公开(公告)号：US08120045B2

公开(公告)日：2012-02-21

申请号：US12596888

申请日：2007-09-18

申请人： Young-Se Kwon ,  Kyoung-Min Kim ,  Sung-Woo Hyun ,  Bo-In Son

发明人： Young-Se Kwon ,  Kyoung-Min Kim ,  Sung-Woo Hyun ,  Bo-In Son

IPC分类号： H01L29/18

CPC分类号： H01L31/024 ,  H01L27/14618 ,  H01L31/0203 ,  H01L33/483 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A metal-based photonic device package module that is capable of greatly improving heat releasing efficiency and implementing a thin package is provided. The metal-based photonic device package module includes a metal substrate that is formed the shape of a plate, a metal oxide layer that is formed on the metal substrate to have a mounting cavity, a photonic device that is mounted in the mounting cavity of the metal oxide layer, and a reflecting plane that is formed at an inner surface of the mounting cavity of the metal oxide layer.

摘要翻译： 提供了能够大大提高放热效率并实现薄包装的基于金属的光子器件封装模块。 金属基光子器件封装模块包括金属基板，其形成为板的形状，金属氧化物层形成在金属基板上以具有安装空腔，光子器件安装在安装空间中 金属氧化物层和形成在金属氧化物层的安装空腔的内表面的反射面。

公开(公告)号：US20100133557A1

公开(公告)日：2010-06-03

申请号：US12596888

申请日：2007-09-18

申请人： Young-Se Kwon ,  Kyoung-Min Kim ,  Sung-Woo Hyun ,  Bo-In Son

发明人： Young-Se Kwon ,  Kyoung-Min Kim ,  Sung-Woo Hyun ,  Bo-In Son

IPC分类号： H01L33/00 ,  H01L21/50

CPC分类号： H01L31/024 ,  H01L27/14618 ,  H01L31/0203 ,  H01L33/483 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A metal-based photonic device package module that is capable of greatly improving heat releasing efficiency and implementing a thin package is provided. The metal-based photonic device package module includes a metal substrate that is formed the shape of a plate, a metal oxide layer that is formed on the metal substrate to have a mounting cavity, a photonic device that is mounted in the mounting cavity of the metal oxide layer, and a reflecting plane that is formed at an inner surface of the mounting cavity of the metal oxide layer.

摘要翻译： 提供了能够大大提高放热效率并实现薄包装的基于金属的光子器件封装模块。 金属基光子器件封装模块包括金属基板，其形成为板的形状，金属氧化物层形成在金属基板上以具有安装空腔，光子器件安装在安装空间中 金属氧化物层和形成在金属氧化物层的安装空腔的内表面的反射面。

公开(公告)号：US08034664B2

公开(公告)日：2011-10-11

申请号：US12914725

申请日：2010-10-28

申请人： Young-Se Kwon ,  Kyoung Min Kim

发明人： Young-Se Kwon ,  Kyoung Min Kim

IPC分类号： H01L21/44

CPC分类号： H01L23/66 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/5389 ,  H01L23/645 ,  H01L24/24 ,  H01L24/82 ,  H01L25/072 ,  H01L25/162 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6644 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/19033 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K1/053 ,  H05K1/185 ,  H01L2924/00

摘要： Provided is a three-dimensional aluminum package module including: an aluminum substrate; an aluminum oxide layer formed on the aluminum substrate and having at least one first opening of which sidewalls are perpendicular to an upper surface of the aluminum substrate; a semiconductor device mounted in the first opening using an adhesive; an organic layer covering the aluminum oxide layer and the semiconductor device; and a first interconnection line and a passive device circuit formed on the organic layer and the aluminum oxide layer.

摘要翻译： 提供一种三维铝封装模块，包括：铝基板; 形成在所述铝基板上并具有至少一个第一开口的铝氧化物层，所述第一开口的侧壁垂直于所述铝基板的上表面; 使用粘合剂安装在第一开口中的半导体器件; 覆盖氧化铝层和半导体器件的有机层; 以及形成在有机层和氧化铝层上的第一互连线和无源器件电路。

公开(公告)号：US20100144099A1

公开(公告)日：2010-06-10

申请号：US12695449

申请日：2010-01-28

申请人： Young-Se Kwon ,  Kyoung-Min Kim

发明人： Young-Se Kwon ,  Kyoung-Min Kim

IPC分类号： H01L21/50

CPC分类号： H01L21/6835 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5227 ,  H01L23/66 ,  H01L24/32 ,  H01L24/48 ,  H01L2221/68363 ,  H01L2224/16225 ,  H01L2224/32188 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing passive devices and semiconductor packages using a thin metal piece is provided. According to the method, an adhesive layer is formed on a dummy substrate; a thin metal piece is bonded on the adhesive layer; a masking material is attached to the thin metal piece, a dielectric layer is formed; a masking material is attached to form metal pads; a metal pad is formed, and the formed device is attached to a lower substrate using the metal pads; the adhesive layer and the dummy substrate are removed, a masking material is attached on a surface exposed, a region where passive devices are to be formed is patterned, and the thin metal piece is etched at a predetermined depth; and solder bumps for surface mounting are formed.

摘要翻译： 提供了使用薄金属片制造无源器件和半导体封装的方法。 根据该方法，在虚设基板上形成粘接层; 在粘合剂层上粘接薄金属片; 将掩模材料附着到薄金属片上，形成电介质层; 连接掩模材料以形成金属垫; 形成金属垫，并使用金属垫将形成的装置附接到下基板; 去除粘合剂层和虚设基板，将掩模材料附着在暴露的表面上，对要形成无源器件的区域进行图案化，并且以预定深度蚀刻薄金属片; 并形成用于表面安装的焊料凸块。

公开(公告)号：US07696055B2

公开(公告)日：2010-04-13

申请号：US11912178

申请日：2005-09-06

申请人： Young-Se Kwon ,  Kyoung-Min Kim

发明人： Young-Se Kwon ,  Kyoung-Min Kim

IPC分类号： H01L21/20

CPC分类号： H01L21/6835 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5227 ,  H01L23/66 ,  H01L24/32 ,  H01L24/48 ,  H01L2221/68363 ,  H01L2224/16225 ,  H01L2224/32188 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing passive devices and semiconductor packages using a thin metal piece is provided. According to the method, an adhesive layer is formed on a dummy substrate; a thin metal piece is bonded on the adhesive layer; a masking material is attached to the thin metal piece, a region where vias are to be formed is patterned, the thin metal piece is etched at a predetermined depth; the masking material is removed, the etched portion is filled with polymer to form a flat polymer layer, a masking material is attached on the polymer layer, a region that is to be attached to an IPD or an IC chip is patterned, a metal pad is formed, and the formed devices are attached to a lower substrate using the metal pad; the adhesive layer and the dummy substrate are removed, a masking material is attached on a surface exposed, a region where passive devices are to be formed is patterned, and the thin metal piece is etched at a predetermined depth; and solder bumps for surface mounting are formed.

摘要翻译： 提供了使用薄金属片制造无源器件和半导体封装的方法。 根据该方法，在虚设基板上形成粘接层; 在粘合剂层上粘接薄金属片; 将掩模材料附着到薄金属片上，对要形成通孔的区域进行图案化，在预定深度刻蚀薄金属片; 去除掩模材料，用聚合物填充蚀刻部分以形成平坦的聚合物层，在聚合物层上附着掩蔽材料，将要附着到IPD或IC芯片的区域进行图案化，金属焊盘 并且使用金属垫将形成的器件附接到下基板; 去除粘合剂层和虚设基板，将掩模材料附着在暴露的表面上，对要形成无源器件的区域进行图案化，并且以预定深度蚀刻薄金属片; 并形成用于表面安装的焊料凸块。

公开(公告)号：US20100326707A1

公开(公告)日：2010-12-30

申请号：US12667263

申请日：2007-09-18

申请人： Young-Se Kwon ,  Kyoung-Min Kim ,  Je-In Yu

发明人： Young-Se Kwon ,  Kyoung-Min Kim ,  Je-In Yu

IPC分类号： H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H01R43/00

CPC分类号： H01L23/142 ,  H01L23/49822 ,  H01L24/31 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/16195 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package substrate, a manufacturing method thereof, a base package module, and a multi-layered package module having package substrates laminated on upper and lower portions of a base package module are provided. The base package module includes a base metal substrate, a first metal oxide layer that is formed on the base metal substrate to have a cavity therein, a device that is mounted in the cavity on the base metal substrate and insulated by the first metal oxide layer formed on a sidewall in the cavity, and a conductor that is connected to the device and a wiring pad formed on the first metal oxide layer on the base metal substrate. The package substrate includes a wiring pad, a conductor line, a second metal oxide layer having an opening that exposes a device, and a via that is connected to the wiring pad through a connection pad in the second metal oxide layer.

摘要翻译： 提供一种封装基板，其制造方法，基底封装模块和具有层压在基底封装模块的上部和下部上的封装基板的多层封装模块。 基底封装模块包括贱金属基底，第一金属氧化物层，其形成在贱金属基底上以在其中具有空腔;第一金属氧化物层，其被安装在贱金属基底上的空腔中并被第一金属氧化物层绝缘 形成在空腔中的侧壁上，以及连接到该器件的导体和形成在基底金属基板上的第一金属氧化物层上的布线焊盘。 封装衬底包括布线衬垫，导体线，具有暴露器件的开口的第二金属氧化物层和通过第二金属氧化物层中的连接焊盘连接到布线焊盘的通孔。

公开(公告)号：US07851918B2

公开(公告)日：2010-12-14

申请号：US12158726

申请日：2006-03-03

申请人： Young-Se Kwon ,  Kyoung Min Kim

发明人： Young-Se Kwon ,  Kyoung Min Kim

IPC分类号： H01L21/31

CPC分类号： H01L23/66 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/5389 ,  H01L23/645 ,  H01L24/24 ,  H01L24/82 ,  H01L25/072 ,  H01L25/162 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6644 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/19033 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K1/053 ,  H05K1/185 ,  H01L2924/00

摘要： Provided is a three-dimensional aluminum package module including: an aluminum substrate; an aluminum oxide layer formed on the aluminum substrate and having at least one first opening of which sidewalls are perpendicular to an upper surface of the aluminum substrate; a semiconductor device mounted in the first opening using an adhesive; an organic layer covering the aluminum oxide layer and the semiconductor device; and a first interconnection line and a passive device circuit formed on the organic layer and the aluminum oxide layer.

摘要翻译： 提供一种三维铝封装模块，包括：铝基板; 形成在所述铝基板上并具有至少一个第一开口的铝氧化物层，所述第一开口的侧壁垂直于所述铝基板的上表面; 使用粘合剂安装在第一开口中的半导体器件; 覆盖氧化铝层和半导体器件的有机层; 以及形成在有机层和氧化铝层上的第一互连线和无源器件电路。

公开(公告)号：US07838380B2

公开(公告)日：2010-11-23

申请号：US12695449

申请日：2010-01-28

申请人： Young-Se Kwon ,  Kyoung-Min Kim

发明人： Young-Se Kwon ,  Kyoung-Min Kim

IPC分类号： H01L21/20

CPC分类号： H01L21/6835 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5227 ,  H01L23/66 ,  H01L24/32 ,  H01L24/48 ,  H01L2221/68363 ,  H01L2224/16225 ,  H01L2224/32188 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing passive devices and semiconductor packages using a thin metal piece is provided. According to the method, an adhesive layer is formed on a dummy substrate; a thin metal piece is bonded on the adhesive layer; a masking material is attached to the thin metal piece, a dielectric layer is formed; a masking material is attached to form metal pads; a metal pad is formed, and the formed device is attached to a lower substrate using the metal pads; the adhesive layer and the dummy substrate are removed, a masking material is attached on a surface exposed, a region where passive devices are to be formed is patterned, and the thin metal piece is etched at a predetermined depth; and solder bumps for surface mounting are formed.

摘要翻译： 提供了使用薄金属片制造无源器件和半导体封装的方法。 根据该方法，在虚设基板上形成粘接层; 在粘合剂层上粘接薄金属片; 将掩模材料附着到薄金属片上，形成电介质层; 连接掩模材料以形成金属垫; 形成金属垫，并使用金属垫将形成的装置附接到下基板; 去除粘合剂层和虚设基板，将掩模材料附着在暴露的表面上，对要形成无源器件的区域进行图案化，并且以预定深度蚀刻薄金属片; 并形成用于表面安装的焊料凸块。

公开(公告)号：US20090032914A1

公开(公告)日：2009-02-05

申请号：US12158726

申请日：2006-03-03

申请人： Young-Se Kwon ,  Kyoung Min Kim

发明人： Young-Se Kwon ,  Kyoung Min Kim

IPC分类号： H01L23/48 ,  H01L21/02 ,  H01L21/58 ,  H01L23/06

CPC分类号： H01L23/66 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/5389 ,  H01L23/645 ,  H01L24/24 ,  H01L24/82 ,  H01L25/072 ,  H01L25/162 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6644 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/19033 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K1/053 ,  H05K1/185 ,  H01L2924/00

摘要： Provided is a three-dimensional aluminum package module including: an aluminum substrate; an aluminum oxide layer formed on the aluminum substrate and having at least one first opening of which sidewalls are perpendicular to an upper surface of the aluminum substrate; a semiconductor device mounted in the first opening using an adhesive; an organic layer covering the aluminum oxide layer and the semiconductor device; and a first interconnection line and a passive device circuit formed on the organic layer and the aluminum oxide layer.

摘要翻译： 提供一种三维铝封装模块，包括：铝基板; 形成在所述铝基板上并具有至少一个第一开口的铝氧化物层，所述第一开口的侧壁垂直于所述铝基板的上表面; 使用粘合剂安装在第一开口中的半导体器件; 覆盖氧化铝层和半导体器件的有机层; 以及形成在有机层和氧化铝层上的第一互连线和无源器件电路。

公开(公告)号：US20080194058A1

公开(公告)日：2008-08-14

申请号：US11912178

申请日：2005-09-06

申请人： Young-Se Kwon ,  Kyoung-Min Kim

发明人： Young-Se Kwon ,  Kyoung-Min Kim

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5227 ,  H01L23/66 ,  H01L24/32 ,  H01L24/48 ,  H01L2221/68363 ,  H01L2224/16225 ,  H01L2224/32188 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing passive devices and semiconductor packages using a thin metal piece is provided. According to the method, an adhesive layer is formed on a dummy substrate; a thin metal piece is bonded on the adhesive layer; a masking material is attached to the thin metal piece, a region where vias are to be formed is patterned, the thin metal piece is etched at a predetermined depth; the masking material is removed, the etched portion is filled with polymer to form a flat polymer layer, a masking material is attached on the polymer layer, a region that is to be attached to an IPD or an IC chip is patterned, a metal pad is formed, and the formed devices are attached to a lower substrate using the metal pad; the adhesive layer and the dummy substrate are removed, a masking material is attached on a surface exposed, a region where passive devices are to be formed is patterned, and the thin metal piece is etched at a predetermined depth; and solder bumps for surface mounting are formed.

摘要翻译： 提供了使用薄金属片制造无源器件和半导体封装的方法。 根据该方法，在虚设基板上形成粘接层; 在粘合剂层上粘接薄金属片; 将掩模材料附着到薄金属片上，对要形成通孔的区域进行图案化，在预定深度刻蚀薄金属片; 去除掩模材料，用聚合物填充蚀刻部分以形成平坦的聚合物层，在聚合物层上附着掩蔽材料，将要附着到IPD或IC芯片的区域进行图案化，金属焊盘 并且使用金属垫将形成的器件附接到下基板; 去除粘合剂层和虚设基板，将掩模材料附着在暴露的表面上，对要形成无源器件的区域进行图案化，并且以预定深度蚀刻薄金属片; 并形成用于表面安装的焊料凸块。