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12 条记录 (耗时 0.024 秒)

    Connection member and separation membrane module using the same
    1.
    发明授权
    Connection member and separation membrane module using the same 有权
    连接件和分离膜组件使用相同

    公开(公告)号：US08568589B2

    公开(公告)日：2013-10-29

    申请号：US12865509

    申请日：2009-02-20

    申请人： Yasuhiro Uda ,  Toshimitsu Hamada ,  Masashi Beppu ,  Shinichi Chikura ,  Nobuharu Tahara ,  Masakatsu Takata

    发明人： Yasuhiro Uda ,  Toshimitsu Hamada ,  Masashi Beppu ,  Shinichi Chikura ,  Nobuharu Tahara ,  Masakatsu Takata

    IPC分类号： B01D35/30 ,  B01D29/56 ,  B01D63/12 ,  C02F1/44

    CPC分类号： B01D63/106 ,  B01D63/12 ,  B01D2319/022

    摘要： Provided are a connection member capable of preventing leakage from a supply side to a permeating side from occurring by a simple means; and a separation membrane module using the connection member. The connection member (20) is used to connect in series a plurality of separation membrane elements equipped with end surface holding members (36) and to install the separation membrane elements in a pressure-resistant vessel (38). The connection member (20) is characterized in that, when the separation membrane elements are connected to each other, the connection member is engaged with respective grooves (36b) of the end surface holding members (36) adjacent to each other.

    摘要翻译： 提供了能够通过简单的手段防止从供给侧到渗透侧的泄漏的连接构件; 以及使用该连接部件的分离膜组件。 连接构件（20）用于串联连接配备有端面保持构件（36）的多个分离膜元件，并将分离膜元件安装在耐压容器（38）中。 连接构件（20）的特征在于，当分离膜元件彼此连接时，连接构件与彼此相邻的端面保持构件（36）的相应凹槽（36b）接合。

    CONNECTION MEMBER AND SEPARATION MEMBRANE MODULE USING THE SAME
    2.
    发明申请
    CONNECTION MEMBER AND SEPARATION MEMBRANE MODULE USING THE SAME 有权
    连接构件和分离膜模块使用相同

    公开(公告)号：US20110000844A1

    公开(公告)日：2011-01-06

    申请号：US12865509

    申请日：2009-02-20

    申请人： Yasuhiro Uda ,  Toshimitsu Hamada ,  Masashi Beppu ,  Shinichi Chikura ,  Nobuharu Tahara ,  Masakatsu Takata

    发明人： Yasuhiro Uda ,  Toshimitsu Hamada ,  Masashi Beppu ,  Shinichi Chikura ,  Nobuharu Tahara ,  Masakatsu Takata

    IPC分类号： B01D69/00 ,  F16L17/00

    CPC分类号： B01D63/106 ,  B01D63/12 ,  B01D2319/022

    摘要： Provided are a connection member capable of preventing leakage from a supply side to a permeating side from occurring by a simple means; and a separation membrane module using the connection member. The connection member (20) is used to connect in series a plurality of separation membrane elements equipped with end surface holding members (36) and to install the separation membrane elements in a pressure-resistant vessel (38). The connection member (20) is characterized in that, when the separation membrane elements are connected to each other, the connection member is engaged with respective grooves (36b) of the end surface holding members (36) adjacent to each other.

    摘要翻译： 提供了能够通过简单的手段防止从供给侧到渗透侧的泄漏的连接构件; 以及使用该连接部件的分离膜组件。 连接构件（20）用于串联连接配备有端面保持构件（36）的多个分离膜元件，并将分离膜元件安装在耐压容器（38）中。 连接构件（20）的特征在于，当分离膜元件彼此连接时，连接构件与彼此相邻的端面保持构件（36）的相应凹槽（36b）接合。

    Wiring board and method of manufacturing the same
    4.
    发明授权
    Wiring board and method of manufacturing the same 失效
    接线板及其制造方法

    公开(公告)号：US06761790B2

    公开(公告)日：2004-07-13

    申请号：US10136053

    申请日：2002-04-30

    申请人： Toshiyuki Kawashima ,  Nobuharu Tahara ,  Kenichi Ikeda

    发明人： Toshiyuki Kawashima ,  Nobuharu Tahara ,  Kenichi Ikeda

    IPC分类号： H05K103

    CPC分类号： H05K3/4069 ,  H05K3/4652 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2203/0191 ,  H05K2203/0425 ,  H05K2203/1461 ,  Y10S156/922 ,  Y10T156/11 ,  Y10T428/24917

    摘要： The present invention provides a method of manufacturing a wiring board, including the steps of forming a through hole on a prepreg having a releasing resin film on at least one of its surfaces, the prepreg being obtained by impregnating a porous film having a thickness of 5 to 90 &mgr;m and a porosity of 30 to 98% with a half cured thermosetting resin, filling the through hole with a conductive paste containing a conductive filler, peeling the resin film, laminating a metal foil on a surface from which the resin film is peeled, and heating and pressurizing the laminated product. Moreover, the present invention provides a wiring board including an insulating layer obtained by impregnating a porous film having a thickness of 5 to 90 &mgr;m and a porosity of 30 to 98% with a thermosetting resin and curing them, and a conductive connection structure between wiring layers in which a through hole provided on the insulating layer is filled with a conductive paste, wherein the conductive connection structure has the conductive filler at only a boundary surface with the porous film and in an inner part thereof.

    摘要翻译： 本发明提供一种制造布线板的方法，包括以下步骤：在至少一个表面上具有释放树脂膜的预浸料坯上形成通孔，将预浸料通过浸渍厚度为5μm的多孔膜 用半固化的热固性树脂填充至90μm和30至98％的孔隙率，用含有导电填料的导电膏填充通孔，剥离树脂膜，在剥离树脂膜的表面上层压金属箔 ，并对层压制品进行加热和加压。 此外，本发明提供一种布线基板，其包括通过用热固性树脂浸渍厚度为5-90μm，孔隙率为30-98％的多孔膜并固化而获得的绝缘层，以及布线之间的导电连接结构 其中设置在绝缘层上的通孔填充有导电膏的层，其中导电连接结构仅在与多孔膜的边界面及其内部具有导电填料。

    Porous film and method for preparation thereof
    9.
    发明申请
    Porous film and method for preparation thereof 审中-公开
    多孔膜及其制备方法

    公开(公告)号：US20070172640A1

    公开(公告)日：2007-07-26

    申请号：US10587786

    申请日：2005-01-27

    申请人： Nobuharu Tahara ,  Yasuhiro Tomi ,  Hideto Matsuyama

    发明人： Nobuharu Tahara ,  Yasuhiro Tomi ,  Hideto Matsuyama

    IPC分类号： B32B3/26 ,  H01M2/16 ,  C08K3/34

    CPC分类号： C08J5/18 ,  C08J2327/16 ,  Y10T428/24999

    摘要： A production method for preparing a porous film of a poly(vinylidene fluoride) based resin which has a microstructure providing a satisfactory mechanical strength and permeation performance and is improved in hydrophilic property, without the precise control of temperature before cooling, as well as a porous film prepared by the above method is provided. The above method for producing a porous film wherein a porous film of a poly(vinylidene fluoride) based resin is prepared by dissolving the poly(vinylidene fluoride) based resin in a poor solvent through heating to form a liquid raw material for a film, and then cooling the liquid raw material to bring about a phase separation is characterized in that an organized clay being organized by a hydrophilic compound is dispersed in said liquid raw material for a film in an amount of 1 to 25 parts by weight relative to 100 parts by weight of the poly(vinylidene fluoride) based resin.

    摘要翻译： 一种制备聚（偏二氟乙烯）基树脂的多孔膜的制备方法，其具有提供令人满意的机械强度和渗透性能的微结构，并且在冷却之前没有精确控制温度的情况下提高亲水性，以及多孔 提供通过上述方法制备的膜。 上述制造多孔膜的方法，其中通过加热将聚偏氟乙烯基树脂溶解在不良溶剂中以形成用于膜的液体原料来制备聚偏二氟乙烯基树脂的多孔膜，以及 然后冷却液体原料进行相分离，其特征在于将由亲水性化合物组织的有机粘土以相对于100份的比例分散在所述液体原料中为1〜25重量份 聚（偏二氟乙烯）系树脂的重量。

    Method of forming composite insulating layer and process of producing wiring board
    10.
    发明授权
    Method of forming composite insulating layer and process of producing wiring board 失效
    形成复合绝缘层的方法和生产接线板的工艺

    公开(公告)号：US07022373B2

    公开(公告)日：2006-04-04

    申请号：US10780677

    申请日：2004-02-19

    申请人： Nobuharu Tahara ,  Toshiyuki Kawashima

    发明人： Nobuharu Tahara ,  Toshiyuki Kawashima

    IPC分类号： B05D5/12

    CPC分类号： H05K1/0346 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0355

    摘要： A method of forming a composite insulating layer in which a thin and uniform adhesive layer can be formed, and an adhesive strength between an adhesive layer and a porous layer is sufficient, a insulating layer obtained by the formation method, and a process of producing a wiring board, wherein an insulating layer is formed by the formation method, are disclosed. The method of forming a composite insulating layer includes a step of forming an adhesive layer 2 containing a partially imidated polyamic acid on a metallic foil 1; a step of applying a solution 3 containing a polyamic acid to the surface of the adhesive layer 2; a step of subjecting the coated solution 3 to phase separation to form a porous layer 4; and a step of subjecting the adhesive layer 2 and the porous layer 4 to imide conversion.

    摘要翻译： 可以形成复合绝缘层的方法，其中可以形成薄且均匀的粘合剂层，并且粘合剂层和多孔层之间的粘合强度是足够的，通过形成方法获得的绝缘层，以及制备 公开了通过形成方法形成绝缘层的布线基板。 形成复合绝缘层的方法包括在金属箔1上形成含有部分酰亚胺化聚酰胺酸的粘合剂层2的步骤; 将含有聚酰胺酸的溶液3涂布到粘合剂层2的表面的步骤; 对涂布液3进行相分离以形成多孔层4的工序; 以及使粘合层2和多孔层4进行酰亚胺转化的工序。