公开(公告)号：US20060091567A1

公开(公告)日：2006-05-04

申请号：US11163131

申请日：2005-10-06

申请人： Yu-Liang Lin ,  Chih-Cheng Hung

发明人： Yu-Liang Lin ,  Chih-Cheng Hung

IPC分类号： H01L23/28

CPC分类号： H01L21/52 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for fabricating a cavity-down package is provided. A chip carrier includes a chip cavity. A chip is disposed inside the cavity, and a plurality of bonding materials is formed at the corners of the chip. The bonding materials are cured to protect the corners of the chip. Next, an encapsulant is formed in the cavity to seal the chip and the bonding materials to prevent stress concentration caused by thermal expansion mismatch on the chip corners and eliminate delamination between the encapsulant and the chip.

摘要翻译： 提供了一种制造腔体封装的方法。 芯片载体包括芯片腔。 芯片设置在空腔内，并且在芯片的角部形成多个接合材料。 固化粘合材料以保护芯片的角部。 接下来，在空腔中形成密封剂以密封芯片和接合材料，以防止由芯片角部的热膨胀失配引起的应力集中，并消除封装剂和芯片之间的分层。

公开(公告)号：US09390949B2

公开(公告)日：2016-07-12

申请号：US13306625

申请日：2011-11-29

申请人： Wen-Chih Chiou ,  Yu-Liang Lin ,  Hung-Jung Tu

发明人： Wen-Chih Chiou ,  Yu-Liang Lin ,  Hung-Jung Tu

IPC分类号： H01L21/02 ,  H01L21/677 ,  H01L21/67

CPC分类号： H01L21/67173 ,  H01L21/02057 ,  H01L21/67207

摘要： This description relates to a wafer debonding and cleaning apparatus including an automatic wafer handling module. The automatic wafer handling module loads a semiconductor wafer into a wafer debonding module for a debonding process. The automatic wafer handling module removes the semiconductor wafer from the debonding module and loads the semiconductor wafer into a wafer cleaning module for a cleaning process.

摘要翻译： 本说明书涉及包括自动晶片处理模块的晶片剥离和清洁设备。 自动晶片处理模块将半导体晶片加载到用于脱粘工艺的晶片剥离模块中。 自动晶片处理模块从剥离模块中移除半导体晶片，并将半导体晶片装载到用于清洁过程的晶片清洁模块中。

公开(公告)号：US09153462B2

公开(公告)日：2015-10-06

申请号：US12964097

申请日：2010-12-09

申请人： Yu-Liang Lin ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou

发明人： Yu-Liang Lin ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou

IPC分类号： H01L21/687 ,  H01L21/67

CPC分类号： H01L21/67051 ,  H01L21/68728

摘要： A device and system for thin wafer cleaning is disclosed. A preferred embodiment comprises a spin chuck having at least three holding clamps. A thin wafer with a wafer frame is mounted on the spin chuck through a tape layer. When the holding clamps are unlocked, there is no interference with the removal and placement of the wafer frame. On the other hand, when the holding clamps are locked, the holding clamps are brought into contact with the outer edge of the wafer frame so as to prevent the wafer frame from moving laterally. Furthermore, the shape of the holding clamps in a locked position is capable of preventing the wafer frame from moving vertically.

摘要翻译： 公开了用于薄晶片清洁的装置和系统。 优选实施例包括具有至少三个保持夹具的旋转卡盘。 具有晶片框架的薄晶片通过带层安装在旋转卡盘上。 当保持夹具解锁时，不会干扰晶片框架的移除和放置。 另一方面，当保持夹具被锁定时，保持夹具与晶片框架的外边缘接触，以防止晶片框架横向移动。 此外，保持夹具处于锁定位置的形状能够防止晶片框架垂直移动。

公开(公告)号：US08722540B2

公开(公告)日：2014-05-13

申请号：US12841874

申请日：2010-07-22

申请人： Yu-Liang Lin ,  Weng-Jin Wu ,  Jing-Cheng Lin

发明人： Yu-Liang Lin ,  Weng-Jin Wu ,  Jing-Cheng Lin

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834

摘要： A method includes bonding a wafer on a carrier through an adhesive, and performing a thinning process on the wafer. After the step of performing the thinning process, a portion of the adhesive not covered by the wafer is removed, while the portion of the adhesive covered by the wafer is not removed.

摘要翻译： 一种方法包括通过粘合剂将晶片接合在载体上，并在晶片上进行稀化处理。 在进行稀化处理的步骤之后，去除未被晶片覆盖的粘合剂的一部分，同时由晶片覆盖的粘合剂部分未被除去。

公开(公告)号：US08278857B2

公开(公告)日：2012-10-02

申请号：US12578835

申请日：2009-10-14

申请人： Yu-Liang Lin ,  Ming-Yen Lin ,  Chia-Wen Kuo ,  Kuan-Ting Lee

发明人： Yu-Liang Lin ,  Ming-Yen Lin ,  Chia-Wen Kuo ,  Kuan-Ting Lee

IPC分类号： H02P6/14

CPC分类号： H02P6/14

摘要： A motor control device is electrically connected with a motor. The motor control device includes a controller and a driving circuit. The controller has a default value of time and generates a first driving signal and a second driving signal. The driving circuit includes a first switching element and a second switching element, the first switching element and the second switching element receive the first driving signal and the second driving signal respectively, and the first switching element and the second switching element are switched on or switched off alternately according to the first driving signal and the second driving signal respectively, so as to drive the motor to operate. The controller switches off the first switching element by the first driving signal the default value of time before the controller switches on the second switching element by the second driving signal, and the controller switches off the second switching element by the second driving signal the default value of time before the controller switches on the first switching element by the first driving signal.

摘要翻译： 电动机控制装置与电动机电连接。 电动机控制装置包括控制器和驱动电路。 控制器具有默认的时间值，并且产生第一驱动信号和第二驱动信号。 驱动电路包括第一开关元件和第二开关元件，第一开关元件和第二开关元件分别接收第一驱动信号和第二驱动信号，并且第一开关元件和第二开关元件被接通或切换 分别根据第一驱动信号和第二驱动信号交替地切断，以驱动马达运行。 控制器通过第一驱动信号将第一开关元件切断为控制器通过第二驱动信号接通第二开关元件之前的默认值，并且控制器通过第二驱动信号将第二开关元件断开，该默认值 在控制器通过第一驱动信号接通第一开关元件之前的时间。

公开(公告)号：US20120194123A1

公开(公告)日：2012-08-02

申请号：US13332572

申请日：2011-12-21

申请人： Yu-Liang Lin ,  Chun-Hsueh Lee

发明人： Yu-Liang Lin ,  Chun-Hsueh Lee

IPC分类号： H02P23/08

CPC分类号： F04D27/004

摘要： A fan rotation speed control circuit comprises an AC power source, a coil electrically connected with the AC power source, a sensing module having a first resistor and a sensing device in parallel connection with mentioned first resistor, a capacitor, a DIAC, and a TRIAC having a first terminal, a second terminal and a gate terminal, wherein mentioned coil electrically connected with the first resistor and the sensing device, mentioned capacitor electrically connected with the first resistor and the sensing device, mentioned DIAC electrically connected with the first resistor, the sensing device and the capacitor, mentioned first terminal electrically connected with the first resistor, the sensing device and the coil, mentioned second terminal electrically connected with the capacitor and the AC power source, and mentioned gate terminal electrically connected with the DIAC.

摘要翻译： 风扇转速控制电路包括AC电源，与AC电源电连接的线圈，具有第一电阻器和与所述第一电阻器并联连接的感测装置的感测模块，电容器，DIAC和TRIAC 具有第一端子，第二端子和栅极端子，其中所述线圈与第一电阻器和感测装置电连接，所述电容器与第一电阻器和感测装置电连接，提及与第一电阻器电连接的DIAC， 所述第一端子与第一电阻器，感测装置和线圈电连接，所述第二端子与电容器和AC电源电连接，并且所述栅极端子与DIAC电连接。

公开(公告)号：US20060043950A1

公开(公告)日：2006-03-02

申请号：US11111807

申请日：2005-04-22

申请人： Yu-Liang Lin ,  Yu-Lung Dung ,  Yueh-Lung Huang ,  Ming-Shi Tsai

发明人： Yu-Liang Lin ,  Yu-Lung Dung ,  Yueh-Lung Huang ,  Ming-Shi Tsai

IPC分类号： G05F1/40

CPC分类号： H02P7/29 ,  G06F1/206 ,  H02M2001/0025 ,  Y02D10/16

摘要： A fan motor speed control circuit and a voltage-regulating module thereof are disclosed. The fan motor speed control circuit includes the voltage-regulating module and a driving module electrically connected to the voltage-regulating module. The driving module includes a pulse signal generating unit, a speed control unit, and a drive unit. The speed control unit compares a high frequency pulse signal generated by the pulse signal generating unit with a variable reference voltage signal output by the voltage-regulating module, and then outputs a control signal to the drive unit to proceed the speed control of the fan motor. In application, the voltage-regulating module and the driving module are electrically connected to a voltage source in parallel.

摘要翻译： 公开了一种风扇电动机速度控制电路及其电压调节模块。 风扇电动机速度控制电路包括电压调节模块和电连接到电压调节模块的驱动模块。 驱动模块包括脉冲信号发生单元，速度控制单元和驱动单元。 速度控制单元将由脉冲信号生成单元生成的高频脉冲信号与由电压调节模块输出的可变参考电压信号进行比较，然后向驱动单元输出控制信号，以进行风扇电动机的速度控制 。 在应用中，电压调节模块和驱动模块并联电连接到电压源。

公开(公告)号：US20050202763A1

公开(公告)日：2005-09-15

申请号：US10797315

申请日：2004-03-09

申请人： Ping-Hsu Chen ,  Chao-Jung Chang ,  Jui-Cheng Lo ,  Yu-Liang Lin ,  Shang-Ting Tsai ,  Ping Chuang

发明人： Ping-Hsu Chen ,  Chao-Jung Chang ,  Jui-Cheng Lo ,  Yu-Liang Lin ,  Shang-Ting Tsai ,  Ping Chuang

IPC分类号： B24B1/00

CPC分类号： B24B57/02 ,  B24B37/044

摘要： A method and system for delivering a mixed slurry for use chemical mechanical polishing operation. A first slurry may be mixed with a second slurry to provide a mixed slurry thereof. A flow rate and a mixing ratio associated with the mixed slurry can be controlled to provide an accurate flow rate control and adjustable mixing ratio thereof. The first slurry and the second slurry may be mixed in-line utilizing an in-line mixing mechanism to provide a mixed slurry thereof. Alternatively, the first and second slurries may be pre-mixed utilizing a pre-mixing mechanism to provide a mixed slurry there.

摘要翻译： 一种用于输送用于化学机械抛光操作的混合浆料的方法和系统。 可以将第一浆料与第二浆料混合以提供其混合浆料。 可以控制与混合浆料相关的流速和混合比，以提供精确的流速控制和可调混合比。 可以使用在线混合机构将第一浆料和第二浆料在线混合以提供其混合浆料。 或者，第一和第二浆料可以使用预混合机构预混合以在其中提供混合浆料。

公开(公告)号：US06857942B1

公开(公告)日：2005-02-22

申请号：US09481224

申请日：2000-01-11

申请人： Yu-Liang Lin ,  Chih-I Peng

发明人： Yu-Liang Lin ,  Chih-I Peng

IPC分类号： B24B1/00 ,  B24B37/04 ,  B24B53/007 ,  B24B53/12

CPC分类号： B24B53/017 ,  B24B53/12

摘要： An apparatus and a method for off-line pre-conditioning a conditioning disc that is used in a chemical mechanical polishing process are provided. In the apparatus, an upper platform for mounting a conditioning disc thereto and a lower platform for mounting a polishing pad thereto are engaged together under a pre-set pressure and rotated in opposite directions for a pre-set length of time. The apparatus is effective in removing loose particles from the surface of the conditioning disc such that the possibility of any such particles causing scratches on a wafer surface during a subsequently conducted chemical mechanical polishing process is eliminated. The present invention novel apparatus can be used off-line for pre-conditioning a conditioning disc such that valuable machine time of a chemical mechanical polishing apparatus is not wasted.

摘要翻译： 提供了用于离线预处理用于化学机械抛光工艺中的调节盘的设备和方法。 在该装置中，用于安装调节盘的上平台和用于将抛光垫安装在其上的下平台在预定压力下接合在一起并以相反方向旋转预定的时间长度。 该装置有效地从调节盘的表面去除松散的颗粒，使得在随后进行的化学机械抛光工艺期间任何这种颗粒在晶片表面上引起划痕的可能性被消除。 本发明的新型设备可以离线使用，用于对调节盘进行预处理，使得化学机械抛光装置的有价值的机器时间不被浪费。

公开(公告)号：US06746966B1

公开(公告)日：2004-06-08

申请号：US10353229

申请日：2003-01-28

申请人： Chung-Long Chang ,  Henry Lo ,  Shang-Ting Tsai ,  Yu-Liang Lin

发明人： Chung-Long Chang ,  Henry Lo ,  Shang-Ting Tsai ,  Yu-Liang Lin

IPC分类号： H01L21302

CPC分类号： H01L21/31111 ,  G03F9/7076 ,  G03F9/708 ,  G03F9/7084

摘要： A method of unblinding an alignment mark comprising the following steps. A substrate having a cell area and an alignment mark within an alignment area is provided. An STI trench is formed into the substrate within the cell area. A silicon oxide layer is formed over the substrate, filling the STI trench and the alignment mark. The silicon oxide layer is planarized to form a planarized STI within the STI trench and leaving silicon oxide within the alignment mark to form a blinded alignment mark. A wet chemical etchant is applied within the alignment mark area over the blinded alignment mark to at least partially remove the silicon oxide within the alignment mark. The remaining silicon oxide is removed from within the blinded alignment mark to unblind the alignment mark. A drop etcher apparatus is also disclosed.

摘要翻译： 一种解开对准标记的方法，包括以下步骤。 提供了在对准区域内具有单元区域和对准标记的基板。 在沟槽区内形成STI沟槽。 在衬底上形成氧化硅层，填充STI沟槽和对准标记。 将氧化硅层平坦化以在STI沟槽内形成平坦化的STI，并使对准标记内的氧化硅形成盲目的对准标记。 湿法化学蚀刻剂施加在对准标记区域内的盲目对准标记上，以至少部分地去除对准标记内的氧化硅。 剩余的氧化硅从盲目的对准标记中移除，以对准对准标记。 还公开了一种滴蚀蚀刻装置。