摘要:
A method for forming a transparent conductive film includes the steps of: forming an ITO film on a substrate by sputtering a target including oxygen atoms, indium atoms, and tin atoms under an inert gas atmosphere; patterning the ITO film by selectively removing a prescribed portion of the ITO film using an etching method; and doping the patterned ITO film with oxygen using an ion shower doping method, thereby forming the transparent conductive film from the ITO film.
摘要:
A thin-film transistor circuit for a logic gate circuit includes: an amorphous silicon layer; a driver transistor having a source region, a drain region, and a channel region, the source, drain, and channel regions being formed in the amorphous silicon layer; and a load device formed in the amorphous silicon layer and made of n.sup.- amorphous silicon, the load device being connected to the driver transistor.
摘要:
In a method for selectively etching a second silicon layer of a multilayer structure which includes a first silicon layer and the second silicon layer formed on the first silicon layer and doped with impurities according to the present invention, the second silicon layer is selectively etched by using an etching gas including freon-14 gas and a gas selected from a group composed of hydrogen chloride gas and chloride gas.
摘要:
In a method for selectively etching a second silicon layer of a multilayer structure which includes a first silicon layer and the second silicon layer formed on the first silicon layer and doped with impurities according to the present invention, the second silicon layer is selectively etched by using an etching gas including freon-14 gas and a gas selected from a group composed of hydrogen chloride gas and chlorine gas.
摘要:
It is an object of the invention to provide a method for producing a substrate for mounting a semiconductor chip, that can reduce bridging and allows excellent wire bondability and solder connection reliability to be obtained, even when forming fine-pitch wirings. The method for producing a substrate for mounting a semiconductor chip according to the invention comprises a resist-forming step in which a resist is formed on the first copper layer of a stack comprising an inner board with an inner layer circuit on the surface and a first copper layer formed on the inner board separated by an insulating layer at the sections other than those that are to constitute a conductor circuit, a conductor circuit-forming step in which a second copper layer is formed by electrolytic copper plating on the first copper layer to obtain a conductor circuit, a nickel layer-forming step in which a nickel layer is formed by electrolytic nickel plating on at least part of the conductor circuit, a resist removal step in which the resist is removed, an etching step in which the first copper layer is removed by etching, and a gold layer-forming step in which a gold layer is formed by electroless gold plating on at least part of the conductor circuit.
摘要:
Picture element electrodes (30) and common electrodes (36) are provided in one of two substrates facing each other. Each picture element (20) has a plurality of sub picture elements (22). In a range in which a signal voltage of an image signal is low, a display is carried out only in a first sub picture element (22a) having narrower electrode spacing, whereas in a range in which the signal voltage of the image signal is high, a display is carried out in both of the first sub picture element (22a) and a second sub picture element (22b) having wider electrode spacing.
摘要:
A liquid crystal panel (10) includes a liquid crystal layer formed with a p-type liquid crystal. The liquid crystal layer exhibits homogeneous orientation while no voltage is applied. Further, an electric field is applied to the liquid crystal layer in a direction same as dipole moments (μ) of liquid crystal molecules (3a) to which no voltage is applied. With these arrangements, it is possible to provide a liquid crystal panel and a liquid crystal display device, each of which adopts a new display mode that can achieve a wide viewing angle equivalent to an IPS mode, can achieve a high-speed response like an OCB mode or exceeding the OCB mode, and does not require an initial operation for orientation conversion to the bend orientation.
摘要:
The present invention provides a liquid crystal display device providing uniform display without lowering the transmissivity.The present invention is a liquid crystal display device comprising: a first substrate and a second substrate positioned to face the first substrate; and a liquid crystal layer interposed between the first substrate and the second substrate, wherein the liquid crystal layer contains liquid crystal molecules having positive dielectric anisotropy, the liquid crystal molecule is aligned in a direction vertical to a surface of the first substrate when voltage is not applied, the first substrate comprises a pixel electrode and a common electrode, each comprising a core portion and a comb-tooth portion, the comb-tooth portions of the pixel electrode and of the common electrode are arranged in parallel with each other and alternately engaged at a constant interval, the core portion of the common electrode comprises two parallel portions that are in parallel with the longitudinal direction of the comb-tooth portion of the common electrode, the two parallel portions are each positioned outside the outermost comb-tooth portions of the pixel electrode, and (W−S)/(L+S) satisfies “2n+1”, in which “W” represents a distance between the two parallel portions, “L” represents the width of each of the comb-tooth portions of the pixel electrode and the common electrode, “S” represents a distance between a comb-tooth portion of the pixel electrode and an adjacent comb-tooth portion of the common electrode and also represents a distance between one of the outermost comb-tooth portions of the pixel electrode and one of the two parallel portions, and “n” represents the number of the comb-tooth portions of the common electrode.
摘要:
The present invention provides a liquid crystal display device that suppress moiré generated when a voltage is applied in a liquid crystal mode that drives a vertical alignment liquid crystal by using at least a pair of comb-shaped electrodes. A liquid crystal display device of the present invention comprises: a liquid crystal display panel including a liquid crystal layer and a pair of substrates sandwiching the liquid crystal layer; and a backlight unit disposed on a back side of the liquid crystal display panel, one of the pair of substrates including a pair of comb-shaped electrodes each having comb teeth, the comb teeth of one of the pair of comb-shaped electrodes and the comb teeth of the other of the pair of comb-shaped electrodes being disposed alternately and spaced apart from each other, the liquid crystal layer containing liquid crystal molecules with positive dielectric anisotropy, the liquid crystal molecules being aligned in a direction perpendicular to a surface of one of the pair of substrates when no voltage is applied, the backlight unit having an optical sheet with multiple folds parallel to one another on a surface, the pitch width of the pair of comb-shaped electrodes being different from an integral multiple of the pitch width of the folds of the optical sheet.
摘要:
It is an object of the invention to provide a method for producing a substrate for mounting a semiconductor chip, that can reduce bridging and allows excellent wire bondability and solder connection reliability to be obtained, even when forming fine-pitch wirings. The method for producing a substrate for mounting a semiconductor chip according to the invention comprises a resist-forming step in which a resist is formed on the first copper layer of a stack comprising an inner board with an inner layer circuit on the surface and a first copper layer formed on the inner board separated by an insulating layer at the sections other than those that are to constitute a conductor circuit, a conductor circuit-forming step in which a second copper layer is formed by electrolytic copper plating on the first copper layer to obtain a conductor circuit, a nickel layer-forming step in which a nickel layer is formed by electrolytic nickel plating on at least part of the conductor circuit, a resist removal step in which the resist is removed, an etching step in which the first copper layer is removed by etching, and a gold layer-forming step in which a gold layer is formed by electroless gold plating on at least part of the conductor circuit.