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11 条记录 (耗时 0.021 秒)

    LOW HEIGHT DISPLAY USING MULTILAYER PRINTED CIRCUIT BOARD WITH A LAMINATED PANEL AS HOUSING
    4.
    发明申请
    LOW HEIGHT DISPLAY USING MULTILAYER PRINTED CIRCUIT BOARD WITH A LAMINATED PANEL AS HOUSING 有权
    使用多层印刷电路板与层压板作为外壳的低高度显示

    公开(公告)号：US20120236531A1

    公开(公告)日：2012-09-20

    申请号：US13048684

    申请日：2011-03-15

    申请人： Seong Choon Lim ,  Meng Ee Lee ,  Yam Khoon Boo

    发明人： Seong Choon Lim ,  Meng Ee Lee ,  Yam Khoon Boo

    IPC分类号： F21V9/16 ,  F21V21/005 ,  F21V21/00

    CPC分类号： G09F9/33 ,  G09F9/3023 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： A multi-segment display is disclosed. Specifically, a low height LED-based display is disclosed that includes a number of segments. The segment construction may include a Printed Circuit Board (PCB) layer, a first substrate, and a second substrate that are laminated or otherwise connected to one another. The first and second substrates may include windows which allow light generated by a light source mounted on the PCB to exit the display and one or more of the windows may be filled with an encapsulant.

    摘要翻译： 公开了一种多段显示器。 具体地，公开了一种低高度的基于LED的显示器，其包括多个段。 片段结构可以包括层压或以其他方式彼此连接的印刷电路板（PCB）层，第一衬底和第二衬底。 第一和第二基板可以包括允许由安装在PCB上的光源产生的光离开显示器并且一个或多个窗口可以用密封剂填充的窗口。

    LED Light Source with Increased Thermal Conductivity
    5.
    发明申请
    LED Light Source with Increased Thermal Conductivity 审中-公开
    具有增加导热性的LED光源

    公开(公告)号：US20090032829A1

    公开(公告)日：2009-02-05

    申请号：US11830535

    申请日：2007-07-30

    申请人： Tong Fatt Chew ,  Siew It Pang ,  Seong Choon Lim

    发明人： Tong Fatt Chew ,  Siew It Pang ,  Seong Choon Lim

    IPC分类号： H01L33/00 ,  H01L21/00

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/01322 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/09318 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light source and method for making the same are disclosed. The light source includes a substrate, a plurality of dies and a transparent layer of encapsulant. The substrate includes an insulating layer having top and bottom surfaces, the top surface having a first metal patterned layer thereon, and the bottom surface having a second metal patterned layer thereon. The first metal patterned layer has a plurality of die mounting areas thereon, and the second metal patterned layer includes a first contact layer that underlies the die mounting area, the die mounting area and the first contact layer being connected by metal lined vias at each of the die mounting areas. The transparent encapsulant covers the plurality of dies and is bonded to the first metal patterned layer and the top surface of the insulating layer.

    摘要翻译： 公开了一种光源及其制造方法。 光源包括基板，多个管芯和透明的密封剂层。 衬底包括具有顶表面和底表面的绝缘层，顶表面上具有第一金属图案化层，底表面上具有第二金属图案层。 第一金属图案层在其上具有多个管芯安装区域，并且第二金属图案化层包括位于管芯安装区域下方的第一接触层，管芯安装区域和第一接触层通过金属衬里的通孔连接 模具安装区域。 透明密封剂覆盖多个管芯并且结合到第一金属图案层和绝缘层的顶表面。

    Method of interconnecting an electronic device
    6.
    发明授权
    Method of interconnecting an electronic device 有权
    互连电子设备的方法

    公开(公告)号：US06242280B1

    公开(公告)日：2001-06-05

    申请号：US09343329

    申请日：1999-06-30

    申请人： Huck Khim Koay ,  Cheng Why Tan ,  Chee Keong Chong ,  Gurbir Singh ,  Sundar A L Natarajan Yoganandan ,  Seong Choon Lim

    发明人： Huck Khim Koay ,  Cheng Why Tan ,  Chee Keong Chong ,  Gurbir Singh ,  Sundar A L Natarajan Yoganandan ,  Seong Choon Lim

    IPC分类号： H01L2144

    CPC分类号： H01L33/62 ,  H01L24/11 ,  H01L25/0753 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14

    摘要： A method of interconnecting bond pads on a semiconductor die to leads of a package is disclosed. The method includes placing a connector over each bond pad and its corresponding lead. The connector is one of a plurality of ganged connectors. The method also includes electrically connecting the connector to the bond pad and the lead and singularizing the connector from the plurality of ganged connectors. Such a method of interconnection has the advantage of simultaneously interconnecting multiple bond pads to leads. In a preferred embodiment, light-emitting diodes (LEDs) are manufactured using the method. A PCB is etched to produced lead pairs of the LEDs. A semiconductor die is attached to a first lead of each lead pair. Ganged interconnects are aligned with and tagged onto the dies and the second leads of the lead pairs, thereby electrically connecting them. After tagging, the interconnects are singularized. An encapsulant is applied on each die and interconnect. Each die, interconnect and lead pair are then separated to form individual LEDs.

    摘要翻译： 公开了一种将半导体管芯上的接合焊盘与封装引线互连的方法。 该方法包括将连接器放置在每个接合焊盘及其对应的引线上。 连接器是多个联动连接器之一。 该方法还包括将连接器电连接到接合焊盘和引线，并将连接器从多个组合的连接器中单独化。 这种互连方法具有将多个接合焊盘同时互连到引线的优点。 在优选实施例中，使用该方法制造发光二极管（LED）。 蚀刻PCB以产生LED的引线对。 半导体管芯连接到每个引线对的第一引线。 组合的互连件与管芯和引线对的第二引线对准并被标记，从而将它们电连接。 标记后，互连是单数化的。 在每个管芯和互连上施加密封剂。 然后将每个管芯，互连和引线对分开以形成单独的LED。

    Low height display using multilayer printed circuit board with a laminated panel as housing
    7.
    发明授权
    Low height display using multilayer printed circuit board with a laminated panel as housing 有权
    使用具有层压板作为外壳的多层印刷电路板的低高度显示

    公开(公告)号：US08403510B2

    公开(公告)日：2013-03-26

    申请号：US13048684

    申请日：2011-03-15

    申请人： Seong Choon Lim ,  Meng Ee Lee ,  Yam Khoon Boo

    发明人： Seong Choon Lim ,  Meng Ee Lee ,  Yam Khoon Boo

    IPC分类号： F21V9/16

    CPC分类号： G09F9/33 ,  G09F9/3023 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： A multi-segment display is disclosed. Specifically, a low height LED-based display is disclosed that includes a number of segments. The segment construction may include a Printed Circuit Board (PCB) layer, a first substrate, and a second substrate that are laminated or otherwise connected to one another. The first and second substrates may include windows which allow light generated by a light source mounted on the PCB to exit the display and one or more of the windows may be filled with an encapsulant.

    摘要翻译： 公开了一种多段显示器。 具体地，公开了一种低高度的基于LED的显示器，其包括多个段。 片段结构可以包括层压或以其他方式彼此连接的印刷电路板（PCB）层，第一衬底和第二衬底。 第一和第二基板可以包括允许由安装在PCB上的光源产生的光离开显示器并且一个或多个窗口可以用密封剂填充的窗口。

    DISPLAY AND METHOD OF MAKING
    8.
    发明申请
    DISPLAY AND METHOD OF MAKING 审中-公开
    显示和制作方法

    公开(公告)号：US20090115926A1

    公开(公告)日：2009-05-07

    申请号：US11935173

    申请日：2007-11-05

    申请人： Seong Choon Lim ,  Eit Thian Yap ,  Wei Liam Loo

    发明人： Seong Choon Lim ,  Eit Thian Yap ,  Wei Liam Loo

    IPC分类号： G02F1/136

    CPC分类号： G09F9/302 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/183 ,  H05K1/189 ,  H05K3/0064 ,  H05K2201/10106 ,  H05K2203/063 ,  H01L2924/00014

    摘要： Displays and methods of manufacturing displays are disclosed herein. An embodiment of a method of manufacturing a display comprises manufacturing a circuit board; forming a hole in a material; attaching the circuit board to the material, wherein the hole forms a cavity upon attachment of the circuit board to the material; and connecting a light source to the circuit board, the light source being located within the cavity.

    摘要翻译： 本文公开了制造显示器的显示器和方法。 制造显示器的方法的实施例包括制造电路板; 在材料上形成孔; 将所述电路板附接到所述材料，其中所述孔在将所述电路板附接到所述材料时形成空腔; 以及将光源连接到所述电路板，所述光源位于所述腔内。