公开(公告)号：US06770547B1

公开(公告)日：2004-08-03

申请号：US09698186

申请日：2000-10-30

申请人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

发明人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

IPC分类号： H01L2120

CPC分类号： H01L23/3157 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3114 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/06102 ,  H01L2224/1403 ,  H01L2224/14515 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/01033 ,  H01L2924/01034

摘要： A semiconductor apparatus in which flip chip bonding is enabled without any underfill, and which comprises a semiconductor device, an electrically insulating layer formed on the semiconductor device by mask-printing an electrically insulating material containing particles, and an external connection terminal formed on the electrically insulating layer and electrically connected with an electrode of the semiconductor device.

摘要翻译： 一种半导体装置，其中可以在没有任何底部填充的情况下进行倒装芯片接合，并且其包括半导体器件，通过掩模印刷含有颗粒的电绝缘材料在半导体器件上形成的电绝缘层，以及形成在电学上的外部连接端子 绝缘层并与半导体器件的电极电连接。

公开(公告)号：US07057283B2

公开(公告)日：2006-06-06

申请号：US10825436

申请日：2004-04-16

申请人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

发明人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L23/3157 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3114 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/06102 ,  H01L2224/1403 ,  H01L2224/14515 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/01033 ,  H01L2924/01034

摘要： A semiconductor apparatus in which flip chip bonding is enabled without any underfill, and which comprises a semiconductor device, an electrically insulating layer formed on the semiconductor device by mask-printing an electrically insulating material containing particles, and an external connection terminal formed on the electrically insulating layer and electrically connected with an electrode of the semiconductor device. The electrically insulating layer is formed with a thickness so as to provide α-ray shielding of the semiconductor device.

摘要翻译： 一种半导体装置，其中可以在没有任何底部填充的情况下进行倒装芯片接合，并且其包括半导体器件，通过掩模印刷含有颗粒的电绝缘材料在半导体器件上形成的电绝缘层，以及形成在电学上的外部连接端子 绝缘层并与半导体器件的电极电连接。 电绝缘层形成为具有提供半导体器件的α射线屏蔽的厚度。

公开(公告)号：US06822317B1

公开(公告)日：2004-11-23

申请号：US09698168

申请日：2000-10-30

申请人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

发明人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

IPC分类号： H01L23495

CPC分类号： H01L23/3114 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3157 ,  H01L2224/05001 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05569 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01034

摘要： A semiconductor apparatus comprising a semiconductor device, an electrically insulating layer formed on the semiconductor device, and an external connection terminal formed on the electrically insulating layer and electrically connected to an electrode of the semiconductor device, wherein a power/ground line and a signal line in a region of from an edge of the electrically insulating layer to a uniform-thickness flat portion of the electrically insulating layer are different in kind of wiring pattern from each other.

摘要翻译： 一种半导体器件，包括半导体器件，形成在半导体器件上的电绝缘层和形成在电绝缘层上并与半导体器件的电极电连接的外部连接端子，其中电源/接地线和信号线 在从电绝缘层的边缘到电绝缘层的均匀厚度平坦部分的区域中，布线图案的种类不同。

公开(公告)号：US06930388B2

公开(公告)日：2005-08-16

申请号：US09811401

申请日：2001-03-20

申请人： Yoshihide Yamaguchi ,  Hiroyuki Tenmei ,  Kosuke Inoue ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Naoya Kanda ,  Madoka Minagawa ,  Ichiro Anjo ,  Asao Nishimura ,  Kenji Ujiie ,  Akira Yajima

发明人： Yoshihide Yamaguchi ,  Hiroyuki Tenmei ,  Kosuke Inoue ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Naoya Kanda ,  Madoka Minagawa ,  Ichiro Anjo ,  Asao Nishimura ,  Kenji Ujiie ,  Akira Yajima

IPC分类号： H01L23/29 ,  H01L21/56 ,  H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/485 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/12 ,  H01L23/3114 ,  H01L23/3171 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05171 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/01034 ,  H01L2924/00014

摘要： A semiconductor device is provided which enables a flip chip connection without use of underfill. The semiconductor device includes a semiconductor element having circuit electrodes and a circuit surface coated with a protecting film. A stress relaxation layer is provided by coating a cured thermoplastic resin onto the protecting film of the circuit surface in a manner which leaves the circuit electrodes exposed and curing it and having an inclination in the edge portion thereof. A wiring layer with wirings is connected to each of the circuit electrodes and disposed so as to make an electrical connection from the circuit electrodes, via the edge portion of the stress relaxation layer, and to a desired portion on the surface of the stress relaxation layer. A protecting film is provided thereon, and an external connection terminal is also provided.

摘要翻译： 提供一种半导体器件，其能够在不使用底部填充物的情况下实现倒装芯片连接。 半导体器件包括具有电路电极的半导体元件和涂有保护膜的电路表面。 通过将固化的热塑性树脂以使电路电极暴露并固化并且在其边缘部分具有倾斜的方式将固化的热塑性树脂涂覆到电路表面的保护膜上来提供应力松弛层。 具有布线的布线层连接到每个电路电极，并布置成经由应力松弛层的边缘部分和电路电极的电连接到应力松弛层的表面上的期望部分 。 在其上设置有保护膜，并且还设置有外部连接端子。

公开(公告)号：US06624504B1

公开(公告)日：2003-09-23

申请号：US09698185

申请日：2000-10-30

申请人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

发明人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

IPC分类号： H01L23495

CPC分类号： H01L23/293 ,  H01L21/563 ,  H01L23/295 ,  H01L23/3114 ,  H01L23/3157 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/01033 ,  H01L2924/01034

摘要： A semiconductor apparatus includes a semiconductor device having circuit electrodes aligned centrally of the semiconductor apparatus. A first electrically insulating layer is formed on said semiconductor device with said circuit electrodes being exposed from said first insulating layer. A second electrically insulating layer is formed on said first insulating layer, and external connection terminals are formed on said second insulating layer. A wiring is formed on said second insulating layer to electrically connect said external connect terminals to said circuit electrodes of said semiconductor device, and a third electrically insulating layer is formed on said second insulating layer and on said wiring. Particles are provided in the second insulating layer to control a shape of said second insulating layer.

摘要翻译： 半导体装置包括具有对准半导体装置中心的电路电极的半导体装置。 在所述半导体器件上形成第一电绝缘层，所述电路电极从所述第一绝缘层露出。 在所述第一绝缘层上形成第二电绝缘层，在所述第二绝缘层上形成外部连接端子。 在所述第二绝缘层上形成布线，以将所述外部连接端子电连接到所述半导体器件的所述电路电极，并且在所述第二绝缘层和所述布线上形成第三电绝缘层。 在第二绝缘层中提供颗粒以控制所述第二绝缘层的形状。

公开(公告)号：US07084498B2

公开(公告)日：2006-08-01

申请号：US10271572

申请日：2002-10-17

申请人： Yoshihide Yamaguchi ,  Shigeharu Tsunoda ,  Hiroyuki Tenmei ,  Hiroshi Hozoji ,  Naoya Kanda

发明人： Yoshihide Yamaguchi ,  Shigeharu Tsunoda ,  Hiroyuki Tenmei ,  Hiroshi Hozoji ,  Naoya Kanda

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L2221/68345 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01092 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00

摘要： A semiconductor device which includes a semiconductor chip, an insulating film formed on the semiconductor chip, a plurality of projected stress relaxation materials formed on the insulating film, projected electrodes covering at least tops of the stress relaxation materials, and wiring lines for electrically connecting the projected electrodes and element electrodes of the semiconductor chip.

摘要翻译： 一种半导体器件，包括半导体芯片，形成在半导体芯片上的绝缘膜，形成在绝缘膜上的多个突出的应力松弛材料，覆盖至少应力松弛材料顶部的突出电极和用于电连接 投影电极和半导体芯片的元件电极。

公开(公告)号：US20050130425A1

公开(公告)日：2005-06-16

申请号：US10985934

申请日：2004-11-12

申请人： Naoya Kanda ,  Kosuke Inoue ,  Madoka Minagawa ,  Shigeharu Tsunoda

发明人： Naoya Kanda ,  Kosuke Inoue ,  Madoka Minagawa ,  Shigeharu Tsunoda

IPC分类号： G06K19/07 ,  G06K19/077 ,  H01R43/02 ,  H01L21/302 ,  H01L21/461

CPC分类号： G06K19/0775 ,  G06K19/07745 ,  G06K19/07749 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81395 ,  H01L2924/01079

摘要： There is a method of manufacturing an RFID, in which a semiconductor chip with a memory is bonded to an antenna, so that the information recorded in the memory can be transmitted through the antenna. In the RFID, a PET film, a PEN film, or a sheet of paper is used as the base material of the antenna. The method includes: aligning the semiconductor chip with gold bumps relative to the antenna, in which a metal foil formed of an aluminum or an aluminum alloy is adhered to the base material, including a polyethylene terephthalate or a polyethylene naphthalate; pressing the semiconductor chip to the antenna; and applying ultrasonic waves under an ambient temperature lower than the glass transition temperature of the polyethylene terephthalate or the polyethylene naphthalate, to thereby bond the gold bumps and the metal foil. Thus, the method suppresses the deformation of the antenna.

摘要翻译： 存在制造RFID的方法，其中具有存储器的半导体芯片被结合到天线，使得可以通过天线发送记录在存储器中的信息。 在RFID中，使用PET膜，PEN膜或纸张作为天线的基材。 该方法包括：将半导体芯片与相对于天线的金凸块对准，其中由铝或铝合金形成的金属箔粘附到包括聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯的基材上; 将半导体芯片按压到天线; 并在低于聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯的玻璃化转变温度的环境温度下施加超声波，从而结合金凸块和金属箔。 因此，该方法抑制天线的变形。

公开(公告)号：US07122087B2

公开(公告)日：2006-10-17

申请号：US10985934

申请日：2004-11-12

申请人： Naoya Kanda ,  Kosuke Inoue ,  Madoka Minagawa ,  Shigeharu Tsunoda

发明人： Naoya Kanda ,  Kosuke Inoue ,  Madoka Minagawa ,  Shigeharu Tsunoda

IPC分类号： B32B37/00

CPC分类号： G06K19/0775 ,  G06K19/07745 ,  G06K19/07749 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81395 ,  H01L2924/01079

摘要： There is a method of manufacturing an RFID, in which a semiconductor chip with a memory is bonded to an antenna, so that the information recorded in the memory can be transmitted through the antenna. In the RFID, a PET film, a PEN film, or a sheet of paper is used as the base material of the antenna. The method includes: aligning the semiconductor chip with gold bumps relative to the antenna, in which a metal foil formed of an aluminum or an aluminum alloy is adhered to the base material, including a polyethylene terephthalate or a polyethylene naphthalate; pressing the semiconductor chip to the antenna; and applying ultrasonic waves under an ambient temperature lower than the glass transition temperature of the polyethylene terephthalate or the polyethylene naphthalate, to thereby bond the gold bumps and the metal foil. Thus, the method suppresses the deformation of the antenna.

摘要翻译： 存在制造RFID的方法，其中具有存储器的半导体芯片被结合到天线，使得可以通过天线发送记录在存储器中的信息。 在RFID中，使用PET膜，PEN膜或纸张作为天线的基材。 该方法包括：将半导体芯片与相对于天线的金凸块对准，其中由铝或铝合金形成的金属箔粘附到包括聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯的基材上; 将半导体芯片按压到天线; 并在低于聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯的玻璃化转变温度的环境温度下施加超声波，从而结合金凸块和金属箔。 因此，该方法抑制天线的变形。

公开(公告)号：US07172130B2

公开(公告)日：2007-02-06

申请号：US10960074

申请日：2004-10-08

申请人： Shigeharu Tsunoda ,  Hiroshi Hozoji ,  Madoka Minagawa

发明人： Shigeharu Tsunoda ,  Hiroshi Hozoji ,  Madoka Minagawa

IPC分类号： G06K19/06 ,  H05B3/30 ,  B29V45/14 ,  G08B13/14

CPC分类号： G06K19/07749 ,  G06K19/07728 ,  G06K19/07764

摘要： The present invention aims to improve the durability of an RFID chip inlet. A module including an RFID chip amounted to an antenna is covered with polyimide film with an adhesive layer to make up an RFID inlet. The outer surface of the RFID inlet is then covered with the surface processed to increase surface lubricity of a base part. When the RFID inlet is for use in a rubber product, it is mounted to a rubber base of the rubber product, the exposed surface of the RFID inlet is covered with an unvulcanized rubber, and the unvulcanized rubber is then pressed and heated causing the RFID inlet to be embedded in the rubber base.

摘要翻译： 本发明旨在提高RFID芯片入口的耐久性。 包括与天线对应的RFID芯片的模块被具有粘合剂层的聚酰亚胺膜覆盖以构成RFID入口。 然后，RFID入口的外表面被处理的表面覆盖以增加基部的表面润滑性。 当RFID入口用于橡胶制品时，它被安装到橡胶制品的橡胶基座上，RFID入口的暴露表面被未硫化橡胶覆盖，然后将未硫化橡胶压制和加热，使得RFID 入口嵌入橡胶底座。

公开(公告)号：US20050101060A1

公开(公告)日：2005-05-12

申请号：US10960074

申请日：2004-10-08

申请人： Shigeharu Tsunoda ,  Hiroshi Hozoji ,  Madoka Minagawa

发明人： Shigeharu Tsunoda ,  Hiroshi Hozoji ,  Madoka Minagawa

IPC分类号： G06K19/07 ,  G06K19/00 ,  G06K19/077 ,  H01L21/44 ,  H01L25/00

CPC分类号： G06K19/07749 ,  G06K19/07728 ,  G06K19/07764

摘要： The present invention aims to improve the durability of an RFID chip inlet. A module including an RFID chip amounted to an antenna is covered with polyimide film with an adhesive layer to make up an RFID inlet. The outer surface of the RFID inlet is then covered with the surface processed to increase surface lubricity of a base part. When the RFID inlet is for use in a rubber product, it is mounted to a rubber base of the rubber product, the exposed surface of the RFID inlet is covered with an unvulcanized rubber, and the unvulcanized rubber is then pressed and heated causing the RFID inlet to be embedded in the rubber base.

摘要翻译： 本发明旨在提高RFID芯片入口的耐久性。 包括与天线对应的RFID芯片的模块被具有粘合剂层的聚酰亚胺膜覆盖以构成RFID入口。 然后，RFID入口的外表面被处理的表面覆盖以增加基部的表面润滑性。 当RFID入口用于橡胶制品时，它被安装到橡胶制品的橡胶基座上，RFID入口的暴露表面被未硫化橡胶覆盖，然后将未硫化橡胶压制和加热，使得RFID 入口嵌入橡胶底座。