Semiconductor device, method of manufacturing the same, and method of designing the same
    3.
    发明授权
    Semiconductor device, method of manufacturing the same, and method of designing the same 有权
    半导体装置及其制造方法及其设计方法

    公开(公告)号:US07344925B2

    公开(公告)日:2008-03-18

    申请号:US11064820

    申请日:2005-02-25

    摘要: An object of the present invention is to provide a semiconductor device formed by laser crystallization by which formation of grain boundaries in the TFT channel formation region can be avoided, and a method of manufacturing the same. Still another object of the present invention is to provide a method of designating the semiconductor device. The present invention relates to a semiconductor device with a plurality of cells each having a plurality of TFTs that have the same channel length direction, in which the plural cells form a plurality of columns along the channel length direction, in which an island-like semiconductor film of each of the plural TFTs is crystallized by laser light running in the channel length direction, in which a channel formation region of the island-like semiconductor film is placed on a depressive portion of a base film that has a rectangular or stripe pattern concave and convex with the channel length direction matching the longitudinal direction of the depressive portion, and in which a plurality of wires for electrically connecting the plural cells with one another are formed between the plural columns.

    摘要翻译: 本发明的目的是提供一种通过激光晶化形成的半导体器件及其制造方法,可以避免TFT沟道形成区域中的晶界的形成。 本发明的另一个目的是提供一种指定半导体器件的方法。 本发明涉及具有多个单元的半导体器件,每个单元具有多个具有相同沟道长度方向的TFT,其中多个单元沿着沟道长度方向形成多个列,其中岛状半导体 通过在沟道长度方向上行进的激光,使多个TFT中的每一个的膜结晶,其中岛状半导体膜的沟道形成区域被放置在基膜的具有矩形或条纹图案凹部的凹部 并且其中通道长度方向与凹陷部分的纵向相匹配的凸起,并且其中在多个柱之间形成有用于彼此电连接多个单元的多根导线。

    Semiconductor device, method of manufacturing the same, and method of designing the same
    5.
    发明授权
    Semiconductor device, method of manufacturing the same, and method of designing the same 失效
    半导体装置及其制造方法及其设计方法

    公开(公告)号:US06875998B2

    公开(公告)日:2005-04-05

    申请号:US10395310

    申请日:2003-03-25

    摘要: An object of the present invention is to provide a semiconductor device formed by laser crystallization by which formation of grain boundaries in the TFT channel formation region can be avoided, and a method of manufacturing the same. Still another object of the present invention is to provide a method of designating the semiconductor device. The present invention relates to a semiconductor device with a plurality of cells each having a plurality of TFTs that have the same channel length direction, in which the plural cells form a plurality of columns along the channel length direction, in which an island-like semiconductor film of each of the plural TFTs is crystallized by laser light running in the channel length direction, in which a channel formation region of the island-like semiconductor film is placed on a depressive portion of a base film that has a rectangular or stripe pattern concave and convex with the channel length direction matching the longitudinal direction of the depressive portion, and in which a plurality of wires for electrically connecting the plural cells with one another are formed between the plural columns.

    摘要翻译: 本发明的目的是提供一种通过激光晶化形成的半导体器件及其制造方法,可以避免TFT沟道形成区域中的晶界的形成。 本发明的另一个目的是提供一种指定半导体器件的方法。 本发明涉及具有多个单元的半导体器件,每个单元具有多个具有相同沟道长度方向的TFT,其中多个单元沿着沟道长度方向形成多个列,其中岛状半导体 通过在沟道长度方向上行进的激光,使多个TFT中的每一个的膜结晶,其中岛状半导体膜的沟道形成区域被放置在基膜的具有矩形或条纹图案凹部的凹部 并且其中通道长度方向与凹陷部分的纵向相匹配的凸起,并且其中在多个柱之间形成有用于彼此电连接多个单元的多根导线。

    Semiconductor device, method of manufacturing the same, and method of designing the same
    6.
    发明授权
    Semiconductor device, method of manufacturing the same, and method of designing the same 有权
    半导体装置及其制造方法及其设计方法

    公开(公告)号:US07541228B2

    公开(公告)日:2009-06-02

    申请号:US12003983

    申请日:2008-01-04

    摘要: An object of the present invention is to provide a semiconductor device formed by laser crystallization by which formation of grain boundaries in the TFT channel formation region can be avoided, and a method of manufacturing the same. Still another object of the present invention is to provide a method of designating the semiconductor device. The present invention relates to a semiconductor device with a plurality of cells each having a plurality of TFTs that have the same channel length direction, in which the plural cells form a plurality of columns along the channel length direction, in which an island-like semiconductor film of each of the plural TFTs is crystallized by laser light running in the channel length direction, in which a channel formation region of the island-like semiconductor film is placed on a depressive portion of a base film that has a rectangular or stripe pattern concave and convex with the channel length direction matching the longitudinal direction of the depressive portion, and in which a plurality of wires for electrically connecting the plural cells with one another are formed between the plural columns.

    摘要翻译: 本发明的目的是提供一种通过激光晶化形成的半导体器件及其制造方法,可以避免TFT沟道形成区域中的晶界的形成。 本发明的另一个目的是提供一种指定半导体器件的方法。 本发明涉及具有多个单元的半导体器件,每个单元具有多个具有相同沟道长度方向的TFT,其中多个单元沿着沟道长度方向形成多个列,其中岛状半导体 通过在沟道长度方向上行进的激光,使多个TFT中的每一个的膜结晶,其中岛状半导体膜的沟道形成区域被放置在基膜的具有矩形或条纹图案凹部的凹部 并且其中通道长度方向与凹陷部分的纵向相匹配的凸起,并且其中在多个柱之间形成有用于彼此电连接多个单元的多根导线。

    Semiconductor device comprising a light emitting element and a light receiving element
    7.
    发明授权
    Semiconductor device comprising a light emitting element and a light receiving element 有权
    包括发光元件和光接收元件的半导体器件

    公开(公告)号:US07459726B2

    公开(公告)日:2008-12-02

    申请号:US10775328

    申请日:2004-02-11

    IPC分类号: H01L31/12

    摘要: A semiconductor device which has a high performance integrated circuit formed of an inexpensive glass substrate and capable of processing a large amount of information and operating at higher data rates. The semiconductor device includes semiconductor elements stacked by transferring a semiconductor element formed on a different substrate. A resin film is formed between the stacked semiconductor elements and a metal oxide film is partially formed between the stacked semiconductor elements as well. A first electric signal is converted to an optical signal in a light emitting element electrically connected to one of the stacked semiconductor elements. Meanwhile, the optical signal is converted to a second electric signal in a light receiving element electrically connected to another one of the stacked semiconductor elements.

    摘要翻译: 一种半导体器件,具有由便宜的玻璃基板形成的能够处理大量信息并以较高数据速率工作的高性能集成电路。 半导体器件包括通过转移形成在不同衬底上的半导体元件而堆叠的半导体元件。 在层叠的半导体元件之间形成树脂膜,并且也在层叠的半导体元件之间部分地形成金属氧化物膜。 第一电信号被转换成电连接到堆叠的半导体元件之一的发光元件中的光信号。 同时,光电信号被转换为与另一个堆叠的半导体元件电连接的光接收元件中的第二电信号。

    Semiconductor device and manufacturing method thereof
    8.
    发明授权
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US09112067B2

    公开(公告)日:2015-08-18

    申请号:US12766389

    申请日:2010-04-23

    摘要: An object relates to an electrode of a semiconductor device or a method for manufacturing a semiconductor device, which includes a bonding step, and problems are: (1) high resistance of a semiconductor device due to the use of an Al electrode, (2) formation of an alloy by Al and Si, (3) high resistance of a film formed by a sputtering method, and (4) defective bonding in a bonding step which is caused if a bonding surface has a large unevenness. A semiconductor device includes a metal substrate or a substrate provided with a metal film, a copper (Cu) plating film over and bonded to the metal substrate or the metal film by employing a thermocompression bonding method, a barrier film over the Cu plating film, a single crystal silicon film over the barrier film, and an electrode layer over the single crystal silicon film.

    摘要翻译: 本发明涉及一种半导体器件的电极或半导体器件的制造方法,其包括接合工序,其问题是:(1)由于使用Al电极而导致的半导体器件的高电阻,(2) 通过Al和Si形成合金,(3)通过溅射法形成的膜的高电阻,以及(4)如果接合表面具有大的不平坦度时引起的接合步骤中的不良接合。 半导体装置包括金属基板或具有金属膜的金属基板,通过使用热压接法在金属基板或金属膜上结合的铜(Cu)电镀膜,在Cu镀膜上的阻挡膜, 阻挡膜上的单晶硅膜,以及单晶硅膜上的电极层。

    Method of manufacturing semiconductor device
    10.
    发明授权
    Method of manufacturing semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US08673739B2

    公开(公告)日:2014-03-18

    申请号:US13303519

    申请日:2011-11-23

    IPC分类号: H01L21/30

    摘要: It is an object of the invention to provide a lightweight semiconductor device having a highly reliable sealing structure which can prevent ingress of impurities such as moisture that deteriorate element characteristics, and a method of manufacturing thereof. A protective film having superior gas barrier properties (which is a protective film that is likely to damage an element if the protective film is formed on the element directly) is previously formed on a heat-resistant substrate other than a substrate with the element formed thereon. The protective film is peeled off from the heat-resistant substrate, and transferred over the substrate with the element formed thereon so as to seal the element.

    摘要翻译: 本发明的目的是提供一种具有高度可靠的密封结构的轻质半导体器件及其制造方法,该密封结构能够防止元素特性恶化的诸如水分等杂质的侵入。 具有优异阻气性的保护膜(其是如果在元件上直接形成保护膜时可能损坏元件的保护膜)预先在其上形成有元件的基板之外的耐热基板上形成 。 保护膜从耐热基材上剥离,并在其上形成的元件在基板上转印以密封元件。