0002 ,  H05K2203/0315 ,  Y10T29/49155 ,  H01L2924/00

摘要： Disclosed herein are a substrate for a power module package and a method for manufacturing the same, including: a base substrate made of a metal material; an anodized layer formed on the base substrate; and a circuit layer formed on the anodized layer, wherein the anodized layer is formed to correspond to circuit patterns on the circuit layer or is formed to be divided into a plurality of areas.

摘要翻译： 本文公开了一种用于功率模块封装的基板及其制造方法，包括：由金属材料制成的基底; 形成在基底基板上的阳极化层; 以及形成在所述阳极氧化层上的电路层，其中所述阳极化层形成为对应于所述电路层上的电路图案，或者形成为被划分为多个区域。

公开(公告)号：US08310023B2

公开(公告)日：2012-11-13

申请号：US12360444

申请日：2009-01-27

申请人： Ho Joon Park ,  Woong Lin Hwang ,  Seog Moon Choi ,  Sung Jun Lee ,  Sang Hyun Choi ,  Chang Hyun Lim

发明人： Ho Joon Park ,  Woong Lin Hwang ,  Seog Moon Choi ,  Sung Jun Lee ,  Sang Hyun Choi ,  Chang Hyun Lim

IPC分类号： H01L23/52

CPC分类号： H01L33/641 ,  H01L33/46 ,  H01L2224/16225 ,  H01L2224/97

摘要： The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.

摘要翻译： 本发明提供一种LED封装及其制造方法。 本发明提供了一种LED封装，其包括基座硅基板和绝缘膜以及形成在基座硅基板上的电极图案。 LED封装还包括形成在电极图案上的具有通孔的间隔物。 LED封装还包括接收在通孔中的LED，与芯片接合的倒装芯片，以及附着到间隔物的上表面的光学元件。

公开(公告)号：US08309399B2

公开(公告)日：2012-11-13

申请号：US13246615

申请日：2011-09-27

申请人： Shan Gao ,  Seog Moon Choi ,  Tae Hyun Kim ,  Ju Pyo Hong ,  Bum Sik Jang ,  Ji Hyun Park

发明人： Shan Gao ,  Seog Moon Choi ,  Tae Hyun Kim ,  Ju Pyo Hong ,  Bum Sik Jang ,  Ji Hyun Park

IPC分类号： H01L21/50

CPC分类号： H01L25/072 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/427 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/071 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a power semiconductor module. The module includes metal plates each having a first through hole, with an anodic oxidation layer formed on a surface of metal plates and an interior of the first through hole. A cooling member has a second through hole at a position corresponding to the first through hole, and the metal plates are attached to both sides of the cooling member. A circuit layer is formed on the anodic oxidation layer and performs an interlayer connection through a via formed in the first and second through holes. A power device is connected to the circuit layer. A resin encapsulant encloses the circuit layer and the power device. A housing is installed to each of the metal plates to form a sealing space for the resin encapsulant.

摘要翻译： 这里公开了功率半导体模块。 模块包括各自具有第一通孔的金属板，阳极氧化层形成在金属板的表面和第一通孔的内部。 冷却构件在与第一通孔对应的位置具有第二通孔，并且金属板附接到冷却构件的两侧。 在阳极氧化层上形成电路层，通过在第一和第二通孔中形成的通孔进行层间连接。 电源设备连接到电路层。 树脂密封剂包围电路层和功率器件。 每个金属板上安装有一个壳体，以形成树脂密封剂的密封空间。

公开(公告)号：US20120273558A1

公开(公告)日：2012-11-01

申请号：US13540504

申请日：2012-07-02

申请人： Hye Sook SHIN ,  Seog Moon CHOI ,  Shan GAO ,  Chang Hyun LIM ,  Tae Hyun KIM ,  Young Ki LEE

发明人： Hye Sook SHIN ,  Seog Moon CHOI ,  Shan GAO ,  Chang Hyun LIM ,  Tae Hyun KIM ,  Young Ki LEE

IPC分类号： B23K1/20

CPC分类号： H05K7/205 ,  H05K1/0209 ,  H05K1/0263 ,  H05K1/053 ,  H05K3/202 ,  H05K3/24 ,  H05K3/341 ,  H05K2201/066 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155

摘要： Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.

摘要翻译： 公开了一种散热电路板，其包括金属芯，该金属芯包括在其表面上形成的绝缘层，形成在绝缘层上的电路层，包括种子层和第一电路图案，以及散热框架层， 使用焊料并具有第二电路图案的电路层，其中散热框架层不是通过电镀工艺而是通过使用焊料结合到电路层上，因此降低了电镀工艺的成本和时间并减轻了施加的应力 由于电镀过程而导致散热电路板。 还提供了制造散热电路板的方法。

公开(公告)号：US08198543B2

公开(公告)日：2012-06-12

申请号：US12618726

申请日：2009-11-14

申请人： Jung Eun Kang ,  Seog Moon Choi ,  Tae Hoon Kim ,  Young Ki Lee ,  Hye Sook Shin ,  Chang Hyun Lim

发明人： Jung Eun Kang ,  Seog Moon Choi ,  Tae Hoon Kim ,  Young Ki Lee ,  Hye Sook Shin ,  Chang Hyun Lim

IPC分类号： H05K1/00

CPC分类号： H05K3/4641 ,  H05K1/0203 ,  H05K1/053 ,  H05K1/189 ,  H05K3/462 ,  H05K3/4691 ,  H05K2203/0315 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.

摘要翻译： 公开了一种刚性柔性电路板，其包括刚性区域和柔性区域，所述刚性区域包括在其两个表面上具有第一电路层的柔性基板，形成在柔性基板上的金属芯基板，并具有第二电路 并且设置在柔性基板和金属芯基板之间的粘合层，其中金属芯基板包括具有通孔的金属芯和形成在金属芯的表面上的绝缘层，使得 刚性区域和柔性区域彼此热分离，改善了刚性区域的散热性能。 还提供了制造刚性柔性电路板的方法。

公开(公告)号：US20120139098A1

公开(公告)日：2012-06-07

申请号：US13009812

申请日：2011-01-19

申请人： Kwan Ho LEE ,  Seog Moon CHOI

发明人： Kwan Ho LEE ,  Seog Moon CHOI

IPC分类号： H01L23/36

CPC分类号： H01L23/427 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a power package module, including: a power package mounted with a plurality of semiconductor chips; a heat radiation module coming into contact with the power package and including a first heat radiation member for discharging heat generated from the power package; and a second heat radiation member, one side of which is connected to the first heat radiation member and the other side of which is connected to the power package.

摘要翻译： 本文公开了一种功率封装模块，包括：安装有多个半导体芯片的功率封装; 热辐射模块与功率封装接触并且包括用于排放从功率封装产生的热量的第一散热构件; 以及第二散热构件，其一侧连接到第一散热构件，另一侧连接到动力封装。

公开(公告)号：US20120111610A1

公开(公告)日：2012-05-10

申请号：US13013736

申请日：2011-01-25

申请人： Kwang Soo KIM ,  Sang Hyun SHIN ,  Jung Eun KANG ,  Chang Hyun LIM ,  Seog Moon CHOI ,  Sung Keun PARK

发明人： Kwang Soo KIM ,  Sang Hyun SHIN ,  Jung Eun KANG ,  Chang Hyun LIM ,  Seog Moon CHOI ,  Sung Keun PARK

IPC分类号： H05K1/02 ,  C23C28/00

CPC分类号： H01L23/3735 ,  H01L23/142 ,  H01L23/4334 ,  H01L23/49531 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： Disclosed herein are a heat-radiating substrate and a method for manufacturing the same. The heat-radiating substrate includes: an anodized substrate having an anodized film formed over a metal substrate; a circuit pattern formed on one surface of the anodized substrate; and a metal layer formed on the other surface of the anodized substrate. The metal layer formed on the other surface of the anodized substrate has the same area as that of the circuit pattern formed on one surface thereof, and is formed within an edge of the anodized substrate. The metal layer is added, making it possible to minimize a warpage problem of the substrate. In addition, a heat radiating plate is in direct contact with the anodized substrate, thereby making it possible to solve a performance deterioration problem of the heat-radiating substrate and a heat generating element and improve a heat-radiating performance.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：阳极氧化基板，其具有形成在金属基板上的阳极氧化膜; 形成在所述阳极氧化基板的一个表面上的电路图案; 以及形成在阳极氧化基板的另一表面上的金属层。 形成在阳极氧化基板的另一个表面上的金属层具有与在其一个表面上形成的电路图案相同的面积，并且形成在阳极氧化基板的边缘内。 添加金属层，使得可以使基板的翘曲问题最小化。 此外，散热板与阳极化基板直接接触，从而可以解决散热基板和发热元件的性能劣化问题，并提高散热性能。

公开(公告)号：US20120049788A1

公开(公告)日：2012-03-01

申请号：US13018806

申请日：2011-02-01

申请人： Jong Man KIM ,  Seog Moon CHOI ,  Kyu Bum HAN

发明人： Jong Man KIM ,  Seog Moon CHOI ,  Kyu Bum HAN

IPC分类号： H02J7/00

CPC分类号： H05K7/20918

摘要： Disclosed herein is a charge module for charging a high-capacity battery.The charge module according to the exemplary embodiment of the present invention includes: a heat sink; a fan cover covering the top of the heat sink; a fan mounted on the upper center of the fan cover; and a heat pipe inserted into the side wall of the heat sink to dissipate heat from the side wall of the heat sink through the circulation of refrigerants.

摘要翻译： 这里公开了一种用于对高容量电池进行充电的充电模块。 根据本发明的示例性实施例的充电模块包括：散热器; 覆盖散热器顶部的风扇盖; 风扇安装在风扇罩的上部中心; 以及插入散热器的侧壁中的热管，以通过制冷剂的循环从散热器的侧壁散发热量。

公开(公告)号：US08047693B2

公开(公告)日：2011-11-01

申请号：US12507356

申请日：2009-07-22

申请人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin ,  Shan Gao ,  Jong Woon Kim

发明人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin ,  Shan Gao ,  Jong Woon Kim

IPC分类号： F21V7/00

CPC分类号： F21V29/63 ,  B61D29/00 ,  F21S41/141 ,  F21S41/143 ,  F21S45/43 ,  F21V29/02 ,  F21W2102/00 ,  F21W2107/10 ,  F21Y2115/10 ,  F28F13/00 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling device for a light emitting device package of a vibration generating machine, includes: a heat releasing plate provided at one side of the light emitting device package; a vibrator disposed to face the heat releasing plate and vibrating to generate an air flow according to vibration of the vibration generating machine; and a vibration transfer unit configured to connect the vibrator and the heat releasing plate to allow the air flow generated from the vibrator to be transferred to the heat releasing plate so as to be cooled.

摘要翻译： 一种用于振动发生机的发光器件封装的冷却装置，包括：设置在发光器件封装的一侧的散热板; 振动器，其设置为面对所述散热板并振动以根据所述振动发生机的振动产生气流; 以及振动传递单元，其构造成将所述振动器和所述散热板连接以允许从所述振动器产生的气流被传递到所述散热板以被冷却。