Processing method of printed wiring board
    1.
    发明授权
    Processing method of printed wiring board 有权
    印刷线路板的加工方法

    公开(公告)号:US06414263B1

    公开(公告)日:2002-07-02

    申请号:US09627308

    申请日:2000-07-27

    IPC分类号: B23K2600

    摘要: To form a hole for electrically connecting an upper conductor layer 11 of an insulating layer 10 of a printed wiring board 1 and a lower conductor layer 12 of the insulating layer 10 in the insulating layer 10 to expose the lower conductor layer 12 to the hole bottom, when laser processing is executed for making the hole 13 in the insulating layer 10 using the printed wiring board 1 comprising a treatment layer 14 being placed between the lower conductor layer 12 and the insulating layer 10 for emitting an electromagnetic wave having a wavelength different from the wavelength of processing laser during the laser processing, change in a signal emitted from the treatment layer 14 of the printed wiring board 1 is measured to determine the remaining state of the insulating layer 10. The electromagnetic wave emitted in laser processing from the treatment layer 14 placed between the lower conductor layer 12 and the insulating layer 10 rather than the reflection of laser of laser is used, so that the hole 13 piercing the insulating layer can be detected precisely.

    摘要翻译: 为了形成用于将绝缘层10中的印刷电路板1的绝缘层10的上导体层11和绝缘层10的下导体层12电连接的孔,以将下导体层12暴露于孔底 当使用包括处理层14的印刷布线板1在绝缘层10中进行激光加工来进行激光加工时,该处理层14位于下导体层12和绝缘层10之间,用于发射波长不同于 测量激光处理期间的处理激光的波长,从印刷布线板1的处理层14发射的信号的变化,以确定绝缘层10的剩余状态。激光加工中从处理层发射的电磁波 因此,使用放置在下导体层12和绝缘层10之间而不是激光的激光的反射 可以精确地检测穿透绝缘层的孔13。

    Method of forming a complex profile of uneven depressions in the surface of a workpiece by energy beam ablation
    2.
    发明授权
    Method of forming a complex profile of uneven depressions in the surface of a workpiece by energy beam ablation 失效
    通过能量束消融在工件表面形成不均匀凹陷的复杂轮廓的方法

    公开(公告)号:US06511627B1

    公开(公告)日:2003-01-28

    申请号:US09539880

    申请日:2000-03-31

    IPC分类号: B23K2600

    CPC分类号: B23K26/066 B23K26/364

    摘要: A method of forming a complex profile of uneven depressions in the surface of the ablatable workpiece by laser ablation with the use of a simple optics or a mask of a simple configuration. The method includes the steps of determining the complex profile in accordance with a particular feature to be given to the surface of the workpiece, then dividing the complex profile into more than one simple and regular waveform patterns of different characteristics, and irradiating an energy beam to the surface of the work piece to form the individual regular waveform patterns successively in an superimposed fashion by ablation in the surface of the workpiece. Accordingly, the desired complex profile can be easily obtained at an improved efficiency and at a moderate cost.

    摘要翻译: 通过使用简单的光学元件或简单配置的掩模,通过激光烧蚀在可烧蚀工件的表面中形成不均匀凹陷的复杂轮廓的方法。 该方法包括以下步骤:根据要赋予工件表面的特定特征确定复杂轮廓,然后将复杂轮廓分成多于一个不同特征的简单和规则波形图案,并将能量束照射到 工件的表面通过在工件的表面中的消融以叠加的方式连续地形成单独的规则波形图案。 因此,可以以更高的效率和适中的成本容易地获得所需的复合物轮廓。

    Method of forming a complex profile of uneven depressions in the surface
of a workpiece by energy beam ablation

    公开(公告)号:US06120725A

    公开(公告)日:2000-09-19

    申请号:US119745

    申请日:1998-07-21

    IPC分类号: B23K26/06 B23K26/36

    CPC分类号: B23K26/066 B23K26/364

    摘要: A method of forming a complex profile of uneven depressions in the surface of the ablatable workpiece by laser ablation with the use of a simple optics or a mask of a simple configuration. The method includes the steps of determining the complex profile in accordance with a particular feature to be given to the surface of the workpiece, then dividing the complex profile into more than one simple and regular waveform patterns of different characteristics, and irradiating an energy beam to the surface of the work piece to form the individual regular waveform patterns successively in an superimposed fashion by ablation in the surface of the workpiece. Accordingly, the desired complex profile can be easily obtained at an improved efficiency and at a moderate cost.

    METHOD FOR REMOVING COPPER IN STEEL SCRAPS
    5.
    发明申请
    METHOD FOR REMOVING COPPER IN STEEL SCRAPS 审中-公开
    钢铁筛除铜方法

    公开(公告)号:US20110000340A1

    公开(公告)日:2011-01-06

    申请号:US12920741

    申请日:2009-03-03

    IPC分类号: C22B15/02 C22B15/00

    摘要: In producing high-quality steel with use of copper-containing steel scraps as an iron source, the copper-containing steel scraps are melted with addition of carbon to produce hot metal for steelmaking, then, copper contained in the hot metal is removed by sulfur-containing flux, and sulfur contained in the hot metal is removed. With this method, the copper in the steel scraps can be removed efficiently and without the need for large facilities. Preferably, the sulfur-containing flux used is flux having Na2S as the main component. The treatment for removing copper in the hot metal is preferably carried out with use of refining equipment with mechanical stirrer or by the flux injecting method. Besides, it is preferable that a shaft furnace having a coke bed formed inside is used to produce hot metal having a higher concentration of sulfur for the copper removal treatment.

    摘要翻译: 在使用含铜钢屑作为铁源生产优质钢时,通过添加碳熔化含铜钢屑,以生产用于炼钢的热金属,然后通过硫除去铁水中所含的铜 并且除去包含在热金属中的硫。 通过这种方法,可以有效地去除钢屑中的铜而无需大型设备。 优选地,使用的含硫助熔剂是具有Na 2 S作为主要成分的助熔剂。 用于除去热金属中的铜的处理优选使用具有机械搅拌器的精炼设备或通过注射方法进行。 此外,优选的是,将内部形成有焦炭床的竖炉用于生产具有较高浓度硫的热金属用于铜去除处理。

    INFRARED SENSOR
    6.
    发明申请
    INFRARED SENSOR 有权
    红外传感器

    公开(公告)号:US20100230595A1

    公开(公告)日:2010-09-16

    申请号:US12302024

    申请日:2007-05-23

    摘要: To improve thermal insulation, a thermal infrared sensing element is carried on a sensor mount of a porous material and is spaced upwardly from a substrate by means of anchor studs projecting on the substrate. The sensor mount is formed with a pair of coplanar beams carry thereon leads extending from the sensing element. The leads and the beams are secured to the upper ends of the anchor studs to hold the sensing element at a predetermined height above the substrate. The beams and the leads are combined with each other by intermolecular adhesion such that the sensing element as well as the sensor mount can be altogether supported to the anchor studs.

    摘要翻译: 为了改善绝热性,热红外传感元件被承载在多孔材料的传感器座上,并且通过突出在基底上的锚固螺柱与衬底间隔开。 传感器支架形成有一对共面梁,其上承载有从感测元件延伸的引线。 引线和梁被固定到锚栓的上端以将感测元件保持在基板上方的预定高度处。 梁和引线通过分子间粘附而彼此组合,使得感测元件以及传感器座可以一起被支撑到锚栓上。

    Optical module
    7.
    发明授权
    Optical module 失效
    光模块

    公开(公告)号:US08391657B2

    公开(公告)日:2013-03-05

    申请号:US12663711

    申请日:2008-06-26

    IPC分类号: G02B6/26 G02B6/30

    CPC分类号: G02B6/423 G02B6/4239 G02B6/43

    摘要: An optical module includes an emitter-side mounting substrate, a receiver-side mounting substrate and an external waveguide substrate. The mounting substrate is provided with a waveguide having a core and a pair of fitting recesses. The external waveguide substrate is provided with an external waveguide having a core, a pair of fitting tabs and a lap joint portion. As the fitting tabs are fitted into the respective fitting recesses, the mounting substrate) and the external waveguide substrate are joined together, the two cores are aligned with each other, and the lap joint portion is positioned to overlap the mounting substrate.

    摘要翻译: 光学模块包括发射极侧安装基板,接收器侧安装基板和外部波导基板。 安装基板设置有具有芯部和一对嵌合凹部的波导管。 外部波导基板设置有具有芯部,一对配合突片和搭接部的外部波导。 当安装片安装在相应的装配凹槽中时,安装基板)和外部波导基板接合在一起,两个芯彼此对准,并且搭接部分被定位成与安装基板重叠。

    HOT LINE DETECTION DEVICE
    9.
    发明申请
    HOT LINE DETECTION DEVICE 审中-公开
    热线检测装置

    公开(公告)号:US20110140011A1

    公开(公告)日:2011-06-16

    申请号:US13054849

    申请日:2009-07-22

    申请人: Yuichi Uchida

    发明人: Yuichi Uchida

    IPC分类号: G01N21/84

    摘要: A light leakage generation portion is formed at a portion of connection by connecting two optical fibers so that a refractive index distribution of the optical fibers in the portion of connection is different from a refractive index distribution thereof in another portion, and a part of a light propagating a core of one optical fiber (optical fiber on the right side in the example shown) is leaked into a clad of the other optical fiber (optical fiber on the left side in the example shown). A light receiving element chip adheres to an outer circumferential surface of the clad of the other optical fiber via a transparent adhesive layer constituted by transparent adhesive so as to detect light leaked by the light leakage generation portion.

    摘要翻译: 通过连接两根光纤在连接部分处形成漏光产生部分,使得连接部分中的光纤的折射率分布不同于其它部分的折射率分布,以及光的一部分 传播一根光纤(示出的示例中右侧的光纤)的核心被泄漏到另一条光纤(示出的示例中为左侧的光纤)的包层中。 光接收元件芯片通过由透明粘合剂构成的透明粘合剂层粘合到另一光纤的包层的外圆周表面上,以便检测由漏光产生部分泄漏的光。

    OPTICAL MODULE
    10.
    发明申请
    OPTICAL MODULE 失效
    光学模块

    公开(公告)号:US20100220957A1

    公开(公告)日:2010-09-02

    申请号:US12663711

    申请日:2008-06-26

    IPC分类号: G02B6/42

    CPC分类号: G02B6/423 G02B6/4239 G02B6/43

    摘要: An optical module includes an emitter-side mounting substrate, a receiver-side mounting substrate and an external waveguide substrate. The mounting substrate is provided with a waveguide having a core and a pair of fitting recesses. The external waveguide substrate is provided with an external waveguide having a core, a pair of fitting tabs and a lap joint portion. As the fitting tabs are fitted into the respective fitting recesses, the mounting substrate and the external waveguide substrate are joined together, the two cores are aligned with each other, and the lap joint portion is positioned to overlap the mounting substrate.

    摘要翻译: 光学模块包括发射极侧安装基板,接收器侧安装基板和外部波导基板。 安装基板设置有具有芯部和一对嵌合凹部的波导管。 外部波导基板设置有具有芯部,一对配合突片和搭接部的外部波导。 由于嵌合片安装在各嵌合凹部中,所以安装基板和外部波导基板接合在一起,两芯彼此对准,搭接部分与安装基板重合。