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公开(公告)号：US07017264B2
公开(公告)日：2006-03-28
申请号：US10171502
申请日：2002-06-11
IPC分类号： H01K3/10
CPC分类号： H05K3/4617 , H05K1/185 , H05K3/4611 , H05K3/4647 , H05K3/4652 , H05K2201/0116 , H05K2201/0154 , H05K2201/0355 , H05K2203/0384 , H05K2203/0733 , H05K2203/1147 , Y10T29/49155 , Y10T29/49165
摘要： The present invention provides a method of manufacturing a multilayer wiring board comprising the step of impregnating a raw material composition of a thermosetting resin in a porous laminated product including two or more porous layers and a wiring layer provided between the porous layers and formed on any of the porous layers and of half curing or curing them. Moreover, the present invention provides a multilayer wiring board having such a lamination structure that two or more porous layers and a wiring layer provided between the porous layers and formed on any of the porous layers are integrated through an impregnated and cured thermosetting resin.
摘要翻译： 本发明提供一种制造多层布线板的方法，包括以下步骤：将热固性树脂的原料组合物浸渍在包含两个或更多个多孔层的多孔层压制品中，以及布置在多孔层之间并在 多孔层，半固化或固化。 此外，本发明提供一种具有这样的叠层结构的多层布线板，其中通过浸渍和固化的热固性树脂将两个或多个多孔层和设置在多孔层之间并形成在多孔层之间的布线层一体化。
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公开(公告)号：US06761790B2
公开(公告)日：2004-07-13
申请号：US10136053
申请日：2002-04-30
IPC分类号： H05K103
CPC分类号： H05K3/4069 , H05K3/4652 , H05K2201/0116 , H05K2201/0154 , H05K2203/0191 , H05K2203/0425 , H05K2203/1461 , Y10S156/922 , Y10T156/11 , Y10T428/24917
摘要： The present invention provides a method of manufacturing a wiring board, including the steps of forming a through hole on a prepreg having a releasing resin film on at least one of its surfaces, the prepreg being obtained by impregnating a porous film having a thickness of 5 to 90 &mgr;m and a porosity of 30 to 98% with a half cured thermosetting resin, filling the through hole with a conductive paste containing a conductive filler, peeling the resin film, laminating a metal foil on a surface from which the resin film is peeled, and heating and pressurizing the laminated product. Moreover, the present invention provides a wiring board including an insulating layer obtained by impregnating a porous film having a thickness of 5 to 90 &mgr;m and a porosity of 30 to 98% with a thermosetting resin and curing them, and a conductive connection structure between wiring layers in which a through hole provided on the insulating layer is filled with a conductive paste, wherein the conductive connection structure has the conductive filler at only a boundary surface with the porous film and in an inner part thereof.
摘要翻译： 本发明提供一种制造布线板的方法，包括以下步骤：在至少一个表面上具有释放树脂膜的预浸料坯上形成通孔，将预浸料通过浸渍厚度为5μm的多孔膜 用半固化的热固性树脂填充至90μm和30至98％的孔隙率，用含有导电填料的导电膏填充通孔，剥离树脂膜，在剥离树脂膜的表面上层压金属箔 ，并对层压制品进行加热和加压。 此外，本发明提供一种布线基板，其包括通过用热固性树脂浸渍厚度为5-90μm，孔隙率为30-98％的多孔膜并固化而获得的绝缘层，以及布线之间的导电连接结构 其中设置在绝缘层上的通孔填充有导电膏的层，其中导电连接结构仅在与多孔膜的边界面及其内部具有导电填料。
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公开(公告)号：US07237332B2
公开(公告)日：2007-07-03
申请号：US10820417
申请日：2004-04-07
IPC分类号： H05K3/36
CPC分类号： H05K3/4655 , B32B5/18 , B32B7/04 , B32B38/08 , B32B2305/026 , B32B2379/08 , B32B2398/10 , B32B2457/08 , H05K3/4652 , H05K2201/0116 , H05K2201/0154 , H05K2201/0195 , H05K2203/066 , H05K2203/1147 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T428/249953 , Y10T428/24997 , Y10T428/249982
摘要： The present invention provides a method of manufacturing a wiring board, including the steps of preparing a composite sheet having an adherent sheet containing a thermosetting resin adhered to a porous film or impregnated with at least a part thereof, laminating at least the composite sheet on a wiring layer having a wiring pattern formed on an insulating layer, and heating and pressurizing the laminated product thus obtained or heating and pressurizing it after the pressurization to integrate the laminated product.
摘要翻译： 本发明提供了一种制造布线板的方法，包括以下步骤：制备具有附着在多孔膜上或浸渍有至少一部分的热固性树脂的粘合片的复合片，至少将该复合片层压在 布线层，其具有形成在绝缘层上的布线图案，并对由此获得的叠层产品进行加热和加压，或者在加压之后对其进行加压和加压以整合层压产品。
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公开(公告)号：US07121000B2
公开(公告)日：2006-10-17
申请号：US10363575
申请日：2002-06-28
IPC分类号： H01K3/10
CPC分类号： H05K3/462 , H05K3/4069 , H05K3/4614 , H05K3/4623 , H05K3/4626 , H05K2201/0116 , H05K2201/09536 , H05K2201/10378 , H05K2203/1147 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T29/49165 , Y10T428/31511
摘要： A method of manufacturing a multilayer wiring board according to the present invention comprises the step of heating and pressurizing a stacked product to be integrated in a state in which a plurality of double-sided wiring boards (10) having a wiring pattern (12) formed on both surfaces of an insulating layer (11) are laminated through a prepreg (1) obtained by impregnating a resin porous film with a thermosetting resin. The present invention is advantageous to mass production because a gap for forming an insulating layer can easily be controlled, and furthermore, can provide thinner layers of the whole board and is also advantageous to the flattening of the surface of the board.
摘要翻译： 根据本发明的制造多层布线板的方法包括在形成有布线图案（12）的多个双面布线板（10）的状态下对堆叠产品进行加热和加压的步骤 在绝缘层（11）的两个表面上通过用热固性树脂浸渍树脂多孔膜获得的预浸料（1）层压。 本发明有利于批量生产，因为可以容易地控制用于形成绝缘层的间隙，此外，可以提供整个板的较薄层，并且还有利于板的表面的平坦化。
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公开(公告)号：US06807729B2
公开(公告)日：2004-10-26
申请号：US10170798
申请日：2002-06-11
IPC分类号： H05K320
CPC分类号： B32B15/08 , B32B5/18 , B32B7/12 , B32B27/281 , B32B27/32 , B32B27/34 , B32B27/36 , B32B37/00 , B32B2038/0076 , B32B2305/026 , B32B2311/00 , B32B2323/04 , B32B2323/10 , B32B2367/00 , B32B2377/00 , B32B2379/08 , B32B2398/10 , B32B2457/08 , H05K3/022 , H05K3/386 , H05K3/4069 , H05K3/4652 , H05K3/4655 , H05K2201/0116 , H05K2201/0154 , H05K2201/0195 , H05K2203/0191 , H05K2203/066 , H05K2203/1147 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49163 , Y10T29/49165
摘要： The present invention provides a method of manufacturing a metal foil laminated product including the steps of forming a bonding layer containing a thermosetting resin on a lower wiring layer, a metal layer or an insulating layer, provisionally bonding a porous layer having a releasing film attached thereto onto a surface of the bonding layer, peeling the releasing film from the porous layer, laminating a metal foil on the porous layer obtained after the peeling, and heating and pressurizing the laminated product to transfer the bonding layer to the metal foil and thereby integrating them. Furthermore, the present invention provides a method of manufacturing a wiring board comprising the steps of manufacturing a metal foil laminated product by the above manufacturing methods, and providing a pattern on the metal foil of the metal foil laminated product, thereby forming a wiring layer.
摘要翻译： 本发明提供一种制造金属箔叠层产品的方法，包括以下步骤：在下布线层，金属层或绝缘层上形成含有热固性树脂的粘合层，临时粘合附着有剥离膜的多孔层 在接合层的表面上，从多孔层剥离剥离膜，在剥离后得到的多孔层上层叠金属箔，对层叠体进行加热加压，将结合层转印到金属箔上， 。 此外，本发明提供一种制造布线板的方法，包括以下步骤：通过上述制造方法制造金属箔层压产品，并在金属箔叠层产品的金属箔上提供图案，从而形成布线层。
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公开(公告)号：US06596406B2
公开(公告)日：2003-07-22
申请号：US10029637
申请日：2001-12-20
IPC分类号： B32B528
CPC分类号： B32B5/18 , C08J5/24 , H05K3/0011 , H05K3/4069 , H05K2201/0116 , H05K2201/0154 , H05K2201/0355 , H05K2203/0191 , H05K2203/0783 , H05K2203/1147 , H05K2203/1461 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917 , Y10T428/249953 , Y10T428/2907 , Y10T428/31504 , Y10T428/31721 , Y10T428/31725
摘要： A wiring board prepreg manufacturing method of the present invention includes the step of depositing and adhering a porous layer made of aromatic polyamide or polyimide onto a heat resistant base material sheet according to a wet gelation process, and the step of impregnating at least one portion of a raw material composition of thermoset resin with insides of pores of the porous layer adhered to the heat resistant base material sheet. Moreover, it is preferable that the step of impregnating the base material composition of the thermoset resin includes the step of applying a raw material liquid of the thermoset resin containing a solvent to a surface of a base material, the step of removing the solvent from the applied raw material liquid so as to obtain a solid coating film, and the step of while heating the solid coating film, laminating and pressurizing the film together with the base material onto the porous layer so as to impregnate at least one portion of the solid coating film.
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公开(公告)号：US06773572B2
公开(公告)日：2004-08-10
申请号：US10330300
申请日：2002-12-30
IPC分类号： C23C2802
CPC分类号： H05K3/388 , B32B15/08 , B32B27/38 , C23C28/00 , C23C28/021 , C23C28/023 , H05K1/036 , H05K1/056 , H05K2201/0116 , Y10T428/12569 , Y10T428/31678
摘要： A method of metal layer formation which can satisfactorily eliminate the problems caused by plating solution infiltration and is sufficiently effective in reducing the permittivity of an insulating layer; and a metal foil-based layered product obtainable by the method. The method is for forming a metal layer on a surface of a porous resin layer and includes: a step in which a porous resin layer having a dense layer as a surface part thereof is used as the porous resin layer and a thin metal film is formed on the surface of the dense layer by a dry process; and a step in which a metal film is formed on the surface of the thin metal film by plating.
摘要翻译： 金属层形成方法可以令人满意地消除由电镀溶液浸渗引起的问题，并且能够有效地降低绝缘层的介电常数; 以及通过该方法得到的金属箔基层叠体。 该方法是在多孔树脂层的表面形成金属层，其特征在于，具有作为其表面部分的具有致密层的多孔树脂层用作多孔树脂层和形成薄金属膜的步骤 通过干法在致密层的表面上; 以及通过电镀在金属薄膜的表面上形成金属膜的工序。
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公开(公告)号：US06759082B2
公开(公告)日：2004-07-06
申请号：US10151072
申请日：2002-05-17
IPC分类号： B05D512
CPC分类号： H05K3/4614 , H05K3/423 , H05K3/4626 , H05K3/4647 , H05K3/4652 , H05K3/4655 , H05K2201/0116 , H05K2201/0154 , H05K2201/0355 , H05K2203/0369 , H05K2203/0384 , H05K2203/0733 , H05K2203/1147 , Y10T428/24917
摘要： The present invention provides a method of manufacturing a metal foil laminated plate comprising the step of forming and attaching a resin porous layer onto a metal foil by a wet coagulating method, wherein a metal foil including a conductive bump having an almost equal height on a film forming side surface is used. The present invention provides a metal foil laminated plate comprising a metal foil including a conductive bump having an almost equal height and a resin porous layer laminated integrally, the conductive bump being exposed. The present invention provides another metal foil laminated plate comprising a metal foil including a conductive bump having an almost equal height, a resin porous layer laminated integrally, and a thermosetting resin impregnated in a hole of the resin porous layer, in which the conductive bump is exposed from the resin porous layer.
摘要翻译： 本发明提供一种金属箔层叠板的制造方法，其特征在于，包括以下步骤：通过湿式凝固法将树脂多孔层形成并附着到金属箔上，其中，在膜上具有几乎相同的高度的导电凸块的金属箔 使用形成侧面。 本发明提供一种金属箔层压板，其包括金属箔，该金属箔包括具有几乎相等高度的导电凸块和一体层压的树脂多孔层，所述导电凸块被暴露。 本发明提供另一种金属箔层压板，其包括金属箔，该金属箔包括具有几乎相同高度的导电凸块，一体层压的树脂多孔层和浸渍在树脂多孔层的孔中的热固性树脂，其中导电凸块 从树脂多孔层露出。
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公开(公告)号：US08224522B2
公开(公告)日：2012-07-17
申请号：US12483120
申请日：2009-06-11
CPC分类号： B60W50/14
摘要： A driving operation support device for a vehicle is provided herein. One exemplary driving operation support device includes a road sensor for acquiring information regarding a section of road ahead of a vehicle over which the vehicle is traveling. The driving operation support device may also include a controller for determining whether the section of road is passable for the vehicle based on the information acquired by the road sensor. The driving operation support device may further include a display provided between the section of road and a driver of the vehicle. The controller may display a guidance element on the display at a position overlapped with the section of the road as seen from the perspective of the driver, such that the guidance element indicates whether the road is passable based on the determination of the controller.
摘要翻译： 本文提供了一种用于车辆的驾驶操作支撑装置。 一个示例性驾驶操作支持装置包括道路传感器，用于获取关于车辆行驶的车辆前方的道路的信息。 驾驶操作支持装置还可以包括用于基于道路传感器获取的信息来确定道路的区段是否可通过车辆的控制器。 驾驶操作支持装置还可以包括设置在道路部分和车辆驾驶员之间的显示器。 控制器可以从驾驶员的角度看，在与道路的该部分重叠的位置处在显示器上显示引导元件，使得引导元件基于控制器的确定来指示道路是否通行。
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公开(公告)号：US07601281B2
公开(公告)日：2009-10-13
申请号：US11236249
申请日：2005-09-26
CPC分类号： H01R43/007 , H01L24/29 , H01L24/83 , H01L2224/16 , H01L2224/2919 , H01L2224/2929 , H01L2224/29355 , H01L2224/2936 , H01L2224/29439 , H01L2224/29444 , H01L2224/73204 , H01L2224/83101 , H01L2224/83192 , H01L2224/838 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/0401
摘要： A flowable insulating resin 1 is placed in a sheet-like molding die space and conductive magnetic particles 2 are dispersed in the insulating resin 1. A first magnetic field G1 is acted in the sheet thickness direction on the position where a conductive path is to be formed in the die space, and conductive magnetic particles 2a are locally collected together to form a conductive path. Simultaneously, a second magnetic field G2 is acted in the sheet thickness direction on the intermediate region and the magnetic field G2 is moved in the lateral direction to move conductive magnetic particles 2b left in the intermediate region to join the collection forming the conductive path. As a result, the number of the conductive magnetic particles left in the insulating resin becomes smaller.
摘要翻译： 将可流动绝缘树脂1放置在片状成型模具空间中，并将导电磁性颗粒2分散在绝缘树脂1中。第一磁场G1沿着导电路径的位置沿片材厚度方向作用 形成在模具空间中，并且导电磁性颗粒2a被局部收集在一起以形成导电路径。 同时，第二磁场G2在中间区域沿片材厚度方向作用，并且磁场G2沿横向方向移动以移动在中间区域中留下的导电磁性粒子2b，从而形成导电路径。 结果，留在绝缘树脂中的导电磁性颗粒的数量变小。
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