公开(公告)号：US20150097278A1

公开(公告)日：2015-04-09

申请号：US14459328

申请日：2014-08-14

申请人： Zhigang Bai ,  Yin Kheng Au ,  Lan Chu Tan ,  Jinzhong Yao

发明人： Zhigang Bai ,  Yin Kheng Au ,  Lan Chu Tan ,  Jinzhong Yao

IPC分类号： H01L23/495

CPC分类号： H01L21/4842 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49558 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012

摘要： Assembling a surface mount semiconductor device includes providing a lead frame structure with peripheral leads and additional bottom face contacts integral with frame members. Outer portions of the bottom face contact members are interposed between inner portions of adjacent pairs of the peripheral leads. A package body is formed by encapsulating the lead frame structure in which the frame members are positioned outside a side edge surface. The peripheral leads and the bottom face contact members project between the side edge surface of the package body and the frame members. The frame members are cut and the peripheral leads and the bottom face contact members are separated and electrically isolated from each other.

摘要翻译： 组装表面贴装半导体器件包括提供具有周边引线的引线框结构和与框架构件一体的附加底面接触。 底面接触构件的外部部分位于相邻的外围引线对的内部之间。 通过封装框架构件定位在侧边缘表面外侧的引线框架结构形成封装体。 外围引线和底面接触构件在封装主体的侧边缘表面和框架构件之间突出。 框架构件被切割，并且周边引线和底面接触构件彼此分离并电隔离。

公开(公告)号：US20150294924A1

公开(公告)日：2015-10-15

申请号：US14552497

申请日：2014-11-25

申请人： Zhigang Bai ,  Jinzhong Yao ,  Lan Chu Tan

发明人： Zhigang Bai ,  Jinzhong Yao ,  Lan Chu Tan

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L23/58 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L24/85 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49861 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a first lead frame type having a first type of package leads and a pre-molded portion, and a second lead frame type having a second type of package leads that surround a die pad and are supported by the pre-molded portion. An integrated circuit is attached to the die pad and electrically connected to the first and second types of leads with bond wires. A mold compound, which forms a mold cap, covers the first and second lead frame types, the integrated circuit and the bond wires. The first lead frame type may be a QFP type and the second lead frame type may be a QFN type.

摘要翻译： 半导体封装包括具有第一类型的封装引线和预成型部分的第一引线框架型和具有围绕芯片焊盘并由预模制部分支撑的第二类型的封装引线的第二引线框架型 。 集成电路附接到管芯焊盘并且用接合线电连接到第一和第二类型的引线。 形成模具帽的模具复合体覆盖第一和第二引线框架类型，集成电路和接合线。 第一引线框类型可以是QFP型，第二引线框类型可以是QFN型。

公开(公告)号：US09589928B2

公开(公告)日：2017-03-07

申请号：US14552497

申请日：2014-11-25

申请人： Zhigang Bai ,  Jinzhong Yao ,  Lan Chu Tan

发明人： Zhigang Bai ,  Jinzhong Yao ,  Lan Chu Tan

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L23/495 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L24/85 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49861 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a first lead frame type having a first type of package leads and a pre-molded portion, and a second lead frame type having a second type of package leads that surround a die pad and are supported by the pre-molded portion. An integrated circuit is attached to the die pad and electrically connected to the first and second types of leads with bond wires. A mold compound, which forms a mold cap, covers the first and second lead frame types, the integrated circuit and the bond wires. The first lead frame type may be a QFP type and the second lead frame type may be a QFN type.

摘要翻译： 半导体封装包括具有第一类型的封装引线和预成型部分的第一引线框架型和具有围绕芯片焊盘并由预模制部分支撑的第二类型的封装引线的第二引线框架型 。 集成电路附接到管芯焊盘并且用接合线电连接到第一和第二类型的引线。 形成模具帽的模具复合体覆盖第一和第二引线框架类型，集成电路和接合线。 第一引线框类型可以是QFP型，第二引线框类型可以是QFN型。

公开(公告)号：US20160056097A1

公开(公告)日：2016-02-25

申请号：US14556225

申请日：2014-11-30

申请人： Zhigang Bai ,  Xingshou Pang ,  Nan Xu ,  Jinzhong Yao

发明人： Zhigang Bai ,  Xingshou Pang ,  Nan Xu ,  Jinzhong Yao

IPC分类号： H01L23/495 ,  H01L21/52 ,  H01L21/78 ,  H01L21/56 ,  H01L21/311 ,  H01L21/3205 ,  H01L23/31 ,  H01L21/48

CPC分类号： H01L21/78 ,  H01L21/4842 ,  H01L21/52 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49551 ,  H01L23/49582 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A Quad Flat Non-leaded (QFN) semiconductor die package has a semiconductor die mounted on a die flag of a lead frame. A covers the semiconductor die. The housing has a base and sides. There are electrically conductive mounting feet, each of which has an exposed base portion in the base of the housing and an exposed side portion in the one of the sides of the housing. Bond wires electrically connect electrodes of the semiconductor die to respective ones of the mounting feet.

摘要翻译： 四边形扁平无引线（QFN）半导体管芯封装具有安装在引线框架的管芯标记上的半导体管芯。 A覆盖半导体管芯。 房屋有一个基地和两侧。 存在导电安装脚，每个脚在壳体的基部中具有暴露的基部，并且在壳体的一侧中的暴露的侧部。 接合线将半导体管芯的电极与相应的安装脚电连接。

公开(公告)号：US20150294929A1

公开(公告)日：2015-10-15

申请号：US14552491

申请日：2014-11-25

申请人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

发明人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L21/565 ,  H01L21/4839 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49558 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15156 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00

摘要： A semiconductor die package is assembled from a lead frame having lead fingers with a bonding end adjacent a die flag, and an elongate region extending away from the die flag. A semiconductor die is mounted on the die flag and electrodes of the semiconductor die are electrically connected to the bonding ends with bond wires. Each elongate region is bent into an external connector lead with mounting feet. The elongate region of each of the lead fingers protrudes from a housing formed from a mold compound. The mold compound extends from the housing to provide insulated support fingers molded to the external connector leads.

摘要翻译： 半导体管芯封装由具有引线指的引线框架组装，引线框具有邻近管芯标记的结合端，以及远离管芯标记延伸的细长区域。 半导体管芯安装在管芯标记上，半导体管芯的电极通过接合线与接合端电连接。 每个细长区域被弯曲成具有安装脚的外部连接器引线。 每个引线指的细长区域从由模具化合物形成的壳体突出。 模具化合物从壳体延伸，以提供模制到外部连接器引线的绝缘支撑指。

公开(公告)号：US08525311B2

公开(公告)日：2013-09-03

申请号：US13170206

申请日：2011-06-28

申请人： Zhigang Bai ,  Jinzhong Yao ,  Xuesong Xu

发明人： Zhigang Bai ,  Jinzhong Yao ,  Xuesong Xu

IPC分类号： H01L33/62

CPC分类号： H01L23/49558 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame for a semiconductor device has a die pad with a first major surface for receiving an semiconductor die and a connection bar that encircles the die pad. First lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the first lead fingers lie in a first plane. Second lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the second lead fingers lie in a second plane that is parallel and spaced from the first plane. An isolation frame is disposed between the proximal ends of the first and second lead fingers. The isolation frame separates but supports the proximal ends of the first and second lead fingers.

摘要翻译： 用于半导体器件的引线框具有具有用于接收半导体管芯的第一主表面的管芯焊盘和环绕管芯焊盘的连接杆。 从连接杆朝向管芯焊盘突出的第一引线指端具有靠近管芯焊盘的近端，并且远端连接到连接杆。 第一引线指的近端位于第一平面中。 从连接杆朝向管芯焊盘突出的第二引线指端具有靠近管芯焊盘的近端，并且远端连接到连接杆。 第二引线指的近端位于与第一平面平行并间隔开的第二平面中。 隔离框架设置在第一和第二引线指的近端之间。 隔离框架分离但支撑第一和第二引线指的近端。

公开(公告)号：US20140191383A1

公开(公告)日：2014-07-10

申请号：US14205374

申请日：2014-03-12

申请人： Jinzhong YAO ,  Zhigang Bai ,  Xuesong Xu

发明人： Jinzhong YAO ,  Zhigang Bai ,  Xuesong Xu

IPC分类号： H01L23/495

CPC分类号： H01L23/49537 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49551 ,  H01L23/49568 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/13101 ,  H01L2224/1329 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92242 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/00012

摘要： A method of packaging a power semiconductor die includes providing a first lead frame of a dual gauge lead frame. The first lead frame includes a thick die pad. A tape is attached to a first side of the thick die pad and the power die is attached to a second side of the thick die pad. A second lead frame of the dual gauge lead frame is provided. The second lead frame has thin lead fingers. One end of the lead fingers is attached to an active surface of the power die such that the lead fingers are electrically connected to bonding pads of the power die. A molding compound is then dispensed onto a top surface of the dual gauge lead frame such that the molding compound covers the power die and the lead fingers.

摘要翻译： 封装功率半导体管芯的方法包括提供双量规引线框架的第一引线框架。 第一引线框架包括厚的芯片焊盘。 磁带附着到厚芯片焊盘的第一侧，并且功率管芯附接到厚芯片焊盘的第二侧。 提供了双量规引线框架的第二引线框架。 第二引线框架具有薄的引线指。 引线指的一端连接到功率管芯的有源表面，使得引线指电连接到功率管芯的焊盘。 然后将模塑料分配到双量规引线框架的顶表面上，使得模制化合物覆盖电源模具和引线指。

公开(公告)号：US09443746B2

公开(公告)日：2016-09-13

申请号：US14562770

申请日：2014-12-07

申请人： Zhigang Bai ,  Xingshou Pang ,  Jinzhong Yao

发明人： Zhigang Bai ,  Xingshou Pang ,  Jinzhong Yao

IPC分类号： H01L23/495 ,  H01L21/67 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L21/67126 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Tooling for molding a packaged semiconductor device includes a clamping plate, a cavity bar, and an attachment mechanism. The cavity bar has a mold half that has a mold cavity for molding the packaged semiconductor device. The mold half has teeth and a space between pairs of adjacent teeth. The teeth and the spaces support bending of leads of a lead frame of the packaged semiconductor device. The attachment mechanism affixes the cavity bar to the clamping plate and permits the cavity bar to slide relative to the clamping plate. This sliding of the cavity bar enables proper alignment with a mating cavity bar to reduce the likelihood of resin bleed.

摘要翻译： 用于模制封装的半导体器件的模具包括夹板，空腔棒和附接机构。 空腔棒具有模具半部，其具有用于模制封装半导体器件的模腔。 模具半部具有齿和相邻齿对之间的空间。 所述齿和所述间隙支撑所述封装半导体器件的引线框架的引线的弯曲。 连接机构将空腔棒固定到夹紧板上，并允许空腔棒相对于夹紧板滑动。 空腔棒的这种滑动使得能够与配合的腔棒正确对准以减少树脂流出的可能性。

公开(公告)号：US20160049318A1

公开(公告)日：2016-02-18

申请号：US14562770

申请日：2014-12-07

申请人： Zhigang Bai ,  Xingshou Pang ,  Jinzhong Yao

发明人： Zhigang Bai ,  Xingshou Pang ,  Jinzhong Yao

IPC分类号： H01L21/67 ,  H01L21/48 ,  H01L23/495 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L21/67126 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Tooling for molding a packaged semiconductor device includes a clamping plate, a cavity bar, and an attachment mechanism. The cavity bar has a mold half that has a mold cavity for molding the packaged semiconductor device. The mold half has teeth and a space between pairs of adjacent teeth. The teeth and the spaces support bending of leads of a lead frame of the packaged semiconductor device. The attachment mechanism affixes the cavity bar to the clamping plate and permits the cavity bar to slide relative to the clamping plate. This sliding of the cavity bar enables proper alignment with a mating cavity bar to reduce the likelihood of resin bleed.

摘要翻译： 用于模制封装的半导体器件的模具包括夹板，空腔棒和附接机构。 空腔棒具有模具半部，其具有用于模制封装半导体器件的模腔。 模具半部具有齿和相邻齿对之间的空间。 所述齿和所述间隙支撑所述封装半导体器件的引线框架的引线的弯曲。 连接机构将空腔棒固定到夹紧板上，并允许空腔棒相对于夹紧板滑动。 空腔棒的这种滑动使得能够与配合的腔棒正确对准以减少树脂流出的可能性。

公开(公告)号：US20150028468A1

公开(公告)日：2015-01-29

申请号：US14277061

申请日：2014-05-14

申请人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

发明人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

IPC分类号： H01L23/08 ,  H01L23/00 ,  H01L21/56

CPC分类号： H01L24/85 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90° angles. The mold columns prevent the corner pads from peeling.

摘要翻译： 无引线型半导体封装具有形成模体的模盖。 模具体的角部用模具柱加强，使得拐角具有圆形的突起并且不形成90°的角度。 模具柱防止角垫脱落。