利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

49 条记录 (耗时 0.018 秒)

    Method of forming composite insulating layer and process of producing wiring board
    5.
    发明授权
    Method of forming composite insulating layer and process of producing wiring board 失效
    形成复合绝缘层的方法和生产接线板的工艺

    公开(公告)号：US07022373B2

    公开(公告)日：2006-04-04

    申请号：US10780677

    申请日：2004-02-19

    申请人： Nobuharu Tahara ,  Toshiyuki Kawashima

    发明人： Nobuharu Tahara ,  Toshiyuki Kawashima

    IPC分类号： B05D5/12

    CPC分类号： H05K1/0346 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0355

    摘要： A method of forming a composite insulating layer in which a thin and uniform adhesive layer can be formed, and an adhesive strength between an adhesive layer and a porous layer is sufficient, a insulating layer obtained by the formation method, and a process of producing a wiring board, wherein an insulating layer is formed by the formation method, are disclosed. The method of forming a composite insulating layer includes a step of forming an adhesive layer 2 containing a partially imidated polyamic acid on a metallic foil 1; a step of applying a solution 3 containing a polyamic acid to the surface of the adhesive layer 2; a step of subjecting the coated solution 3 to phase separation to form a porous layer 4; and a step of subjecting the adhesive layer 2 and the porous layer 4 to imide conversion.

    摘要翻译： 可以形成复合绝缘层的方法，其中可以形成薄且均匀的粘合剂层，并且粘合剂层和多孔层之间的粘合强度是足够的，通过形成方法获得的绝缘层，以及制备 公开了通过形成方法形成绝缘层的布线基板。 形成复合绝缘层的方法包括在金属箔1上形成含有部分酰亚胺化聚酰胺酸的粘合剂层2的步骤; 将含有聚酰胺酸的溶液3涂布到粘合剂层2的表面的步骤; 对涂布液3进行相分离以形成多孔层4的工序; 以及使粘合层2和多孔层4进行酰亚胺转化的工序。

    Method of metal layer formation and metal foil-based layered product
    6.
    发明授权
    Method of metal layer formation and metal foil-based layered product 失效
    金属层形成方法和金属箔基层状产品

    公开(公告)号：US06773572B2

    公开(公告)日：2004-08-10

    申请号：US10330300

    申请日：2002-12-30

    申请人： Toshiyuki Kawashima ,  Nobuharu Tahara ,  Kenichi Ikeda

    发明人： Toshiyuki Kawashima ,  Nobuharu Tahara ,  Kenichi Ikeda

    IPC分类号： C23C2802

    CPC分类号： H05K3/388 ,  B32B15/08 ,  B32B27/38 ,  C23C28/00 ,  C23C28/021 ,  C23C28/023 ,  H05K1/036 ,  H05K1/056 ,  H05K2201/0116 ,  Y10T428/12569 ,  Y10T428/31678

    摘要： A method of metal layer formation which can satisfactorily eliminate the problems caused by plating solution infiltration and is sufficiently effective in reducing the permittivity of an insulating layer; and a metal foil-based layered product obtainable by the method. The method is for forming a metal layer on a surface of a porous resin layer and includes: a step in which a porous resin layer having a dense layer as a surface part thereof is used as the porous resin layer and a thin metal film is formed on the surface of the dense layer by a dry process; and a step in which a metal film is formed on the surface of the thin metal film by plating.

    摘要翻译： 金属层形成方法可以令人满意地消除由电镀溶液浸渗引起的问题，并且能够有效地降低绝缘层的介电常数; 以及通过该方法得到的金属箔基层叠体。 该方法是在多孔树脂层的表面形成金属层，其特征在于，具有作为其表面部分的具有致密层的多孔树脂层用作多孔树脂层和形成薄金属膜的步骤 通过干法在致密层的表面上; 以及通过电镀在金属薄膜的表面上形成金属膜的工序。

    Metal foil laminated plate and method of manufacturing the same
    7.
    发明授权
    Metal foil laminated plate and method of manufacturing the same 失效
    金属箔层压板及其制造方法

    公开(公告)号：US06759082B2

    公开(公告)日：2004-07-06

    申请号：US10151072

    申请日：2002-05-17

    申请人： Kenichi Ikeda ,  Toshiyuki Kawashima ,  Nobuharu Tahara

    发明人： Kenichi Ikeda ,  Toshiyuki Kawashima ,  Nobuharu Tahara

    IPC分类号： B05D512

    CPC分类号： H05K3/4614 ,  H05K3/423 ,  H05K3/4626 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0369 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1147 ,  Y10T428/24917

    摘要： The present invention provides a method of manufacturing a metal foil laminated plate comprising the step of forming and attaching a resin porous layer onto a metal foil by a wet coagulating method, wherein a metal foil including a conductive bump having an almost equal height on a film forming side surface is used. The present invention provides a metal foil laminated plate comprising a metal foil including a conductive bump having an almost equal height and a resin porous layer laminated integrally, the conductive bump being exposed. The present invention provides another metal foil laminated plate comprising a metal foil including a conductive bump having an almost equal height, a resin porous layer laminated integrally, and a thermosetting resin impregnated in a hole of the resin porous layer, in which the conductive bump is exposed from the resin porous layer.

    摘要翻译： 本发明提供一种金属箔层叠板的制造方法，其特征在于，包括以下步骤：通过湿式凝固法将树脂多孔层形成并附着到金属箔上，其中，在膜上具有几乎相同的高度的导电凸块的金属箔 使用形成侧面。 本发明提供一种金属箔层压板，其包括金属箔，该金属箔包括具有几乎相等高度的导电凸块和一体层压的树脂多孔层，所述导电凸块被暴露。 本发明提供另一种金属箔层压板，其包括金属箔，该金属箔包括具有几乎相同高度的导电凸块，一体层压的树脂多孔层和浸渍在树脂多孔层的孔中的热固性树脂，其中导电凸块 从树脂多孔层露出。

    Wiring board and method of manufacturing the same
    9.
    发明授权
    Wiring board and method of manufacturing the same 失效
    接线板及其制造方法

    公开(公告)号：US06761790B2

    公开(公告)日：2004-07-13

    申请号：US10136053

    申请日：2002-04-30

    申请人： Toshiyuki Kawashima ,  Nobuharu Tahara ,  Kenichi Ikeda

    发明人： Toshiyuki Kawashima ,  Nobuharu Tahara ,  Kenichi Ikeda

    IPC分类号： H05K103

    CPC分类号： H05K3/4069 ,  H05K3/4652 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2203/0191 ,  H05K2203/0425 ,  H05K2203/1461 ,  Y10S156/922 ,  Y10T156/11 ,  Y10T428/24917

    摘要： The present invention provides a method of manufacturing a wiring board, including the steps of forming a through hole on a prepreg having a releasing resin film on at least one of its surfaces, the prepreg being obtained by impregnating a porous film having a thickness of 5 to 90 &mgr;m and a porosity of 30 to 98% with a half cured thermosetting resin, filling the through hole with a conductive paste containing a conductive filler, peeling the resin film, laminating a metal foil on a surface from which the resin film is peeled, and heating and pressurizing the laminated product. Moreover, the present invention provides a wiring board including an insulating layer obtained by impregnating a porous film having a thickness of 5 to 90 &mgr;m and a porosity of 30 to 98% with a thermosetting resin and curing them, and a conductive connection structure between wiring layers in which a through hole provided on the insulating layer is filled with a conductive paste, wherein the conductive connection structure has the conductive filler at only a boundary surface with the porous film and in an inner part thereof.

    摘要翻译： 本发明提供一种制造布线板的方法，包括以下步骤：在至少一个表面上具有释放树脂膜的预浸料坯上形成通孔，将预浸料通过浸渍厚度为5μm的多孔膜 用半固化的热固性树脂填充至90μm和30至98％的孔隙率，用含有导电填料的导电膏填充通孔，剥离树脂膜，在剥离树脂膜的表面上层压金属箔 ，并对层压制品进行加热和加压。 此外，本发明提供一种布线基板，其包括通过用热固性树脂浸渍厚度为5-90μm，孔隙率为30-98％的多孔膜并固化而获得的绝缘层，以及布线之间的导电连接结构 其中设置在绝缘层上的通孔填充有导电膏的层，其中导电连接结构仅在与多孔膜的边界面及其内部具有导电填料。