AIR-CONDITIONING CONTROL DEVICE, AIR-CONDITIONING CONTROL METHOD, AND COMPUTER PROGRAM PRODUCT
    2.
    发明申请
    AIR-CONDITIONING CONTROL DEVICE, AIR-CONDITIONING CONTROL METHOD, AND COMPUTER PROGRAM PRODUCT 有权
    空调控制装置,空调控制方法和计算机程序产品

    公开(公告)号:US20150051740A1

    公开(公告)日:2015-02-19

    申请号:US14358873

    申请日:2012-06-15

    IPC分类号: F24F11/00

    CPC分类号: F24F11/30 F24F11/62 F24F11/64

    摘要: An air-conditioning control device includes a conversion definition information storage unit, an air-conditioning control computation unit, and a gateway unit. The conversion definition information storage unit preliminarily stores conversion definition information for converting air-conditioning control original data acquired from an external air-conditioning facility into computational data for performing an air-conditioning control computation or conversion definition information for converting air-conditioning control computation resultant data acquired as a result of the air-conditioning control computation into air-conditioning control data used for air-conditioning control at the air-conditioning facility. The air-conditioning control computation unit performs the air-conditioning control computation based on the computational data, and outputs the air-conditioning control computation resultant data. The gateway unit refers to the conversion definition information to convert the air-conditioning control original data into the computational data or to convert the air-conditioning control computation resultant data into the air-conditioning control data.

    摘要翻译: 空调控制装置包括转换定义信息存储单元,空调控制计算单元和网关单元。 转换定义信息存储单元预先存储用于将从外部空调设备获取的空调控制原始数据转换为用于执行空调控制计算的计算数据或用于转换空调控制计算结果的转换定义信息的转换定义信息 作为空调控制计算的结果的数据被用于空调设备中用于空调控制的空调控制数据。 空调控制计算单元基于计算数据执行空调控制计算,并输出空调控制计算结果数据。 网关单元参考将空调控制原始数据转换成计算数据的转换定义信息,或将空调控制计算结果数据转换成空调控制数据。

    Polylactic acid composition
    6.
    发明授权
    Polylactic acid composition 失效
    聚乳酸组成

    公开(公告)号:US07585910B2

    公开(公告)日:2009-09-08

    申请号:US11387964

    申请日:2006-03-24

    IPC分类号: B60C1/00

    CPC分类号: C08K5/10 C08L67/04

    摘要: A polylactic acid composition containing polylactic acid and ester-based plasticizer, wherein a content of the ester-based plasticizer is 16 to 33 wt %, and when the composition is highly deformed by stress loading as the relation between the stress and the deformation deviates from linear viscoelastic behavior and thereafter the stress is released, residual deformation measured after the stress is released is not less than 66.0% after 0.2 minute of the stress release, and is not more than 34.0% after 240 hours of the stress release.

    摘要翻译: 含有聚乳酸和酯系增塑剂的聚乳酸组合物,其中酯类增塑剂的含量为16〜33重量%,当应力负荷与组合物的应力与变形之间的关系偏离时,组合物高度变形 线性粘弹性行为,然后释放应力,应力释放后测得的残余变形在应力释放0.2分钟后不低于66.0%,应力释放240小时后不大于34.0%。

    Electronic component, method of sealing electronic component with resin, and apparatus therefor
    8.
    发明授权
    Electronic component, method of sealing electronic component with resin, and apparatus therefor 失效
    电子部件,用树脂密封电子部件的方法及其装置

    公开(公告)号:US06438826B2

    公开(公告)日:2002-08-27

    申请号:US09777787

    申请日:2001-02-05

    IPC分类号: H05K1300

    摘要: A resin seal apparatus includes a movable bottom die vertically moved by an elevator mechanism, a transport mechanism horizontally moving the movable bottom die having placed thereon a printed circuit board with a semiconductor chip mounted thereon, an intermediate die abutting against a periphery of the printed circuit board when the movable bottom die is moved upward, a film of resin stretched by a film stretch mechanism over the intermediate die and the printed circuit board, a die for a chip, pressing a back surface of the semiconductor chip via the film of resin, and a top die pressing a top surface of the intermediate die via the film of resin. This apparatus allows a PCB with a semiconductor chip mounted thereon in the form of a flip chip to be sealed with resin in a reduced period of time to fabricate an electronic component.

    摘要翻译: 树脂密封装置包括通过电梯机构垂直移动的可移动底部模具,水平移动其上安装有半导体芯片的印刷电路板上的可移动底模的运送机构,邻接印刷电路的周边的中间模具 当可移动底模向上移动时,通过膜拉伸机构在中间模和印刷电路板上延伸的树脂膜,用于芯片的模具,通过树脂膜挤压半导体芯片的背表面, 以及通过树脂膜压制中间模具的顶表面的顶模。 该装置允许其中安装有半导体芯片的PCB以倒装芯片的形式在减少的时间周期内用树脂密封以制造电子部件。

    Polylactic Acid Resin Composition, Moldings, and Process for Production Thereof
    10.
    发明申请
    Polylactic Acid Resin Composition, Moldings, and Process for Production Thereof 有权
    聚乳酸树脂组合物,成型品及其制造方法

    公开(公告)号:US20100174017A1

    公开(公告)日:2010-07-08

    申请号:US11661671

    申请日:2005-09-02

    IPC分类号: C08K5/24

    CPC分类号: C08K5/25 C08K3/34 C08L67/04

    摘要: A polylactic acid resin composition in which polylactic acid is blended with dibasic acid bis(benzoylhydrazide) represented by general formula (I) below; and a process for producing heat-resistant polylactic acid resin moldings, wherein after the polylactic acid resin composition is melted, the polylactic acid resin composition melted is filled in a die of a molding machine and molded accompanied with crystallization, in which the temperature of the die has been set in a range not higher than the initiation temperature of crystallization and not lower than the glass transition temperature determined with a differential scanning calorimeter (DSC). (In the formula, R represents a alkylene, alkenylene, cycloalkylene, alkylene having an ether bond, or alkylene interrupted with a cycloalkylene, the groups each having 1 to 12 carbon atoms; and R1, R2, R3, and R4 each represent a hydrogen atom, halogen atom, alkyl, cycloalkyl, aryl, aralkyl, or alkylaryl, the groups each having 1 to 12 carbon atoms, or R1 and R2 and/or R3 and R4 bond to each other to form a five- to eight-membered ring.)

    摘要翻译: 将聚乳酸与下述通式(I)表示的二元酸二(苯甲酰基酰肼)配合的聚乳酸树脂组合物; 以及制造耐热性聚乳酸树脂成形体的方法,其中在聚乳酸树脂组合物熔融之后,熔融的聚乳酸树脂组合物被填充在模塑机的模具中,并且随着结晶而成型,其中, 晶粒已经设定在不高于结晶的起始温度的范围内,并且不低于用差示扫描量热计(DSC)测定的玻璃化转变温度。 (式中,R表示亚烷基,亚烯基,亚环烷基,具有醚键的亚烷基,或亚环烷基间隔的亚烷基,各自具有1〜12个碳原子的基团,R1,R2,R3,R4分别表示氢原子 原子,卤素原子,烷基,环烷基,芳基,芳烷基或烷基芳基,各自具有1至12个碳原子,或R 1和R 2和/或R 3和R 4彼此键合以形成五至八元环 。)